Class H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass 21/00: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 10566292 | Semiconductor device and method for manufacturing semiconductor device | Aug 28, 18 | Feb 18, 20 | OLYMPUS CORPORATION |
| 10566233 | Semiconductor device having interconnection structure | Aug 07, 19 | Feb 18, 20 | SAMSUNG ELECTRONICS CO., LTD. |
| 10566397 | Ink jet printing first and second materials to form a pixel defining layer having groove | Jan 10, 18 | Feb 18, 20 | BOE Technology Group Co. Ltd. |
| 10566528 | Heating element designs for phase-change material (PCM) radio frequency (RF) switches | Dec 14, 18 | Feb 18, 20 | Newport Fab, LLC |
| 10566515 | Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device | Jun 13, 19 | Feb 18, 20 | Not available |
| 10563095 | Adhesive composition sheet, method of producing same, and semiconductor device | Mar 09, 16 | Feb 18, 20 | TORAY INDUSTRIES, INC. |
| 10566398 | Organic light emitting diode (OLED) display panel having protrusions on substrate with plurality of planarization layers and method for manufacturing same | Nov 01, 17 | Feb 18, 20 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 10566307 | Manufacturing method of semiconductor device | Nov 02, 16 | Feb 18, 20 | SHINKAWA LTD. |
| 10566319 | Apparatus for direct transfer of semiconductor device die | Jul 26, 19 | Feb 18, 20 | ROHINNI, LLC |
| 10566222 | Semiconductor device sorting system and semiconductor device | Aug 27, 18 | Feb 18, 20 | Mitsubishi Electric Corporation |
| 10566238 | Wafer dicing using femtosecond-based laser and plasma etch | Nov 16, 18 | Feb 18, 20 | Applied Materials Inc. |
| 10566188 | Method to improve film stability | Jul 16, 18 | Feb 18, 20 | Applied Materials Inc. |
| 10559507 | Direct wafer mapping and selective elastomer deposition | Feb 06, 18 | Feb 11, 20 | Facebook Technologies, LLC |
| 10559503 | Methods, apparatus and system for a passthrough-based architecture | Oct 09, 17 | Feb 11, 20 | Globalfoundries Inc. |
| 10559561 | Isolation enhancement with on-die slot-line on power/ground grid structure | Jan 19, 18 | Feb 11, 20 | Xilinx Inc. |
| 10559524 | 2-step die attach for reduced pedestal size of laminate component packages | Sep 17, 18 | Feb 11, 20 | Agilent Technologies Texas Instruments Incorporated |
| 10561012 | Methods related to implementing surface mount devices with ground paths | Oct 10, 17 | Feb 11, 20 | SKYWORKS SOLUTIONS, INC. |
| 10559578 | Deposition of cobalt films with high deposition rate | Jun 01, 18 | Feb 11, 20 | Applied Materials Inc. |
| 10559669 | Indium gallium arsenide metal oxide semiconductor field effect transistor having a low contact resistance to metal electrode | Mar 14, 19 | Feb 11, 20 | IBM Corporation |
| 10559588 | Three-dimensional flat inverse NAND memory device and method of making the same | May 04, 18 | Feb 11, 20 | SanDisk Technologies LLC |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2018/0266,016 | Nitrogen Doped and Vacancy Dominated Silicon Ingot and Thermally Treated Wafer Formed Therefrom Having Radially Uniformly Distributed Oxygen Precipitation Density and Size | May 18, 18 | Sep 20, 18 | Not available |
| 2018/0224,916 | HYBRID COMPUTING MODULE | Dec 18, 17 | Aug 09, 18 | Not available |
| 2018/0012,052 | SYSTEMS AND METHODS FOR SORTING IMAGE ACQUISITION SETTINGS FOR PATTERN STITCHING AND DECODING USING MULTIPLE CAPTURED IMAGES | Mar 20, 17 | Jan 11, 18 | COGNEX CORPORATION |
| 2011/0079,273 | PHOTOVOLTAIC DEVICES | Jan 09, 09 | Apr 07, 11 | MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
| 2007/0020,793 | Three-dimensional shaped solid dosimeter and method of use | Aug 21, 06 | Jan 25, 07 | Not available |
| 2006/0292,722 | FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME | Aug 30, 06 | Dec 28, 06 | Not available |
| 2004/0101,979 | Ferroelectric resistor non-volatile memory | Nov 26, 02 | May 27, 04 | SHARP LABORATORIES OF AMERICA, INC. |
| 2004/0053,431 | Method of forming a flexible thin film transistor display device with a metal foil substrate | Jun 11, 03 | Mar 18, 04 | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
| 2003/0203,511 | Method of manufacture of ferroelectric memory | Dec 02, 02 | Oct 30, 03 | OKI ELECTRIC INDUSTRY CO., LTD. |
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