C23F 1/10

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Class  C23F : NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES


Subclass 1/10: Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence)

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12104108 Etching compositionsNov 24, 20Oct 01, 24Fujifilm Electronic Materials U.S.A., Inc.
12046476 Wet etching chemistry and method of forming semiconductor device using the sameMar 25, 22Jul 23, 24Taiwan Semiconductor Manufacturing Company Ltd.
11972955 Dry etching method, method for manufacturing semiconductor element, and cleaning methodApr 30, 21Apr 30, 24Resonac Corporation
11926903 Etching of alkali metal compoundsJun 09, 22Mar 12, 24Applied Materials Inc.
11840766 Etching metal using N-heterocyclic carbenesJun 01, 17Dec 12, 23Queen's University at Kingston; The University Court of the University of St. Andrews;
11753722 Method of preparing nanocomposite material plated with network-type metal layer through silica self-cracks and wearable electronics carbon fiber prepared therefromFeb 11, 21Sep 12, 23JEONJU UNIVERSITY OFFICE OF INDUSTRY UNIVERSITY COOPERATION;
11753561 Patterning pasteNov 20, 18Sep 12, 23PPG Industries Ohio, Inc.
11499071 Polishing compositions and methods of use thereofMar 27, 20Nov 15, 22Fujifilm Electronic Materials U.S.A., Inc.
11441071 Etchant composition and methods for manufacturing metal pattern and array substrate using the sameDec 04, 19Sep 13, 22Samsung Display Co., Ltd.
11254870 Etching solution, additive, and etching methodFeb 07, 20Feb 22, 22KABUSHIKI KAISHA TOSHIBA
11186771 Etching solution for selectively removing silicon nitride during manufacture of a semiconductor deviceMay 25, 18Nov 30, 21VERSUM MATERIALS US, LLC
11145544 Contact etchback in room temperature ionic liquidMay 09, 19Oct 12, 21Taiwan Semiconductor Manufacturing Co., Ltd.
11118268 Method for reducing surface roughnessNov 30, 18Sep 14, 21General Electric Company
11028321 Etching composition, method for etching insulating layer of semiconductor devices and method for preparing semiconductor devicesOct 07, 19Jun 08, 21SK INNOVATION CO., LTD.; SK-MATERIALS CO., LTD.;
11008482 Polishing composition and polishing method using the sameDec 20, 18May 18, 21Not available
10961453 Etching compositionsAug 15, 19Mar 30, 21Fujifilm Electronic Materials U.S.A., Inc.
10953467 Porous materials comprising two-dimensional nanomaterialsJul 31, 15Mar 23, 21Oxford University Innovation Limited
10921064 Heat storage apparatus, method for storing heat, and method for producing heat storage apparatusNov 13, 18Feb 16, 21Panasonic Intellectual Property Management Co., Ltd.
10703937 Polishing compositions and methods of use thereofOct 22, 18Jul 07, 20Fujifilm Electronic Materials U.S.A., Inc.
10636666 Etchant and method for manufacturing display device using the sameOct 10, 19Apr 28, 20SAMSUNG DISPLAY CO., LTD.; Dongwoo Fine-Chem Co., Ltd.;

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2024/0339,327 METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRYJun 20, 24Oct 10, 24Taiwan Semiconductor Manufacturing Company Ltd.
2023/0374,669 Wet Etching MethodOct 11, 21Nov 23, 23Not available

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Patents Issued To Date - By Filing Year

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