H01L 21/00

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Description

Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/00: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
10566292 Semiconductor device and method for manufacturing semiconductor deviceAug 28, 18Feb 18, 20OLYMPUS CORPORATION
10566233 Semiconductor device having interconnection structureAug 07, 19Feb 18, 20SAMSUNG ELECTRONICS CO., LTD.
10566397 Ink jet printing first and second materials to form a pixel defining layer having grooveJan 10, 18Feb 18, 20BOE Technology Group Co. Ltd.
10566528 Heating element designs for phase-change material (PCM) radio frequency (RF) switchesDec 14, 18Feb 18, 20Newport Fab, LLC
10566515 Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric deviceJun 13, 19Feb 18, 20Not available
10563095 Adhesive composition sheet, method of producing same, and semiconductor deviceMar 09, 16Feb 18, 20TORAY INDUSTRIES, INC.
10566398 Organic light emitting diode (OLED) display panel having protrusions on substrate with plurality of planarization layers and method for manufacturing sameNov 01, 17Feb 18, 20Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
10566307 Manufacturing method of semiconductor deviceNov 02, 16Feb 18, 20SHINKAWA LTD.
10566319 Apparatus for direct transfer of semiconductor device dieJul 26, 19Feb 18, 20ROHINNI, LLC
10566222 Semiconductor device sorting system and semiconductor deviceAug 27, 18Feb 18, 20Mitsubishi Electric Corporation
10566238 Wafer dicing using femtosecond-based laser and plasma etchNov 16, 18Feb 18, 20Applied Materials Inc.
10566188 Method to improve film stabilityJul 16, 18Feb 18, 20Applied Materials Inc.
10559507 Direct wafer mapping and selective elastomer depositionFeb 06, 18Feb 11, 20Facebook Technologies, LLC
10559503 Methods, apparatus and system for a passthrough-based architectureOct 09, 17Feb 11, 20Globalfoundries Inc.
10559561 Isolation enhancement with on-die slot-line on power/ground grid structureJan 19, 18Feb 11, 20Xilinx Inc.
10559524 2-step die attach for reduced pedestal size of laminate component packagesSep 17, 18Feb 11, 20Agilent Technologies Texas Instruments Incorporated
10561012 Methods related to implementing surface mount devices with ground pathsOct 10, 17Feb 11, 20SKYWORKS SOLUTIONS, INC.
10559578 Deposition of cobalt films with high deposition rateJun 01, 18Feb 11, 20Applied Materials Inc.
10559669 Indium gallium arsenide metal oxide semiconductor field effect transistor having a low contact resistance to metal electrodeMar 14, 19Feb 11, 20IBM Corporation
10559588 Three-dimensional flat inverse NAND memory device and method of making the sameMay 04, 18Feb 11, 20SanDisk Technologies LLC

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2018/0266,016 Nitrogen Doped and Vacancy Dominated Silicon Ingot and Thermally Treated Wafer Formed Therefrom Having Radially Uniformly Distributed Oxygen Precipitation Density and SizeMay 18, 18Sep 20, 18Not available
2018/0224,916 HYBRID COMPUTING MODULEDec 18, 17Aug 09, 18Not available
2018/0012,052 SYSTEMS AND METHODS FOR SORTING IMAGE ACQUISITION SETTINGS FOR PATTERN STITCHING AND DECODING USING MULTIPLE CAPTURED IMAGESMar 20, 17Jan 11, 18COGNEX CORPORATION
2011/0079,273 PHOTOVOLTAIC DEVICESJan 09, 09Apr 07, 11MASSACHUSETTS INSTITUTE OF TECHNOLOGY
2007/0020,793 Three-dimensional shaped solid dosimeter and method of useAug 21, 06Jan 25, 07Not available
2006/0292,722 FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAMEAug 30, 06Dec 28, 06Not available
2004/0101,979 Ferroelectric resistor non-volatile memoryNov 26, 02May 27, 04SHARP LABORATORIES OF AMERICA, INC.
2004/0053,431 Method of forming a flexible thin film transistor display device with a metal foil substrateJun 11, 03Mar 18, 04INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
2003/0203,511 Method of manufacture of ferroelectric memoryDec 02, 02Oct 30, 03OKI ELECTRIC INDUSTRY CO., LTD.

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