Class G11C : STATIC STORES
Subclass 5/04: Details of stores covered by group G11C 11/00 Disposition of storage elements, e.g. in the form of a matrix array Supports for storage elements; Mounting or fixing of storage elements on such supports
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12265489 | Communicating data with stacked memory dies | Sep 18, 23 | Apr 01, 25 | Not available |
| 12266400 | Apparatus and method for ZQ calibration of data transmission driving circuit in memory chip package of multi-memory die structure | Nov 08, 22 | Apr 01, 25 | Electronics and Telecommunications Research Institute |
| 12249399 | On-die termination of address and command signals | May 31, 24 | Mar 11, 25 | RAMBUS INC. |
| 12249593 | Electronic device | Sep 14, 23 | Mar 11, 25 | Nagase & Co., Ltd. |
| 12242344 | DRAM assist error correction mechanism for DDR SDRAM interface | Mar 28, 23 | Mar 04, 25 | Samsung Electronics Co., Ltd. |
| 12243575 | Memory system having combined high density, low bandwidth and low density, high bandwidth memories | Nov 21, 23 | Mar 04, 25 | Apple Inc. |
| 12222878 | Memory module with data buffering | Aug 16, 21 | Feb 11, 25 | Netlist, Inc. |
| 12213548 | Hybrid memory module | Jun 28, 22 | Feb 04, 25 | RAMBUS INC. |
| 12211577 | Layout for dual in-line memory to support 128-byte cache line processor | Oct 24, 22 | Jan 28, 25 | TACHYUM LTD. |
| 12205669 | Memory buffer with data scrambling and error correction | Nov 17, 23 | Jan 21, 25 | RAMBUS INC. |
| 12197731 | Memory system with threaded transaction support | Oct 23, 23 | Jan 14, 25 | RAMBUS INC. |
| 12200860 | Load reduced memory module | Mar 13, 24 | Jan 14, 25 | RAMBUS INC. |
| 12189954 | Computer system, memory device formed on a wafer on wafer stack in the computer system and memory control method applied to the computer system based on wafer-on-wafer architecture | Oct 05, 22 | Jan 07, 25 | WHALECHIP CO., LTD. |
| 12190974 | DRAM retention test method for dynamic error correction | Apr 24, 23 | Jan 07, 25 | RAMBUS INC. |
| 12185538 | Semiconductor memory device with a three-dimensional stacked memory cell structure | Aug 10, 21 | Dec 31, 24 | Kioxia Corporation |
| 12170127 | Buffer configurations for communications between memory dies and a host device | Dec 22, 22 | Dec 17, 24 | Micron Technology Inc. |
| 12170265 | Semiconductor package | Nov 02, 20 | Dec 17, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12164447 | Off-module data buffer | Mar 01, 23 | Dec 10, 24 | RAMBUS INC. |
| 12153827 | Non-volatile memory module architecture to support memory error correction | Oct 19, 23 | Nov 26, 24 | Not available |
| 12154649 | Semiconductor device | Jul 05, 23 | Nov 26, 24 | Kioxia Corporation |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0110,897 | TRAINING AND OPERATIONS WITH A DOUBLE BUFFERED MEMORY TOPOLOGY | Oct 09, 24 | Apr 03, 25 | Not available |
| 2025/0094,080 | NON-VOLATILE MEMORY MODULE ARCHITECTURE TO SUPPORT MEMORY ERROR CORRECTION | Nov 25, 24 | Mar 20, 25 | Not available |
| 2025/0098,166 | SEMICONDUCTOR MEMORY DEVICE WITH A THREE-DIMENSIONAL STACKED MEMORY CELL STRUCTURE | Nov 29, 24 | Mar 20, 25 | Kioxia Corporation |
| 2025/0087,261 | HIGH CAPACITY MEMORY SYSTEM USING STANDARD CONTROLLER COMPONENT | Oct 02, 24 | Mar 13, 25 | Not available |
| 2025/0078,884 | BUFFER CONFIGURATIONS FOR COMMUNICATIONS BETWEEN MEMORY DIES AND A HOST DEVICE | Nov 14, 24 | Mar 06, 25 | Not available |
| 2025/0068,516 | ACCESSING ERROR STATISTICS FROM A CIRCUIT HAVING INTEGRATED ERROR CORRECTION | Nov 11, 24 | Feb 27, 25 | Not available |
| 2025/0070,094 | SEMICONDUCTOR PACKAGE | Nov 14, 24 | Feb 27, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 2025/0063,659 | EDGE MOUNT MEMORY CONNECTOR WITH STAGGERED FOOTPRINT PINS | Nov 04, 24 | Feb 20, 25 | Not available |
| 2025/0054,521 | SEMICONDUCTOR DEVICE | Oct 28, 24 | Feb 13, 25 | Kioxia Corporation |
| 2025/0028,660 | MEMORY MODULE WITH TIMING-CONTROLLED DATA BUFFERING | Aug 20, 23 | Jan 23, 25 | Not available |
| 2025/0021,235 | HIGH-THROUGHPUT LOW-LATENCY HYBRID MEMORY MODULE | Aug 05, 24 | Jan 16, 25 | Not available |
| 2024/0420,793 | BUFFER CIRCUIT WITH ADAPTIVE REPAIR CAPABILITY | Jul 08, 24 | Dec 19, 24 | Not available |
| 2024/0402,920 | MEMORY MODULE CAPABLE OF REDUCING POWER CONSUMPTION AND SEMICONDUCTOR SYSTEM INCLUDING THE SAME | Aug 14, 24 | Dec 05, 24 | SK HYNIX INC. |
| 2024/0404,580 | MULTI-DIE MEMORY DEVICE | May 07, 24 | Dec 05, 24 | Not available |
| 2024/0394,177 | MEMORY MODULE WITH DISTRIBUTED DATA BUFFERS | May 27, 24 | Nov 28, 24 | Not available |
| 2024/0379,133 | SYSTEM AND METHOD FOR PROVIDING COMPRESSION ATTACHED MEMORY MODULE COMPRESSION CONNECTORS | Jul 17, 24 | Nov 14, 24 | Not available |
| 2024/0371,411 | CONFIGURABLE MEMORY CARD CONNECTOR | May 03, 24 | Nov 07, 24 | Amphenol Commercial Products (ChengDu) Co. LTD |
| 2024/0365,556 | COMPUTE-IN-MEMORY DEVICE AND METHOD | Jul 11, 24 | Oct 31, 24 | Not available |
| 2024/0331,757 | INTRA-PACKAGE MEMORY DIE COMMUNICATION STRUCTURES | Jun 11, 24 | Oct 03, 24 | Not available |
| 2024/0331,780 | ADJUSTMENT OF PROGRAM VERIFY TARGETS CORRESPONDING TO A LAST PROGRAMMING DISTRIBUTION AND A PROGRAMMING DISTRIBUTION ADJACENT TO AN INITIAL PROGRAMMING DISTRIBUTION | Jun 10, 24 | Oct 03, 24 | Not available |
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