Class H01C : RESISTORS
Subclass 1/036: Details Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath (H01C 1/032 takes precedence) on wound resistive element
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 11248941 | Method for manufacturing a sensor of a thermal, flow measuring device for measuring mass flow of a medium in a measuring tube | Jun 26, 17 | Feb 15, 22 | Endress+Hauser Flowtec AG |
| Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More |
|---|
