Class G11C : STATIC STORES
Subclass 5/04: Details of stores covered by group G11C 11/00 Disposition of storage elements, e.g. in the form of a matrix array Supports for storage elements; Mounting or fixing of storage elements on such supports
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 11961821 | Semiconductor device assemblies including multiple stacks of different semiconductor dies | Aug 05, 22 | Apr 16, 24 | Micron Technology Inc. |
| 11963299 | Load reduced memory module | Apr 21, 22 | Apr 16, 24 | RAMBUS INC. |
| 11942182 | Memory and system supporting parallel and serial access modes | Dec 28, 22 | Mar 26, 24 | RAMBUS INC. |
| 11935578 | Signal timing alignment based on a common data strobe in memory devices configured for stacked arrangements | Jun 17, 22 | Mar 19, 24 | III Holdings 2, LLC |
| 11929139 | Methods for optimizing semiconductor device placement on a substrate for improved performance, and associated systems and methods | Apr 11, 22 | Mar 12, 24 | Micron Technology Inc. |
| 11915774 | Memory devices and methods for managing error regions | Oct 11, 21 | Feb 27, 24 | Micron Technology Inc. |
| 11916602 | Remote memory architectures enabled by monolithic in-package optical i/o | Feb 14, 21 | Feb 27, 24 | Ayar Labs, Inc. |
| 11903210 | Semiconductor memory device | Jul 15, 21 | Feb 13, 24 | Kioxia Corporation |
| 11867366 | Light emitting device modules | Aug 02, 21 | Jan 09, 24 | Samsung Electronics Co. Ltd. |
| 11868285 | Memory controller configured to transmit interrupt signal if volatile memory has no data corresponding to address requested from source | Nov 18, 22 | Jan 09, 24 | Kioxia Corporation |
| 11862235 | Stacked semiconductor device | Oct 22, 21 | Jan 02, 24 | RAMBUS INC. |
| 11862267 | Multi mode memory module with data handlers | Feb 26, 19 | Jan 02, 24 | Netlist, Inc. |
| 11862236 | Memory component for deployment in a dynamic stripe width memory system | Jan 31, 22 | Jan 02, 24 | RAMBUS INC. |
| 11855048 | Semiconductor packages with pass-through clock traces and associated systems and methods | Oct 31, 22 | Dec 26, 23 | Not available |
| 11853600 | Memory systems, modules, and methods for improved capacity | Apr 20, 21 | Dec 26, 23 | RAMBUS INC. |
| 11854658 | Memory buffer with data scrambling and error correction | Mar 16, 22 | Dec 26, 23 | RAMBUS INC. |
| 11854635 | Reclaimable semiconductor device package and associated systems and methods | Oct 15, 19 | Dec 26, 23 | Micron Technology Inc. |
| 11848281 | Die stack with reduced warpage | Aug 02, 21 | Dec 19, 23 | Intel Corp. |
| 11837278 | DRAM device and ODT resistor value adjustment method and computer program for the same | Feb 23, 22 | Dec 05, 23 | Not available |
| 11837273 | Semiconductor device having interconnection in package and method for manufacturing the same | Jul 25, 22 | Dec 05, 23 | Samsung Electronics Co. Ltd. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2024/0126,475 | NON-VOLATILE MEMORY MODULE ARCHITECTURE TO SUPPORT MEMORY ERROR CORRECTION | Oct 19, 23 | Apr 18, 24 | Not available |
| 2024/0111,423 | MEMORY SYSTEM WITH THREADED TRANSACTION SUPPORT | Oct 23, 23 | Apr 04, 24 | Not available |
| 2024/0111,457 | Memory Systems, Modules, and Methods for Improved Capacity | Oct 29, 23 | Apr 04, 24 | Not available |
| 2024/0104,036 | DYNAMIC RANDOM ACCESS MEMORY (DRAM) COMPONENT FOR HIGH-PERFORMANCE, HIGH-CAPACITY REGISTERED MEMORY MODULES | Oct 06, 23 | Mar 28, 24 | Not available |
| 2024/0096,387 | MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DATA INTERFACES | Sep 01, 23 | Mar 21, 24 | RAMBUS INC. |
| 2024/0096,852 | STACKED MEMORY ROUTING TECHNIQUES | Nov 28, 23 | Mar 21, 24 | Not available |
| 2024/0079,054 | INPUT/OUTPUT REFERENCE VOLTAGE TRAINING METHOD IN THREE-DIMENSIONAL MEMORY DEVICES | Sep 02, 22 | Mar 07, 24 | Yangtze Memory Technologies Co., Ltd. |
| 2024/0079,079 | BUFFER CIRCUIT WITH ADAPTIVE REPAIR CAPABILITY | Aug 11, 23 | Mar 07, 24 | Not available |
| 2024/0079,402 | MEMORY DEVICE WITH A MULTIPLEXED COMMAND/ADDRESS BUS | Nov 13, 23 | Mar 07, 24 | Not available |
| 2024/0071,424 | MEMORY COMPONENT FOR A SYSTEM-ON-CHIP DEVICE | Jul 28, 23 | Feb 29, 24 | Not available |
| 2024/0045,813 | TRAINING AND OPERATIONS WITH A DOUBLE BUFFERED MEMORY TOPOLOGY | Aug 21, 23 | Feb 08, 24 | Not available |
| 2024/0029,784 | DRAM DEVICE AND ODT RESISTOR VALUE ADJUSTMENT METHOD AND COMPUTER PROGRAM FOR THE SAME | Sep 28, 23 | Jan 25, 24 | Not available |
| 2024/0020,043 | MEMORY SYSTEM INCLUDING A MEMORY CONTROLLER | Sep 27, 23 | Jan 18, 24 | Not available |
| 2023/0410,890 | Memory System Topologies Including A Memory Die Stack | Jun 23, 23 | Dec 21, 23 | Not available |
| 2023/0377,611 | CENTRALIZED PLACEMENT OF COMMAND AND ADDRESS SIGNALS IN DEVICES AND SYSTEMS | Aug 04, 23 | Nov 23, 23 | Not available |
| 2023/0377,668 | DRAM RETENTION TEST METHOD FOR DYNAMIC ERROR CORRECTION | Apr 24, 23 | Nov 23, 23 | Not available |
| 2023/0370,170 | Pooled Memory System Enabled by Monolithic In-Package Optical I/O | Jul 18, 23 | Nov 16, 23 | Not available |
| 2023/0343,371 | SEMICONDUCTOR DEVICE | Jul 05, 23 | Oct 26, 23 | Kioxia Corporation |
| 2023/0215,474 | MEMORY DEVICE WITH MODULAR DESIGN AND MEMORY SYSTEM COMPRISING THE SAME | Jan 18, 22 | Jul 06, 23 | Not available |
| 2023/0197,116 | STORAGE DEVICE AND STORAGE DEVICE ASSEMBLY USING THE SAME | Oct 03, 22 | Jun 22, 23 | Not available |
| Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More |
|---|
