C23F 1/08

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Class  C23F : NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES


Subclass 1/08: Etching metallic material by chemical means Apparatus, e.g. for photomechanical printing surfaces

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
10566194 Selective deposition of etch-stop layer for enhanced patterningMay 07, 18Feb 18, 20Lam Research Corporation
10559461 Selective deposition with atomic layer etch resetApr 28, 17Feb 11, 20Lam Research Corporation
10533134 Methods and apparatuses for selective chemical etchingMar 03, 17Jan 14, 20The Boeing Company
10508343 Etching method for manufacturing semiconductor deviceDec 05, 13Dec 17, 19Fujitsu Limited
10507475 Device for structuring the surface of a pressed sheet or an endless stripNov 15, 16Dec 17, 19HUECK ENGRAVING GMBH & CO., KG
10471565 Polishing apparatus for a work with mechanical polishing function and chemical polishing functionJul 29, 16Nov 12, 19Fujikoshi Machinery Corp.
10443133 Corrosion control compositions and methods of mitigating corrosionSep 29, 15Oct 15, 19ECOLAB USA INC.
10403814 Method of cleaning and method of plasma processingMay 02, 16Sep 03, 19Tokyo Electron Limited
10290517 Etching apparatus and method, and flexible film etched by the etching methodFeb 17, 16May 14, 19HANWHA AEROSPACE CO., LTD.
10276354 Segmented focus ring assemblySep 23, 13Apr 30, 19Applied Materials Inc.
10256123 Component temperature control using a combination of proportional control valves and pulsed valvesOct 15, 12Apr 09, 19Applied Materials Inc.
10246782 Methods for etching a workpiece, an apparatus configured to etch a workpiece, and a non-transitory computer readable mediumJun 10, 15Apr 02, 19Infineon Technologies AG
10214444 Method for treating a surface and device implementedJun 06, 14Feb 26, 19Commissariat à l'énergie atomique et aux énergies alternatives
10204804 Apparatuses and methods for gas mixed liquid polishing, etching, and cleaningSep 09, 14Feb 12, 19Infineon Technologies AG
10192735 Substrate processing method and substrate processing apparatusAug 03, 17Jan 29, 19Kokusai Electric Corporation
10147618 Methods for controlling plasma constituent flux and deposition during semiconductor fabrication and apparatus for implementing the sameJan 11, 16Dec 04, 18Lam Research Corporation
10131994 Inductively coupled plasma source with top coil over a ceiling and an independent side coil and independent air flowNov 01, 12Nov 20, 18Applied Materials Inc.
10069443 Dechuck control method and plasma processing apparatusDec 19, 12Sep 04, 18Tokyo Electron Limited
10030309 Machine to chemically engrave a plate of stainless steelFeb 10, 12Jul 24, 18THE DILLER CORPORATION
9981362 Apparatus and methods for high pressure leaching of polycrystalline diamond cutter elementsDec 30, 13May 29, 18NATIONAL OILWELL VARCO, L.P.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2020/0016,623 SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND STORAGE MEDIUMJul 08, 19Jan 16, 20Not available
2019/0330,748 Gas distribution hub for plasma processing chamberJul 08, 19Oct 31, 19Not available
2019/0152,211 TRANSFERRING GRAPHITIC THIN FILMS WITH A LIQUID GALLIUM PROBENov 20, 18May 23, 19Not available
2019/0085,467 Plasma Reactor Having Radial Struts for Substrate SupportNov 19, 18Mar 21, 19Not available
2018/0265,989 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHODSep 11, 17Sep 20, 18TOSHIBA MEMORY CORPORATION
2018/0094,354 ETCHING DEVICES AND ETCHING METHODSMay 25, 16Apr 05, 18Wuhan China Star Optoelectronics Technology Co., Ltd.
2018/0068,755 METHOD FOR MANUFACTURING TRANSPARENT CONDUCTOR, TRANSPARENT CONDUCTOR AND DEVICE FOR MANUFACTURING THE SAME, AND DEVICE FOR MANUFACTURING TRANSPARENT CONDUCTOR PRECURSORNov 14, 17Mar 08, 18KABUSHIKI KAISHA TOSHIBA
2018/0051,378 WET ETCHING EQUIPMENT AND WET ETCHING METHODMay 25, 16Feb 22, 18BOE TECHNOLOGY GROUP CO., LTD.
2017/0363,953 DEVICE FOR CARRYING OUT A CAPILLARY NANOPRINTING METHOD, A METHOD FOR CARRYING OUT CAPILLARY NANOPRINTING USING THE DEVICE, PRODUCTS OBTAINED ACCORDING TO THE METHOD AND USE OF THE DEVICENov 03, 15Dec 21, 17UNIVERSITÄT OSNABRÜCK
2017/0350,017 Symmetrical Inductively Coupled Plasma Source with Symmetrical Flow ChamberAug 24, 17Dec 07, 17Not available
2017/0350,018 Inductively Coupled Plasma Source with Multiple Dielectric Windows and Window Supporting StructureAug 24, 17Dec 07, 17Not available
2017/0037,519 METHOD OF IMPROVING LIFETIME OF ETCHING LIQUID AND YIELD IN CU-INTERCONNECTION PROCESS AND CU-INTERCONNECTION ETCHING DEVICEOct 19, 16Feb 09, 17SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
2015/0367,286 ETCHING LIQUID STORAGE APPARATUS AND A WET ETCHING DEVICEOct 22, 14Dec 24, 15BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.,
2015/0014,154 PROCESSING UNIT HAVING CONDENSER, AND FULLY AUTOMATIC GRAVURE PLATEMAKING PROCESSING SYSTEM USING SAMEDec 05, 12Jan 15, 15THINK LABORATORY CO., LTD.
2014/0224,767 AUTOMATED ALGORITHM FOR TUNING OF FEEDFORWARD CONTROL PARAMETERS IN PLASMA PROCESSING SYSTEMFeb 13, 14Aug 14, 14APPLIED MATERIALS, INC.
2012/0103,523 PLASMA PROCESSING APPARATUSOct 27, 11May 03, 12TOKYO ELECTRON LIMITED
2012/0091,095 METHOD AND APPARATUS FOR REDUCING PARTICLE DEFECTS IN PLASMA ETCH CHAMBERSJun 30, 11Apr 19, 12APPLIED MATERIALS, INC.
2012/0031,563 PLASMA PROCESSING DEVICEMar 10, 10Feb 09, 12EMD Corporation, TOKYO ELECTRON LIMITED,
2011/0024,043 CONTINUOUS ANALYTE SENSORS AND METHODS OF MAKING SAMEJul 01, 10Feb 03, 11DEXCOM, INC.
2009/0242,125 Carrier Head MembraneMar 23, 09Oct 01, 09APPLIED MATERIALS, INC.

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Patents Issued To Date - By Filing Year

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