Class H01G : CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
Subclass 4/00: Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G 9/00)
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12230443 | Multilayer electronic component | Jun 15, 23 | Feb 18, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 12100554 | Ceramic composition, ceramic sintered body, capacitor and method for manufacturing the same | Jun 23, 22 | Sep 24, 24 | Walsin Technology Corporation |
| 12073998 | Multilayer electronic component | Apr 29, 22 | Aug 27, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 11703319 | Method to determine properties of a coating on a transparent film, method for manufacturing a capacitor film and device to determine properties of a coating on a transparent film | Nov 22, 18 | Jul 18, 23 | TDK ELECTRONICS AG |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Nov 16, 20 | Apr 18, 23 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 11302618 | Microelectronic assemblies having substrate-integrated perovskite layers | Apr 09, 18 | Apr 12, 22 | Intel Corp. |
| 11168167 | Hydrophilic compositions | Nov 30, 16 | Nov 09, 21 | SUPERDIELECTRICS LTD |
| 11092142 | Plasma electric propulsion device | Nov 20, 17 | Aug 17, 21 | CAPACITOR SCIENCES INCORPORATED |
| 11056842 | Jumper cable with capacitive power enhancement and/or overvoltage protection | Oct 11, 18 | Jul 06, 21 | CommScope Technologies LLC |
| 11024704 | Manufacturing method of capacitor structure | Feb 26, 20 | Jun 01, 21 | United Semiconductor (Xiamen) Co., Ltd. |
| 11004606 | Dielectric materials using 2D nanosheet network interlayer | Jul 17, 18 | May 11, 21 | University of Connecticut |
| 10892092 | Conductive powder for inner electrode and capacitor | Apr 02, 19 | Jan 12, 21 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 10847317 | Electronic component | Mar 08, 19 | Nov 24, 20 | Murata Manufacturing Co Ltd. |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Sep 12, 18 | Nov 17, 20 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 10833041 | Fan-out semiconductor package | Dec 01, 17 | Nov 10, 20 | Samsung Electronics Co. Ltd. |
| 10825611 | Multilayer electronic component and mounting structure thereof | Jul 16, 20 | Nov 03, 20 | 501 TDK Corporation |
| 10756707 | Area-efficient dynamic capacitor circuit for noise reduction in VLSI circuits | May 22, 19 | Aug 25, 20 | International Business Machine Corporation |
| 10707016 | Method of manufacturing laminated electronic component | Sep 21, 17 | Jul 07, 20 | Murata Manufacturing Co., Ltd. |
| 10537025 | Capacitor and method of manufacturing the same | Jan 30, 18 | Jan 14, 20 | Samsung Electro-Mechanics Co., Ltd. |
| 10529486 | Conductive paste for external electrode and method for manufacturing electronic component including the conductive paste for external electrode | Apr 11, 18 | Jan 07, 20 | Murata Manufacturing Co., Ltd. |
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