H01L 21/033

Sub-Class

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Description

Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/033: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L 21/18 or H01L 21/34 comprising inorganic layers

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
10566207 Semiconductor manufacturing methods for patterning line patterns to have reduced length variationSep 19, 18Feb 18, 20Samsung Electronics Co. Ltd.
10566209 Etching method and workpiece processing methodAug 31, 18Feb 18, 20Tokyo Electron Limited
10566333 Methods of fabricating semiconductor deviceMay 20, 16Feb 18, 20Samsung Electronics Co. Ltd.
10562762 Method of forming semiconductor deviceNov 01, 17Feb 18, 20United Microelectronics Corp.; Fujian Jinhua Integrated Circuit Co., Ltd.;
10566473 Compound semiconductor solar cell and method of manufacturing the sameApr 24, 18Feb 18, 20LG Electronics Inc.
10566195 Multiple patterning with variable space mandrel cutsAug 29, 17Feb 18, 20Globalfoundries Inc.
10566194 Selective deposition of etch-stop layer for enhanced patterningMay 07, 18Feb 18, 20Lam Research Corporation
10564549 Photoresist stripping apparatus, and methods of stripping photoresist and forming thin film pattern using the sameAug 31, 17Feb 18, 20Samsung Display Co., Ltd.
10559492 Patterning methods for semiconductor devices and structures resulting therefromJun 08, 18Feb 11, 20Taiwan Semiconductor Manufacturing Company Ltd.
10559465 Pre-treatment approach to improve continuity of ultra-thin amorphous silicon film on silicon oxideMay 24, 18Feb 11, 20APPLIED MATERIALS, INC.
10559542 Chip security fingerprintMar 14, 18Feb 11, 20International Business Machine Corporation
10559467 Selective gas etching for self-aligned pattern transferJun 06, 18Feb 11, 20International Business Machine Corporation
10553438 Semiconductor device and method for fabricating the sameJan 19, 17Feb 04, 20Samsung Electronics Co., Ltd.
10553532 Structure and method to self align via to top and bottom of tight pitch metal interconnect layersDec 24, 14Feb 04, 20Intel Corp.
10553429 Method of forming pattern of semiconductor deviceNov 18, 16Feb 04, 20Samsung Electronics Co., Ltd.
10553534 Method for fabricating contact electrical fuseApr 10, 18Feb 04, 20United Microelectronics Corp.
10553428 Reflection mode photomask and fabrication method thereforeAug 22, 17Feb 04, 20TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
10553430 Technologies for inverting lithographic patterns and semiconductor devices including high aspect ratio structuresSep 25, 15Feb 04, 20Intel Corp.
10553443 Pattern formation methodSep 13, 17Feb 04, 20TOSHIBA MEMORY CORPORATION
10553433 Method for preparing a semiconductor structureNov 14, 18Feb 04, 20NANYA TECHNOLOGY CORPORATION

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2020/0058,504 FILM FORMING METHOD AND FILM FORMING APPARATUSAug 14, 19Feb 20, 20Not available
2020/0058,664 Cell boundary structure for embedded memoryAug 15, 18Feb 20, 20Not available
2020/0058,501 TONE REVERSAL DURING EUV PATTERN TRANSFER USING SURFACE ACTIVE LAYER ASSISTED SELECTIVE DEPOSITIONAug 17, 18Feb 20, 20Not available
2020/0058,503 METHODS FOR FORMING AND ETCHING STRUCTURES FOR PATTERNING PROCESSESJul 24, 19Feb 20, 20Not available
2020/0058,505 Mask Formation by Selectively Removing Portions of a Layer That Have Not Been ImplantedOct 28, 19Feb 20, 20Not available
2020/0058,502 METHOD AND STRUCTURE OF MIDDLE LAYER REMOVALAug 17, 18Feb 20, 20TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
2020/0051,821 METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH MASK STRUCTUREOct 08, 19Feb 13, 20Taiwan Semiconductor Manufacturing Co., Ltd.
2020/0051,829 DEPOSITION OF ORGANIC FILMSOct 21, 19Feb 13, 20Not available
2020/0043,735 Method of Semiconductor Device FabricationOct 14, 19Feb 06, 20Not available
2020/0043,733 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAMESep 20, 18Feb 06, 20Not available
2020/0043,732 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAMEOct 18, 18Feb 06, 20Taiwan Semiconductor Manufacturing Co., Ltd.
2020/0043,734 SYSTEMS AND METHODS FOR MATERIAL BREAKTHROUGHOct 11, 19Feb 06, 20Applied Materials Inc.
2020/0035,492 METHOD FOR PATTERNING A SEMICONDUCTOR STRUCTUREOct 04, 19Jan 30, 20Not available
2020/0035,491 METHOD AND APPARATUS FOR FORMING HARD MASK FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICESJul 12, 19Jan 30, 20Not available
2020/0027,735 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAMEMay 31, 19Jan 23, 20Semiconductor Manufacturing International (Beijing) Corporation
2020/0027,736 METHODS TO PROTECT NITRIDE LAYERS DURING FORMATION OF SILICON GERMANIUM NANO-WIRES IN MICROELECTRONIC WORKPIECESJul 15, 19Jan 23, 20Not available
2020/0020,533 Semiconductor Devices and Methods of Making the SameJun 11, 19Jan 16, 20Alpha Power Solutions Limited
2020/0020,532 Multiple Layer Scheme Patterning ProcessJul 12, 18Jan 16, 20Not available
2020/0020,531 INTERCONNECTS WITH NON-MANDREL CUTS FORMED BY EARLY BLOCK PATTERNINGJul 12, 18Jan 16, 20Not available
2020/0020,534 METHOD TO TRANSFER PATTERNS TO A LAYERMar 01, 19Jan 16, 20Not available

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