H01G 2/02

Sub-Class

Watch 1Status Updates

Stats

Description

Class  H01G : CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE


Subclass 2/02: Details applicable to more than one of groups H01G 4/00-H01G 9/00 Mountings

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12266479 Multilayer electronic component including non-conductive resin layer on body thereofFeb 13, 24Apr 01, 25SAMSUNG-ELECTRO-MECHANICS CO. LTD.
12237117 Capacitor, capacitor manufacturing method, and capacitor mounting methodMar 25, 21Feb 25, 25Nippon Chemi-Con Corporation
12205772 Multilayer capacitor and substrate including the same mounted thereonDec 01, 23Jan 21, 25SAMSUNG-ELECTRO-MECHANICS CO. LTD.
12166425 Electric device for a converter, converter and arrangement with an electric machine and a converterDec 10, 20Dec 10, 24VALEO SIEMENS EAUTOMOTIVE GERMANY GMBH
12154720 Ceramic electronic component, mounting substrate arrangement, and methods of manufacturing ceramic electronic componentJun 01, 22Nov 26, 24Taiyo Yuden Co. Ltd.
12136523 Multilayer capacitor and board having the same mounted thereonOct 26, 22Nov 05, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
12119177 Capacitor with seat plateFeb 03, 22Oct 15, 24Panasonic Intellectual Property Management Co., Ltd.
12112895 Multilayer ceramic capacitorMar 07, 23Oct 08, 24Murata Manufacturing Co Ltd.
12100556 Capacitor and method for manufacturing sameFeb 25, 21Sep 24, 24Nichicon Corporation
12080484 Multilayer ceramic capacitorOct 12, 21Sep 03, 24Murata Manufacturing Co Ltd.
12062601 Power semiconductor module having a DC voltage connecting deviceSep 21, 22Aug 13, 24Semikron Elektronik GmbH & Co. KG
12062898 Method for manufacturing a busbar and such a busbarApr 29, 19Aug 13, 24ROGERS BV
12057383 Bonded structures with integrated passive componentDec 29, 22Aug 06, 24ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
12014880 Multilayered capacitor and board having the same mounted thereonNov 03, 22Jun 18, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
12009405 Deep trench capacitor including a compact contact region and methods of forming the sameAug 28, 21Jun 11, 24Taiwan Semiconductor Manufacturing Company Limited
11935703 Multilayer electronic component including non-conductive resin layer on body thereofJan 09, 23Mar 19, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
11923149 Multilayer ceramic capacitor and method of manufacturing the sameJan 31, 23Mar 05, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
11915878 Multilayer ceramic capacitorApr 16, 21Feb 27, 24Murata Manufacturing Co Ltd.
11908635 Capacitor and method for producing same, and capacitor-mounting methodMay 01, 20Feb 20, 24Nippon Chemi-Con Corporation
11901126 Multilayer ceramic capacitorApr 21, 21Feb 13, 24Murata Manufacturing Co Ltd.

more results

Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0104,912 CAPACITOR, CAPACITOR BANK, AND OUTER CASE FOR CAPACITORDec 11, 24Mar 27, 25Not available
2024/0395,461 CAPACITOR AND METHOD FOR MANUFACTURING SAMEAug 02, 24Nov 28, 24Not available
2024/0356,144 Method for Producing an Electric Energy Storage Device, Energy Storage Device, and DeviceSep 05, 22Oct 24, 24Not available
2024/0304,700 DEEP TRENCH CAPACITOR INCLUDING A COMPACT CONTACT REGION AND METHODS OF FORMING THE SAMEMay 13, 24Sep 12, 24Not available
2024/0258,029 MULTILAYER CERAMIC CAPACITOR AND BUMP-PRODUCING PASTEApr 08, 24Aug 01, 24Not available
2024/0170,209 CAPACITOR MODULEDec 26, 23May 23, 24Not available
2024/0096,558 MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTHNov 20, 23Mar 21, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2024/0096,559 MULTI-LAYERED CERAMIC CAPACITORNov 27, 23Mar 21, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2024/0038,449 MULTILAYER ELECTRONIC COMPONENT INCLUDING A SILICON ORGANIC COMPOUND LAYER ARRANGED BETWEEN LAYERS OF AN EXTERNAL ELECTRODEOct 10, 23Feb 01, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2023/0420,185 CAPACITOR MODULESep 06, 23Dec 28, 23Not available
2023/0245,830 MULTILAYER ELECTRONIC COMPONENT HAVING MOISTURE-PROOF LAYER ON BODY THEREOFApr 06, 23Aug 03, 23SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2023/0223,192 ELECTRONIC COMPONENTNov 01, 22Jul 13, 23SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2023/0051,327 DIELECTRIC FILM FOR FILM CAPACITOR, FILM CAPACITOR AND CONNECTED CAPACITOR INCLUDING DIELECTRIC FILM, INVERTER, AND ELECTRIC VEHICLEDec 07, 20Feb 16, 23KYOCERA CORPORATION; SHINSHU UNIVERSITY;
2023/0036,133 MULTI-LAYERED CERAMIC CAPACITORSep 27, 22Feb 02, 23SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2023/0016,672 CAPACITOR ASSEMBLYMay 16, 22Jan 19, 23Not available
2021/0074,481 MULTILAYER ELECTRONIC COMPONENTMar 30, 20Mar 11, 21Not available
2014/0284,091 LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOFMar 10, 14Sep 25, 14MURATA MANUFACTURING CO., LTD.

more results

Top Owners in This Subclass

Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More

Patents Issued To Date - By Filing Year

Average Time to Issuance