Description
Class H01G : CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
Subclass 2/00: Details applicable to more than one of groups H01G 4/00-H01G 9/00
Class H01G : CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
Subclass 2/00: Details applicable to more than one of groups H01G 4/00-H01G 9/00
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12173742 | Integrally formed thread lock retention feature | Oct 27, 23 | Dec 24, 24 | Whirlpool Corporation |
| 12080460 | Insulation jacket for top coil of an isolated transformer | Aug 17, 22 | Sep 03, 24 | Analog Devices Global Unlimited Company |
| 12046539 | Semiconductor module comprising a resin case and an external connection terminal | Dec 06, 21 | Jul 23, 24 | Fuji Electric Co. Ltd. |
| 11972900 | Multilayer ceramic capacitor | Feb 10, 22 | Apr 30, 24 | Murata Manufacturing Co Ltd. |
| 11928412 | Method | Oct 20, 21 | Mar 12, 24 | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 11657964 | Multilayer capacitor and board having the same mounted thereon | Dec 13, 21 | May 23, 23 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 11545802 | Fork structure for positive retention and centering a wire for electrical connection | Jan 16, 20 | Jan 03, 23 | VITESCO TECHNOLOGIES USA, INC. |
| 11450469 | Insulation jacket for top coil of an isolated transformer | Aug 28, 19 | Sep 20, 22 | Not available |
| 11340287 | Capacitor with visual indicator | Jul 25, 18 | May 24, 22 | Intel Corp. |
| 11262324 | Gas sensor | Mar 28, 18 | Mar 01, 22 | PANASONIC CORPORATION |
| 11246568 | 3D ultrasound imaging system | Apr 25, 19 | Feb 15, 22 | SHENZHEN DANSHA TECHNOLOGY CO., LTD. |
| 11043533 | Switch and method for fabricating the same, and resistive memory cell and electronic device, including the same | Jun 27, 19 | Jun 22, 21 | SK hynix, Inc. |
| 10998132 | Capacitor and electronics module assembly with low-inductance connection features | Oct 16, 19 | May 04, 21 | Infineon Technologies AG; TDK ELECTRONICS AG; |
| 10819114 | Submodule that is capable of connecting capacitor and power pack easily | Feb 27, 19 | Oct 27, 20 | LSIS Co., Ltd. |
| 10692655 | Filter component for filtering an interference signal | Jun 12, 17 | Jun 23, 20 | TDK Electronics AG |
| 10636552 | Multi-function electronic device having memristor and memcapacitor and method for manufacturing the same | Mar 20, 18 | Apr 28, 20 | Gwangju Institute of Science and Technology |
| 10381407 | Switch and method for fabricating the same, and resistive memory cell and electronic device, including the same | Feb 14, 17 | Aug 13, 19 | SK hynix, Inc. |
| 10354802 | Ceramic electronic component | Nov 19, 18 | Jul 16, 19 | Samsung Electro-Mechanics Co., Ltd. |
| 10256042 | Contact part for electrically connecting end-face contact layers on the end faces of a plastic film capacitor winding of an encased electric single-phase or three-phase capacitor, and encased electric single-phase and three-phase capacitors comprising same | May 15, 12 | Apr 09, 19 | FRAKO KONDENSATOREN- UND ANLAGENBAU GMBH |
| 10237991 | Electronic component | Nov 02, 17 | Mar 19, 19 | Molex, LLC |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0118,490 | MULTILAYER ELECTRONIC COMPONENT | Jul 15, 24 | Apr 10, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2024/0194,403 | MULTILAYER ELECTRONIC COMPONENT | Nov 01, 23 | Jun 13, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2024/0055,781 | POWER ELECTRONIC DEVICES WITH BUSBARS AND METHOD FOR THEIR FABRICATION | Aug 09, 23 | Feb 15, 24 | Not available |
| 2024/0006,127 | ELECTRONIC MODULATING DEVICE INCLUDING DIFFERENT CELL GAPS | Sep 19, 23 | Jan 04, 24 | Not available |
| 2023/0268,119 | MULTILAYER CERAMIC CAPACITOR | Feb 21, 23 | Aug 24, 23 | Not available |
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