Class C23F : NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES
Subclass 1/30: Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) for etching other metallic material
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12150386 | Ruthenium removal composition and method of producing magnetoresistive random access memory | Aug 16, 22 | Nov 19, 24 | FUJIFILM Corporation |
| 12104260 | Method for producing semiconductor element and chemical solution to be used in method for producing semiconductor element | Dec 14, 21 | Oct 01, 24 | Tokyo Ohka Kogyo Co. LTD |
| 12080801 | Method of controlling oxygen vacancy concentration in a semiconducting metal oxide | Jan 10, 22 | Sep 03, 24 | The Board of Trustees of the University of Illinois |
| 11932948 | Electroless nickel etch chemistry, method of etching and pretreatment | Oct 27, 21 | Mar 19, 24 | Hutchinson Technology Incorporated |
| 11918433 | Surface treatment for an implant surface | Aug 21, 19 | Mar 05, 24 | Biomet 3i LLC |
| 11859293 | Vanishing viewing windows apparatuses and methods | Apr 04, 21 | Jan 02, 24 | Electric Mirror, LLC |
| 11862474 | Substrate processing apparatus and substrate processing method | Nov 25, 20 | Jan 02, 24 | Tokyo Electron Limited |
| 11802342 | Methods for wet atomic layer etching of ruthenium | Feb 17, 22 | Oct 31, 23 | Tokyo Electron Limited |
| 11795550 | Etching composition, a method of etching a metal barrier layer and a metal layer using the same, and method of manufacturing semiconductor device using the same | May 06, 21 | Oct 24, 23 | Samsung Electronics Co. Ltd.; SOULBRAIN CO., LTD; |
| 11767595 | Chemical liquid, chemical liquid container, and method for treating substrate | Jan 23, 23 | Sep 26, 23 | FUJIFILM Corporation |
| 11732365 | Composition for removing ruthenium | Nov 13, 19 | Aug 22, 23 | Kanto Kagaku Kabushiki Kaisha |
| 11658034 | Patterning platinum by alloying and etching platinum alloy | Apr 20, 21 | May 23, 23 | Texas Instruments Incorporated |
| 11536520 | Modified surface for condensation | Feb 02, 19 | Dec 27, 22 | INDIAN INSTITUTE OF TECHNOLOGY MADRAS (IIT MADRAS) |
| 11456412 | Ruthenium removal composition and method of producing magnetoresistive random access memory | Jun 02, 20 | Sep 27, 22 | FUJIFILM Corporation |
| 11441229 | Method for selectively removing nickel platinum material | Jun 18, 19 | Sep 13, 22 | Entegris Inc. |
| 11384437 | Etchant composition and forming method of wiring using etchant composition | Apr 21, 20 | Jul 12, 22 | Samsung Display Co., Ltd. |
| 11384253 | Dual additive composition for polishing memory hard disks exhibiting edge roll off | Dec 30, 19 | Jul 12, 22 | CMC Materials, Inc. |
| 11346008 | Ruthenium etching composition and method | Nov 22, 19 | May 31, 22 | Entegris Inc. |
| 11225721 | Thin film etchant composition and method of forming metal pattern by using the same | Feb 25, 19 | Jan 18, 22 | Samsung Display Co., Ltd.; DONGWOO FINE-CHEM CO., LTD.; |
| 11180826 | Tin stripping method | Mar 06, 19 | Nov 23, 21 | UWIN NANOTECH, CO., LTD. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2024/0197,444 | SURFACE TREATMENT FOR AN IMPLANT SURFACE | Mar 01, 24 | Jun 20, 24 | Not available |
| 2024/0191,360 | CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Dec 04, 23 | Jun 13, 24 | Not available |
| 2024/0191,361 | CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Dec 04, 23 | Jun 13, 24 | Not available |
| 2024/0191,362 | CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Dec 04, 23 | Jun 13, 24 | Not available |
| 2023/0121,246 | METHODS FOR WET ETCHING OF NOBLE METALS | Nov 14, 22 | Apr 20, 23 | Not available |
| 2022/0372,631 | METHOD FOR SELECTIVELY REMOVING NICKEL PLATINUM MATERIAL | Aug 05, 22 | Nov 24, 22 | Not available |
| 2022/0127,729 | Electroless Nickel Etch Chemistry, Method Of Etching And Pretreatment | Oct 27, 21 | Apr 28, 22 | Not available |
| 2021/0020,955 | PLATINUM-BASED ALLOY CATALYST AND PREPARATION METHOD THEREFOR, MEMBRANE ELECTRODE, AND FUEL CELL | Mar 22, 19 | Jan 21, 21 | QINGDAO CHUANGQI XINNENG CATALYSIS TECHNOLOGY CO., LTD |
| 2020/0248,318 | ETCHANT COMPOSITION AND FORMING METHOD OF WIRING USING ETCHANT COMPOSITION | Apr 21, 20 | Aug 06, 20 | Samsung Display Co., Ltd. |
| 2020/0190,672 | ETCHING SOLUTION, METHOD FOR PROCESSING OBJECT TO BE PROCESSED, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT | Dec 09, 19 | Jun 18, 20 | Not available |
| 2020/0010,959 | METHOD FOR SELECTIVELY REMOVING NICKEL PLATINUM MATERIAL | Jun 18, 19 | Jan 09, 20 | Not available |
| 2019/0274,791 | TITANIUM NANO-SCALE ETCHING ON AN IMPLANT SURFACE | Dec 17, 18 | Sep 12, 19 | Not available |
| 2019/0255,317 | PRODUCTION METHOD FOR A RING ELECTRODE | Feb 18, 19 | Aug 22, 19 | Heraeus Deutschland GmbH & Co. KG |
| 2019/0085,209 | COMPOSITION FOR TUNGSTEN CMP | Sep 14, 18 | Mar 21, 19 | Not available |
| 2018/0371,625 | ETCHANT COMPOSITION AND FORMING METHOD OF WIRING USING ETCHANT COMPOSITION | May 04, 18 | Dec 27, 18 | Not available |
| 2018/0163,311 | ADDITIVE METAL DEPOSITION PROCESS | Feb 09, 18 | Jun 14, 18 | Not available |
| 2017/0314,140 | Method for the Wet Chemical Polishing of Molded Zinc Parts | Aug 27, 15 | Nov 02, 17 | POLIGRAT GMBH |
| 2017/0222,138 | RUTHENIUM REMOVAL COMPOSITION AND METHOD OF PRODUCING MAGNETORESISTIVE RANDOM ACCESS MEMORY | Apr 17, 17 | Aug 03, 17 | FUJIFILM CORPORATION |
| 2016/0053,386 | ETCHING SOLUTION AND ETCHING SOLUTION KIT, ETCHING METHOD USING SAME, AND PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE PRODUCT | Oct 30, 15 | Feb 25, 16 | FUJIFILM CORPORATION |
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