Description
Class G11C : STATIC STORES
Subclass 5/06: Details of stores covered by group G11C 11/00 Arrangements for interconnecting storage elements electrically, e.g. by wiring
Class G11C : STATIC STORES
Subclass 5/06: Details of stores covered by group G11C 11/00 Arrangements for interconnecting storage elements electrically, e.g. by wiring
Patent # | Title | Filing Date | Issue Date | Patent Owner |
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11972189 | Interconnections for modular die designs | Mar 22, 22 | Apr 30, 24 | QUALCOMM Incorporated |
11972825 | Integrated circuit chip and die test without cell array | Oct 29, 19 | Apr 30, 24 | SK HYNIX INC. |
11972830 | Methods for accessing resistive change elements operable as antifuses | Jul 14, 22 | Apr 30, 24 | Nantero, Inc. |
11967381 | Semiconductor memory device | Oct 06, 21 | Apr 23, 24 | SK HYNIX INC. |
11968820 | Semiconductor device and electronic device including the semiconductor device | Feb 11, 20 | Apr 23, 24 | Semiconductor Energy Laboratory Co. Ltd. |
11968840 | Tri-gate transistor and methods for forming the same | Nov 10, 21 | Apr 23, 24 | Taiwan Semiconductor Manufacturing Company Limited |
11961552 | Memory device including partial pages in memory blocks | Mar 24, 22 | Apr 16, 24 | SK HYNIX INC. |
11961556 | Socket design for a memory device | Jan 04, 22 | Apr 16, 24 | Micron Technology Inc. |
11961559 | Storage device and operating method of storage device | Jun 02, 22 | Apr 16, 24 | Samsung Electronics Co., Ltd. |
11963299 | Load reduced memory module | Apr 21, 22 | Apr 16, 24 | RAMBUS INC. |
11948624 | Memory bit cell array including contention-free column reset circuit, and related methods | Dec 23, 21 | Apr 02, 24 | Microsoft Technology Licensing, LLC. |
11948636 | Memory device | Mar 14, 22 | Apr 02, 24 | Kioxia Corporation |
11950402 | Memory device having 2-transistor vertical memory cell and shield structures | Apr 21, 23 | Apr 02, 24 | Micron Technology Inc. |
11940857 | Multi-element memory device with power control for individual elements | Dec 19, 22 | Mar 26, 24 | RAMBUS INC. |
11940929 | Methods and apparatus to reduce read-modify-write cycles for non-aligned writes | May 22, 20 | Mar 26, 24 | Texas Instruments Incorporated |
11940930 | Methods and apparatus to facilitate atomic operations in victim cache | Jul 28, 22 | Mar 26, 24 | Texas Instruments Incorporated |
11942145 | Static random access memory layout | May 06, 22 | Mar 26, 24 | Taiwan Semiconductor Manufacturing Co., Ltd. |
11942154 | Non-volatile memory device and method of operating nonvolatile memory device | May 26, 22 | Mar 26, 24 | Samsung Electronics Co. Ltd. |
11942155 | Semiconductor memory devices with dielectric fin structures | Sep 30, 21 | Mar 26, 24 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
11942181 | Semiconductor device including internal transmission path and stacked semiconductor device using the same | Dec 17, 21 | Mar 26, 24 | SK Hynix Inc. |
Publication # | Title | Filing Date | Pub Date | Patent Owner |
---|---|---|---|---|
2024/0143,516 | METHODS AND APPARATUS FOR ALLOCATION IN A VICTIM CACHE SYSTEM | Jan 08, 24 | May 02, 24 | Not available |
2024/0145,002 | MEMORY DEVICE HAVING PHYSICAL UNCLONABLE FUNCTION AND MEMORY SYSTEM INCLUDING THE MEMORY DEVICE | Jan 08, 24 | May 02, 24 | Samsung Electronics Co., Ltd. |
2024/0147,713 | MICROELECTRONIC DEVICES COMPRISING STACK STRUCTURES HAVING PILLARS AND ELLIPTICAL CONDUCTIVE CONTACTS | Dec 22, 23 | May 02, 24 | Not available |
2024/0147,732 | SEMICONDUCTOR STRUCTURE HAVING MEMORY DEVICE AND METHOD OF FORMING THE SAME | Jan 04, 24 | May 02, 24 | Not available |
2024/0135,983 | Write Driver Boost Circuit for Memory Cells | Jan 02, 24 | Apr 25, 24 | Not available |
2024/0138,138 | SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE | Oct 24, 22 | Apr 25, 24 | Not available |
2024/0138,139 | SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Jul 17, 23 | Apr 25, 24 | Not available |
2024/0138,146 | Integrated Assemblies Having Conductive Posts Extending Through Stacks of Alternating Materials | Oct 22, 23 | Apr 25, 24 | Not available |
2024/0127,864 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY SEPARATED SOURCE LINES AND METHOD OF MAKING THE SAME | Jul 11, 23 | Apr 18, 24 | Not available |
2024/0127,869 | STORAGE DEVICES HAVING MULTI DROP STRUCTURE | May 15, 23 | Apr 18, 24 | Not available |
2024/0127,884 | Memory Device Having Variable Impedance Memory Cells and Time-To-Transition Sensing of Data Stored Therein | Dec 27, 23 | Apr 18, 24 | R&D 3 LLC |
2024/0127,886 | RECOGNITION SYSTEM AND SRAM CELL THEREOF | Dec 28, 23 | Apr 18, 24 | Not available |
2024/0130,127 | SEMICONDUCTOR MEMORY DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Aug 16, 23 | Apr 18, 24 | Not available |
2024/0130,128 | SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS | Oct 18, 22 | Apr 18, 24 | Not available |
2024/0119,978 | SEMICONDUCTOR MEMORY DEVICE | Jun 05, 23 | Apr 11, 24 | Not available |
2024/0119,998 | 3D Integrated Circuit | Oct 06, 23 | Apr 11, 24 | Not available |
2024/0112,746 | SEMICONDUCTOR STORAGE DEVICE | Dec 13, 23 | Apr 04, 24 | Not available |
2024/0114,680 | Integrated Assemblies and Semiconductor Memory Devices | Dec 08, 23 | Apr 04, 24 | Micron Technology Inc. |
2024/0104,026 | HYBRID VICTIM CACHE AND WRITE MISS BUFFER WITH FENCE OPERATION | Dec 11, 23 | Mar 28, 24 | Not available |
2024/0105,242 | On-Die Termination of Address and Command Signals | Jun 26, 23 | Mar 28, 24 | Not available |
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