H01L 21/04

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Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/04: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
10566281 Integrated assemblies having structures along a first pitch coupled with structures along a second pitch different from the first pitch, and methods of forming integrated assembliesJun 17, 19Feb 18, 20Micron Technology Inc.
10566416 Semiconductor device with improved field layerAug 15, 18Feb 18, 20Microsemi Corporation
10566473 Compound semiconductor solar cell and method of manufacturing the sameApr 24, 18Feb 18, 20LG Electronics Inc.
10564097 Chemical sensors based on plasmon resonance in grapheneAug 01, 16Feb 18, 20International Business Machine Corporation
10559652 Semiconductor deviceNov 22, 16Feb 11, 20Mitsubishi Electric Corporation
10559653 Silicon carbide semiconductor device and method for manufacturing silicon carbide semiconductor deviceMay 23, 17Feb 11, 20Mitsubishi Electric Corporation
10559664 Method of manufacturing semiconductor device by removing a bulk layer to expose an epitaxial-growth layer and by removing portions of a supporting-substrate to expose portions of the epitaxial-growth layerFeb 28, 17Feb 11, 20Fuji Electric Co. Ltd.
10559514 Semiconductor deviceAug 27, 18Feb 11, 20Fuji Electric Co. Ltd.
10553437 Semiconductor device and method for manufacturing such a semiconductor deviceJun 04, 18Feb 04, 20ABB Schweiz AG
10553436 Method of manufacturing semiconductor device using photoresist as ion implantation maskJan 30, 18Feb 04, 20FUJI ELECTRIC CO., LTD.
10546944 Semiconductor device and method of fabricating the sameNov 27, 17Jan 28, 20Nuvoton Technology Corporation
10546749 Diamond semiconductor system and methodJan 13, 17Jan 28, 20AKHAN SEMICONDUCTOR INC
10546950 Semiconductor deviceAug 27, 18Jan 28, 20Fuji Electric Co. Ltd.
10546954 Semiconductor deviceMay 21, 19Jan 28, 20ROHM CO., LTD.
10541307 Diode with an oxygen concentration regionJun 26, 15Jan 21, 20KABUSHIKI KAISHA TOSHIBA
10541325 Semiconductor device with termination structure including field zones and method of manufacturingOct 26, 18Jan 21, 20Infineon Technologies AG
10541301 SiC-based superjunction semiconductor deviceDec 26, 17Jan 21, 20Infineon Technologies AG
10538862 Crystal laminate structureFeb 17, 16Jan 21, 20Tamura Corporation; National University Corporation Tokyo University of Agriculture and Technology;
10529799 Semiconductor deviceJun 02, 17Jan 07, 20Mitsubishi Electric Corporation
10529820 Method for gallium nitride on diamond semiconductor wafer productionJul 15, 15Jan 07, 20BAE Systems Information and Electronic Systems Integration Inc.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2020/0020,535 Etching MethodOct 26, 17Jan 16, 20Not available
2020/0006,074 METHODS FOR FABRICATING AND ETCHING POROUS SILICON CARBIDE STRUCTURESJun 06, 19Jan 02, 20Not available
2019/0362,972 Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbide Semiconductor DeviceMay 24, 19Nov 28, 19Not available
2019/0362,973 Electrical Contact Connection on Silicon Carbide SubstrateMay 24, 19Nov 28, 19Not available
2019/0348,502 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEJul 25, 19Nov 14, 19Fuji Electric Co. Ltd.
2019/0326,117 SEMICONDUCTOR WAFER THINNING SYSTEMS AND RELATED METHODSJun 21, 19Oct 24, 19Semiconductor Components Industries, LLC
2019/0319,102 SEMICONDUCTOR DEVICEJun 29, 17Oct 17, 19Not available
2019/0311,903 Wide Band Gap Semiconductor Device and Method for Forming a Wide Band Gap Semiconductor DeviceApr 03, 19Oct 10, 19Not available
2019/0295,981 Silicon Carbide Devices and Methods for Manufacturing the SameMar 21, 19Sep 26, 19Not available
2019/0296,146 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, INVERTER CIRCUIT, DRIVING DEVICE, VEHICLE, AND ELEVATORAug 27, 18Sep 26, 19KABUSHIKI KAISHA TOSHIBA
2019/0287,803 METHOD FOR IMPLEMENTING AND REGULATING PATTERNING OF A GRAPHENE FILM BY ULTRAVIOLET PHOTO-OXIDATIONOct 18, 16Sep 19, 19Not available
2019/0259,615 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEJan 29, 19Aug 22, 19Not available
2019/0252,190 LASER DOPING APPARATUS AND LASER DOPING METHODApr 24, 19Aug 15, 19Kyushu University; Gigaphoton Inc.;
2019/0237,578 SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAMEApr 09, 19Aug 01, 19Not available
2019/0237,546 METHOD OF FABRICATING ELECTRICALLY ISOLATED DIAMOND NANOWIRES AND ITS APPLICATION FOR NANOWIRE MOSFETNov 21, 18Aug 01, 19HRL Laboratories, LLC
2019/0228,971 DOPING SYSTEM, DOPING METHOD AND METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICENov 27, 18Jul 25, 19Fuji Electric Co. Ltd.
2019/0198,608 SILICON CARBIDE-BASED TRANSISTOR AND METHOD FOR MANUFACTURING THE SAMEOct 12, 17Jun 27, 19SOGANG UNIVERSITY RESEARCH FOUNDATION
2019/0181,219 SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICEAug 10, 17Jun 13, 19Not available
2019/0172,944 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAMENov 06, 18Jun 06, 19Fuji Electric Co. Ltd.
2019/0172,715 MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE WITH EFFICIENT EDGE STRUCTUREDec 04, 18Jun 06, 19Not available

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Patents Issued To Date - By Filing Year

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