Class H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Subclass 1/00: Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12267949 | Display unit and electronic apparatus | May 22, 23 | Apr 01, 25 | InterDigital CE Patent Holdings, SAS |
| 12267956 | Mounting structure of electronic component | Sep 29, 22 | Apr 01, 25 | Murata Manufacturing Co Ltd. |
| 12262465 | Circuit board | May 13, 21 | Mar 25, 25 | LG INNOTEK CO., LTD. |
| 12262471 | Dual-sided expansion card with offset slot alignment | Sep 26, 22 | Mar 25, 25 | Liqid Inc. |
| 12250765 | Anti-interference surface mount electronic component | Sep 08, 22 | Mar 11, 25 | Kaotek Electronic Technology Co., Ltd. |
| 12245375 | Circuit board | Apr 16, 21 | Mar 04, 25 | LG INNOTEK CO., LTD. |
| 12232255 | Circuit board | Jun 17, 21 | Feb 18, 25 | LG INNOTEK CO., LTD. |
| 12232259 | Printed circuit board including conductive pad and electric device using the same | Feb 08, 23 | Feb 18, 25 | Samsung Electronics Co., Ltd. |
| 12232262 | Electronic device | Jan 09, 24 | Feb 18, 25 | Japan Display Inc. |
| 12225657 | Power system and method for controlling power modules | Apr 12, 22 | Feb 11, 25 | Transportation IP Holdings, LLC |
| 12225659 | Electronic control device | Dec 25, 20 | Feb 11, 25 | Hitachi Astemo, Ltd. |
| 12219706 | Removable and low insertion force connector system | Jun 22, 21 | Feb 04, 25 | Intel Corp. |
| 12200154 | Electronic device including flexible printed circuit board | May 06, 22 | Jan 14, 25 | Samsung Electronics Co., Ltd. |
| 12187602 | Cover member for electronic device, package, electronic device, and electronic module | Sep 24, 20 | Jan 07, 25 | Kyocera Corporation |
| 12193143 | Circuit board module | Sep 18, 22 | Jan 07, 25 | Murata Manufacturing Co., Ltd. |
| 12193161 | Redundant printed circuit board with built in isolation | May 26, 21 | Jan 07, 25 | Steering Solutions IP Holding Corporation |
| 12193167 | Method of manufacturing an electronic device | Oct 27, 23 | Jan 07, 25 | Chimei Innolux Corporation |
| 12185461 | Electronic device | Dec 02, 22 | Dec 31, 24 | Chimei Innolux Corporation |
| 12185470 | Embedded printed circuit board | Feb 15, 23 | Dec 31, 24 | Shinko Electric Industries Co. Ltd. |
| 12177970 | Support substrate and method for producing a support substrate | Apr 28, 21 | Dec 24, 24 | Rogers Germany GmbH |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0035,271 | LED LAMP, INTEGRATED CIRCUIT AND POWER SUPPLY MODULE THEREOF | Sep 27, 24 | Jan 30, 25 | Not available |
| 2024/0093,841 | LED lamp and misuse warning module thereof | Jul 10, 23 | Mar 21, 24 | Not available |
| 2024/0090,140 | COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME | Nov 22, 23 | Mar 14, 24 | Fujikura Ltd. |
| 2024/0053,314 | PURGE GAS MONITOR | Aug 14, 23 | Feb 15, 24 | Not available |
| 2019/0342,643 | Technologies For Switching Network Traffic In A Data Center | Jul 16, 19 | Nov 07, 19 | Not available |
| 2019/0342,642 | Technologies For Switching Network Traffic In A Data Center | Jul 16, 19 | Nov 07, 19 | Not available |
| 2019/0202,204 | LIQUID DISCHARGE HEAD, LIQUID DISCHARGE DEVICE, AND LIQUID DISCHARGE APPARATUS | Mar 12, 19 | Jul 04, 19 | Not available |
| 2013/0186,676 | Methods and Apparatus for a Substrate Core Layer | Jan 20, 12 | Jul 25, 13 | FUTUREWEI TECHNOLOGIES, INC. |
| 2012/0279,762 | COMPOSITION FOR FORMING STRETCHABLE CONDUCTIVE PATTERN, METHOD OF PRODUCING THE STRETCHABLE CONDUCTIVE PATTERN USING THE COMPOSITION, AND ELECTRONIC DEVICE INCLUDING STRETCHABLE CONDUCTIVE ELECTRODE | Apr 27, 12 | Nov 08, 12 | SAMSUNG ELECTRONICS CO., LTD., INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY, |
| 2012/0090,883 | Method and Apparatus for Improving Substrate Warpage | Jul 15, 11 | Apr 19, 12 | QUALCOMM INCORPORATED |
| 2011/0214,909 | Hydrophobic Silane Coating for Preventing Conductive Anodic Filament (CAF) Growth in Printed Circuit Boards | Mar 05, 10 | Sep 08, 11 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 2009/0155,684 | PROTECTION CIRCUIT ASSEMBLY AND BATTERY PACK HAVING THE SAME | Nov 13, 08 | Jun 18, 09 | SAMSUNG SDI CO., LTD. |
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