C23F 1/08

Sub-Class

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Description

Class  C23F : NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES


Subclass 1/08: Etching metallic material by chemical means Apparatus, e.g. for photomechanical printing surfaces

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12264396 Substrate processing methodNov 22, 23Apr 01, 25Tokyo Electron Limited
12215417 Substrate processing method and substrate processing deviceMar 22, 22Feb 04, 25Tokyo Electron Limited
12194490 Automotive part identification marking systemOct 24, 23Jan 14, 25Catmark Manufacturing, LLC
11993854 Chamber wall polymer protection system and methodFeb 24, 22May 28, 24Taiwan Semiconductor Manufacturing Company Ltd.
11986853 Substrate processing apparatus, film formation unit, substrate processing method and film formation methodNov 06, 20May 21, 24SCREEN Holdings Co., Ltd.
11923170 Plasma processing apparatus and plasma processing methodNov 26, 19Mar 05, 24Tokyo Electron Limited
11905603 Substrate processing method and substrate processing apparatusDec 17, 21Feb 20, 24Tokyo Electron Limited
11869770 Selective deposition of etch-stop layer for enhanced patterningJul 29, 21Jan 09, 24Lam Research Corporation
11826775 Automotive part identification marking systemMar 06, 23Nov 28, 23CatMarks Manufacturing, LLC
11810797 Wetting processing apparatus and operation method thereofDec 20, 19Nov 07, 23PYXIS CF PTE. LTD.
11708637 Methods of supporting a graphene sheet disposed on a frame supportAug 06, 20Jul 25, 23The Regents of the University of California
11710630 Plasma block with integrated coolingApr 23, 20Jul 25, 23Applied Materials Inc.
11306399 Nanoparticle compositionsAug 12, 20Apr 19, 22January Therapeutics, Inc.
11142830 Method of surface micro-texturing with a subtractive agentFeb 08, 19Oct 12, 21The Boeing Company
11136673 Method of surface micro-texturing with a subtractive agentFeb 08, 19Oct 05, 21The Boeing Company
11099131 Systems and methods for copper etch rate monitoring and controlDec 06, 17Aug 24, 21University of North Texas
11094542 Selective deposition of etch-stop layer for enhanced patterningJan 15, 20Aug 17, 21Lam Research Corporation
10998187 Selective deposition with atomic layer etch resetDec 13, 19May 04, 21Lam Research Corporation
10995409 Method and apparatus for transfer of two-dimensional materialsMay 21, 19May 04, 21ETX Corporation
10957471 Calibration system and calibrating methodDec 26, 18Mar 23, 21Tyco Electronics (Shanghai) Co. Ltd.; TE Connectivity Corporation; Kunshan League Automechanism Co., Ltd.;

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0034,719 APPARATUS AND METHOD OF TREATING SUBSTRATEJun 26, 24Jan 30, 25SEMES CO., LTD.
2025/0019,835 ETCHING DEVICE AND ETCHING SYSTEMAug 26, 24Jan 16, 25Cloeren Technology GmbH; Steinbeis Transfer GmbH;
2025/0006,535 SUBSTRATE PROCESSING SYSTEMJun 26, 24Jan 02, 25Not available
2025/0006,536 SUBSTRATE TREATMENT SYSTEMJun 26, 24Jan 02, 25Not available
2024/0410,057 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSMar 25, 24Dec 12, 24SEMES CO., LTD.; Research & Business Foundation SUNGKYUNKWAN UNIVERSITY;
2024/0309,515 ETCHING DEVICEMay 29, 24Sep 19, 24Not available
2024/0271,286 CHAMBER WALL POLYMER PROTECTION SYSTEM AND METHODApr 26, 24Aug 15, 24Not available
2024/0253,079 SUBSTRATE PROCESSING METHODApr 12, 24Aug 01, 24Not available
2024/0124,984 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE GRIPPING DEVICEOct 10, 23Apr 18, 24Not available
2024/0035,168 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODJul 19, 23Feb 01, 24Not available
2023/0366,100 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODApr 11, 23Nov 16, 23Not available
2023/0203,669 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHODDec 22, 22Jun 29, 23Not available
2023/0160,071 PROCESS CONTROL SYSTEM AND OPERATING METHOD THEREFORFeb 18, 21May 25, 23POSCO
2022/0356,584 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSMay 03, 22Nov 10, 22Not available
2022/0117,092 CONTINUOUS ETCHING SYSTEMJul 29, 19Apr 14, 22Not available
2020/0016,623 SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND STORAGE MEDIUMJul 08, 19Jan 16, 20Not available
2019/0330,748 Gas distribution hub for plasma processing chamberJul 08, 19Oct 31, 19Not available
2019/0152,211 TRANSFERRING GRAPHITIC THIN FILMS WITH A LIQUID GALLIUM PROBENov 20, 18May 23, 19Not available
2019/0085,467 Plasma Reactor Having Radial Struts for Substrate SupportNov 19, 18Mar 21, 19Not available
2018/0265,989 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHODSep 11, 17Sep 20, 18TOSHIBA MEMORY CORPORATION

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Patents Issued To Date - By Filing Year

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