Description
Class C23F : NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES
Subclass 1/10: Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence)
Class C23F : NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES
Subclass 1/10: Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence)
Patent # | Title | Filing Date | Issue Date | Patent Owner |
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12104108 | Etching compositions | Nov 24, 20 | Oct 01, 24 | Fujifilm Electronic Materials U.S.A., Inc. |
12046476 | Wet etching chemistry and method of forming semiconductor device using the same | Mar 25, 22 | Jul 23, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
11972955 | Dry etching method, method for manufacturing semiconductor element, and cleaning method | Apr 30, 21 | Apr 30, 24 | Resonac Corporation |
11926903 | Etching of alkali metal compounds | Jun 09, 22 | Mar 12, 24 | Applied Materials Inc. |
11840766 | Etching metal using N-heterocyclic carbenes | Jun 01, 17 | Dec 12, 23 | Queen's University at Kingston; The University Court of the University of St. Andrews; |
11753722 | Method of preparing nanocomposite material plated with network-type metal layer through silica self-cracks and wearable electronics carbon fiber prepared therefrom | Feb 11, 21 | Sep 12, 23 | JEONJU UNIVERSITY OFFICE OF INDUSTRY UNIVERSITY COOPERATION; |
11753561 | Patterning paste | Nov 20, 18 | Sep 12, 23 | PPG Industries Ohio, Inc. |
11499071 | Polishing compositions and methods of use thereof | Mar 27, 20 | Nov 15, 22 | Fujifilm Electronic Materials U.S.A., Inc. |
11441071 | Etchant composition and methods for manufacturing metal pattern and array substrate using the same | Dec 04, 19 | Sep 13, 22 | Samsung Display Co., Ltd. |
11254870 | Etching solution, additive, and etching method | Feb 07, 20 | Feb 22, 22 | KABUSHIKI KAISHA TOSHIBA |
11186771 | Etching solution for selectively removing silicon nitride during manufacture of a semiconductor device | May 25, 18 | Nov 30, 21 | VERSUM MATERIALS US, LLC |
11145544 | Contact etchback in room temperature ionic liquid | May 09, 19 | Oct 12, 21 | Taiwan Semiconductor Manufacturing Co., Ltd. |
11118268 | Method for reducing surface roughness | Nov 30, 18 | Sep 14, 21 | General Electric Company |
11028321 | Etching composition, method for etching insulating layer of semiconductor devices and method for preparing semiconductor devices | Oct 07, 19 | Jun 08, 21 | SK INNOVATION CO., LTD.; SK-MATERIALS CO., LTD.; |
11008482 | Polishing composition and polishing method using the same | Dec 20, 18 | May 18, 21 | Not available |
10961453 | Etching compositions | Aug 15, 19 | Mar 30, 21 | Fujifilm Electronic Materials U.S.A., Inc. |
10953467 | Porous materials comprising two-dimensional nanomaterials | Jul 31, 15 | Mar 23, 21 | Oxford University Innovation Limited |
10921064 | Heat storage apparatus, method for storing heat, and method for producing heat storage apparatus | Nov 13, 18 | Feb 16, 21 | Panasonic Intellectual Property Management Co., Ltd. |
10703937 | Polishing compositions and methods of use thereof | Oct 22, 18 | Jul 07, 20 | Fujifilm Electronic Materials U.S.A., Inc. |
10636666 | Etchant and method for manufacturing display device using the same | Oct 10, 19 | Apr 28, 20 | SAMSUNG DISPLAY CO., LTD.; Dongwoo Fine-Chem Co., Ltd.; |
Publication # | Title | Filing Date | Pub Date | Patent Owner |
---|---|---|---|---|
2024/0339,327 | METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY | Jun 20, 24 | Oct 10, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
2023/0374,669 | Wet Etching Method | Oct 11, 21 | Nov 23, 23 | Not available |
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