Description
Class C25D : PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
Subclass 2/00: Joining workpieces by electrolysis
C25D 2/00
Sub-Class
Stats
- 1 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- 1 Total Patent Owners
- 2 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 5645707 | Bonding method for chip-type electronic parts | Aug 18, 95 | Jul 08, 97 | SHARP KABUSHIKI KAISHA |
Recent Publications
Not Available
Top Owners in This Subclass
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Patents Issued To Date - By Filing Year
Average Time to Issuance
- 22 Months (last 2 years Issuances)
- 22 Months (last 5 years Issuances)