Class H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Subclass 1/00: Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 11950337 | Wiring boards for array-based electronic devices | Jan 23, 20 | Apr 02, 24 | Cooledge Lighting Inc. |
| 11924959 | Heatsink based power delivery for CPUs | Apr 19, 22 | Mar 05, 24 | Dell Products L.P. |
| 11909132 | PCB having edge antenna, and battery including PCB having edge antenna | Nov 19, 19 | Feb 20, 24 | LG Energy Solution, Ltd. |
| 11910523 | Bus bar | Apr 21, 21 | Feb 20, 24 | TDK ELECTRONICS AG |
| 11871524 | Component-incorporated substrate and method for manufacturing same | Aug 21, 17 | Jan 09, 24 | Fujikura Ltd. |
| 11860460 | Button deck assembly for an electronic gaming machine and method for making the same | May 10, 22 | Jan 02, 24 | Aristocrat Technologies Australia Pty Limited |
| 11862552 | Methods of embedding magnetic structures in substrates | Jan 03, 22 | Jan 02, 24 | Intel Corp. |
| 11856710 | Method of manufacturing an electronic device | May 25, 22 | Dec 26, 23 | Chimei Innolux Corporation |
| 11839033 | Method of directly patterning stretchable substrate and stretchable electrode fabricated by the same | Apr 25, 22 | Dec 05, 23 | Korea University Research and Business Foundation |
| 11832382 | Printed circuit board and a storage system including the same | Nov 04, 21 | Nov 28, 23 | Samsung Electronics Co. Ltd. |
| 11825592 | Electronic device console with natural draft cooling | Oct 05, 20 | Nov 21, 23 | IBM Corporation |
| 11825596 | Storage devices and methods of operating storage devices | Feb 04, 21 | Nov 21, 23 | Samsung Electronics Co. Ltd. |
| 11818836 | Systems for electrostatic discharge protection | Jan 19, 21 | Nov 14, 23 | CommScope Technologies LLC |
| 11818831 | Notched baffled heat exchanger for circuit boards | Sep 24, 19 | Nov 14, 23 | BorgWarner Inc. |
| 11812547 | Memory module for protection of a circuit, a memory module protection device, and a memory module protection system | Jun 24, 21 | Nov 07, 23 | Samsung Electronics Co. Ltd. |
| 11812558 | Display device and assembly method thereof | Aug 01, 19 | Nov 07, 23 | CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE Technology Group Co. Ltd.; |
| 11800636 | Electronic substrate having differential coaxial vias | Sep 23, 21 | Oct 24, 23 | Agilent Technologies Texas Instruments Incorporated |
| 11792930 | Wiring substrate, electronic device, and electronic module | Mar 25, 20 | Oct 17, 23 | Kyocera Corporation |
| 11784392 | High frequency film transmission line, antenna comprising same, and image display device having antenna coupled thereto | Feb 08, 21 | Oct 10, 23 | DONGWOO FINE-CHEM CO., LTD. |
| 11785712 | Communication device | May 17, 21 | Oct 10, 23 | Not available |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2024/0093,841 | LED lamp and misuse warning module thereof | Jul 10, 23 | Mar 21, 24 | Not available |
| 2024/0090,140 | COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME | Nov 22, 23 | Mar 14, 24 | Fujikura Ltd. |
| 2024/0053,314 | PURGE GAS MONITOR | Aug 14, 23 | Feb 15, 24 | Not available |
| 2024/0019,088 | LED LAMP AND POWER SOURCE MODULE THEREOF | Sep 11, 23 | Jan 18, 24 | Not available |
| 2019/0342,643 | Technologies For Switching Network Traffic In A Data Center | Jul 16, 19 | Nov 07, 19 | Not available |
| 2019/0342,642 | Technologies For Switching Network Traffic In A Data Center | Jul 16, 19 | Nov 07, 19 | Not available |
| 2019/0202,204 | LIQUID DISCHARGE HEAD, LIQUID DISCHARGE DEVICE, AND LIQUID DISCHARGE APPARATUS | Mar 12, 19 | Jul 04, 19 | Not available |
| 2013/0186,676 | Methods and Apparatus for a Substrate Core Layer | Jan 20, 12 | Jul 25, 13 | FUTUREWEI TECHNOLOGIES, INC. |
| 2012/0279,762 | COMPOSITION FOR FORMING STRETCHABLE CONDUCTIVE PATTERN, METHOD OF PRODUCING THE STRETCHABLE CONDUCTIVE PATTERN USING THE COMPOSITION, AND ELECTRONIC DEVICE INCLUDING STRETCHABLE CONDUCTIVE ELECTRODE | Apr 27, 12 | Nov 08, 12 | SAMSUNG ELECTRONICS CO., LTD., INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY, |
| 2012/0090,883 | Method and Apparatus for Improving Substrate Warpage | Jul 15, 11 | Apr 19, 12 | QUALCOMM INCORPORATED |
| 2011/0214,909 | Hydrophobic Silane Coating for Preventing Conductive Anodic Filament (CAF) Growth in Printed Circuit Boards | Mar 05, 10 | Sep 08, 11 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 2009/0155,684 | PROTECTION CIRCUIT ASSEMBLY AND BATTERY PACK HAVING THE SAME | Nov 13, 08 | Jun 18, 09 | SAMSUNG SDI CO., LTD. |
| Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More |
|---|
