Class G11C : STATIC STORES
Subclass 7/18: Arrangements for writing information into, or reading information out from, a digital store (G11C 5/00 takes precedence; auxiliary circuits for stores using semiconductor devices G11C 11/4063, G11C 11/413, G11C 11/4193) Bit line organisation; Bit line lay-out
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 11990181 | Low-power static random access memory | Jun 21, 22 | May 21, 24 | UNTETHER AI CORPORATION |
| 11990204 | Memory device using semiconductor element | Jul 05, 22 | May 21, 24 | Unisantis Electronics Singapore Pte. Ltd. |
| 11991886 | Three-dimensional stackable ferroelectric random access memory devices and methods of forming | Jan 09, 23 | May 21, 24 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 11980028 | Semiconductor device and data storage system including the same | Jun 09, 21 | May 07, 24 | Samsung Electronics Co., Ltd. |
| 11961579 | Bit line noise suppression and related apparatuses, methods, and computing systems | May 18, 22 | Apr 16, 24 | Micron Technology Inc. |
| 11942169 | Semiconductor memory structure | Jul 20, 22 | Mar 26, 24 | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 11942177 | Using embedded switches for reducing capacitive loading on a memory system | Jan 10, 22 | Mar 26, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 11942422 | Methods of forming microelectronic devices | Oct 27, 22 | Mar 26, 24 | Not available |
| 11943925 | Semiconductor memory device having charge storage pattern | Jun 01, 21 | Mar 26, 24 | Samsung Electronics Co. Ltd. |
| 11935619 | Page buffer circuits of three-dimensional memory device | Mar 04, 22 | Mar 19, 24 | Yangtze Memory Technologies Co., Ltd. |
| 11929106 | Semiconductor memory device | Mar 10, 22 | Mar 12, 24 | Kioxia Corporation |
| 11929323 | Methods of forming a microelectronic device | Feb 27, 23 | Mar 12, 24 | Micron Technology Inc. |
| 11900990 | Memory device having variable impedance memory cells and time-to-transition sensing of data stored therein | Oct 12, 22 | Feb 13, 24 | R&D3 LLC |
| 11895840 | Memory device | Aug 25, 22 | Feb 06, 24 | Samsung Electronics Co., Ltd. |
| 11895849 | Memory device and method of forming the same | Aug 08, 22 | Feb 06, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 11889684 | Three-dimensional memory device with separated source-side lines and method of making the same | Nov 18, 20 | Jan 30, 24 | SanDisk Technologies LLC |
| 11869578 | Memory bank and memory | Sep 13, 21 | Jan 09, 24 | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 11862287 | Managing page buffer circuits in memory devices | Feb 17, 22 | Jan 02, 24 | Macronix International Co., Ltd. |
| 11864391 | Magnetoresistive random access memory | Dec 26, 22 | Jan 02, 24 | United Microelectronics Corp. |
| 11856768 | Memory device and method for forming the same | May 23, 22 | Dec 26, 23 | Taiwan Semiconductor Manufacturing Co., Ltd. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2024/0172,431 | THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE LINES AND METHOD OF MAKING THE SAME | Jan 29, 24 | May 23, 24 | Not available |
| 2024/0161,789 | PAGE BUFFER CIRCUITS IN THREE-DIMENSIONAL MEMORY DEVICES | Jan 23, 24 | May 16, 24 | Not available |
| 2024/0147,738 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | Jan 04, 24 | May 02, 24 | Not available |
| 2024/0127,884 | Memory Device Having Variable Impedance Memory Cells and Time-To-Transition Sensing of Data Stored Therein | Dec 27, 23 | Apr 18, 24 | R&D 3 LLC |
| 2024/0119,978 | SEMICONDUCTOR MEMORY DEVICE | Jun 05, 23 | Apr 11, 24 | Not available |
| 2024/0105,241 | MEMORY DEVICE INCLUDING SEPARATE NEGATIVE BIT LINE | Feb 16, 23 | Mar 28, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 2024/0087,646 | MEMORY CELL | Feb 10, 23 | Mar 14, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 2024/0090,234 | MAGNETORESISTIVE RANDOM ACCESS MEMORY | Nov 17, 23 | Mar 14, 24 | United Microelectronics Corp. |
| 2024/0071,555 | MEMORY AND MEMORY SYSTEM THEREOF | Aug 02, 23 | Feb 29, 24 | Not available |
| 2024/0057,336 | 3D SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING SAME | Oct 23, 23 | Feb 15, 24 | Not available |
| 2024/0036,754 | ADJUSTABLE ACCESS ENERGY AND ACCESS LATENCY MEMORY SYSTEM AND DEVICES | Aug 04, 23 | Feb 01, 24 | Not available |
| 2024/0013,850 | TECHNIQUES FOR ERROR MITIGATION TO IMPROVE RELIABILITY FOR ANALOG COMPUTE-IN-MEMORY | Sep 25, 23 | Jan 11, 24 | Not available |
| 2023/0380,140 | MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTORSTRUCTURE | Aug 03, 22 | Nov 23, 23 | Not available |
| 2023/0290,392 | 3D MEMORY STRUCTURE AND CIRCUIT | Mar 14, 22 | Sep 14, 23 | Macronix International Co. Ltd. |
| 2023/0253,033 | Memory Device Having Variable Impedance Memory Cells and Time-to-Transition Sensing of Data Stored Therein | Apr 08, 23 | Aug 10, 23 | R&D 3 LLC |
| 2023/0240,068 | Three-Dimensional Semiconductor Memory Device | Mar 31, 23 | Jul 27, 23 | Not available |
| 2023/0147,923 | Three-Dimensional Memory Device and Method | Jan 03, 23 | May 11, 23 | Not available |
| 2023/0081,678 | ELECTRONIC DEVICES COMPRISING AIR GAPS ADJACENT TO BITLINES | Nov 08, 22 | Mar 16, 23 | Not available |
| 2022/0406,349 | SEMICONDUCTOR STORAGE DEVICE | Jun 16, 22 | Dec 22, 22 | WINBOND ELECTRONICS CORP. |
| 2022/0406,814 | MEMORY DEVICE | Aug 25, 22 | Dec 22, 22 | Not available |
| Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More |
|---|
