C23F 1/34

Sub-Class

Watch

Stats

Description

Class  C23F : NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES


Subclass 1/34: Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Alkaline compositions (C23F 1/42 takes precedence) for etching copper or alloys thereof

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12146070 Eco-friendly hydrophobic or ultrahydrophobic coating methodJan 29, 21Nov 19, 24POSTECH Research and Business Development Foundation
11938536 Nanotextured metal powders for 3D printing of metalsMar 28, 22Mar 26, 24The Board of Trustees of the Leland Stanford Junior University
11866831 Methods for wet atomic layer etching of copperApr 20, 22Jan 09, 24Tokyo Electron Limited
11859119 Chemical liquid and method for treating object to be treatedSep 17, 21Jan 02, 24FUJIFILM Corporation
11674229 Etching chelating agent, manufacturing method thereof, and etching solution compositionMay 07, 20Jun 13, 23Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
11512406 Method of enhancing copper electroplatingSep 21, 20Nov 29, 22Rohm and Haas Electronic Materials LLC
11346008 Ruthenium etching composition and methodNov 22, 19May 31, 22Entegris Inc.
11225722 Alkaline cupric chloride etchant for printed circuit boardAug 04, 17Jan 18, 22Not available
10961629 Superhydrophobic surface arrangement, article compromising same and method of manufacture thereofDec 27, 18Mar 30, 21CITY UNIVERSITY OF HONG KONG
10297465 Selective metal/metal oxide etch processJan 13, 15May 21, 19Sachem Inc.
10246335 Methods of modifying surfaces of diamond particles, and related diamond particles and earth-boring toolsMay 27, 16Apr 02, 19Baker Hughes, a GE company, LLC
10211232 Manufacture method of array substrate and array substrate manufactured by the methodApr 08, 16Feb 19, 19Shenzhen China Star Optoelectronics Technology Co. Ltd.
10155921 Removal composition for selectively removing hard mask and methods thereofOct 09, 14Dec 18, 18E I DUPONT NE NEMOURS AND COMPANY; EKC Technology, Inc.;
10087368 High-efficiency high-quality and safe alkaline cupric chloride etchant for printed circuit boardMay 26, 15Oct 02, 18Not available
10005991 Removal composition for selectively removing hard mask and methods thereofOct 09, 14Jun 26, 18EKC Technology, Inc.; E I du Pont de Nemours and Company;
9932678 Microetching solution for copper, replenishment solution therefor and method for production of wiring boardAug 01, 16Apr 03, 18Mec Company Ltd.
9797048 Stripping solution for zinc/nickel alloy plating from metal substrateMar 31, 15Oct 24, 17THE BOEING COMPANY
9790600 Etching agent for copper or copper alloyNov 02, 15Oct 17, 17ENTEGRIS, INC.
9580818 Etching liquid for film of multilayer structure containing copper layer and molybdenum layerMay 27, 11Feb 28, 17MITSUBISHI GAS CHEMICAL COMPANY, INC.
9528188 Method of improving lifetime of etching liquid and yield in Cu-interconnection process and Cu-interconnection etching deviceFeb 09, 15Dec 27, 16SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

more results

Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2024/0376,606 ETCHING COMPOSITIONSJul 22, 24Nov 14, 24Texas Instruments Incorporated
2023/0243,041 ETCHING COMPOSITIONSJan 28, 22Aug 03, 23Not available
2023/0220,558 AN AQUEOUS BASIC ETCHING COMPOSITION FOR THE TREATMENT OF SURFACES OF METAL SUBSTRATESJun 10, 21Jul 13, 23Not available
2022/0117,092 CONTINUOUS ETCHING SYSTEMJul 29, 19Apr 14, 22Not available
2017/0037,519 METHOD OF IMPROVING LIFETIME OF ETCHING LIQUID AND YIELD IN CU-INTERCONNECTION PROCESS AND CU-INTERCONNECTION ETCHING DEVICEOct 19, 16Feb 09, 17SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

more results

Top Owners in This Subclass

Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More

Patents Issued To Date - By Filing Year

Average Time to Issuance