Class H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Subclass 1/03: Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 11975198 | Nerve stimulator and manufacturing method thereof | May 16, 18 | May 07, 24 | HANGZHOU NANOCHAP ELECTRONICS CO., LTD. |
| 11975507 | Thermosetting resin composition, prepreg containing same, metal foil-clad laminate and printed circuit board | Mar 06, 19 | May 07, 24 | Shengyi Technology Co., Ltd. |
| 11977194 | Printed film electrostatic concentration for radon detection | Oct 25, 19 | May 07, 24 | National Research Council of Canada |
| 11976171 | Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board | Oct 01, 21 | May 07, 24 | Arisawa Mfg. Co. Ltd. |
| 11979980 | Method of fabricating a substrate with metal reflection layer | Aug 19, 21 | May 07, 24 | UNIFLEX Technology Inc. |
| 11979981 | Wiring board | Feb 18, 21 | May 07, 24 | Kyocera Corporation |
| 11979982 | Printed wiring board and method for manufacturing printed wiring board | Oct 27, 20 | May 07, 24 | TANAZAWA HAKKOSHA CO., LTD. |
| 11979985 | Printed circuit board | Sep 23, 22 | May 07, 24 | LG INNOTEK CO., LTD. |
| 11979990 | Wiring board and method for manufacturing the same | Dec 19, 19 | May 07, 24 | Resonac Corporation |
| 11970591 | Resin composition, prepreg for printed circuit and metal-coated laminate | Dec 25, 18 | Apr 30, 24 | Shengyi Technology Co., Ltd. |
| 11971760 | Printed circuits with embedded resistive thermal devices | Apr 07, 21 | Apr 30, 24 | Apple Inc. |
| 11973003 | Ceramic metal circuit board and semiconductor device using the same | Jan 19, 23 | Apr 30, 24 | Kabushiki Kaisha Toshiba; Toshiba Materials Co., Ltd.; |
| 11974388 | Circuit board | Feb 13, 20 | Apr 30, 24 | LG Innotek Co. Ltd. |
| 11974389 | Low dielectric substrate for high-speed millimeter-wave communication | Mar 08, 23 | Apr 30, 24 | Shin-Etsu Chemical Co. Ltd. |
| 11974396 | Systems using composite materials | Oct 19, 20 | Apr 30, 24 | Advanced American Technologies, LLC |
| 11965760 | Flow rate detecting device of intake air in an internal combustion engine | Feb 13, 19 | Apr 23, 24 | Hitachi Astemo, Ltd. |
| 11967561 | Fabric-based items with electrical component arrays | Jun 06, 23 | Apr 23, 24 | Apple Inc. |
| 11965060 | Fluorine-containing epoxy resin for electrical materials and method for manufacturing same | Nov 23, 21 | Apr 23, 24 | DAIKIN INDUSTRIES, LTD. |
| 11968778 | Stretchable substrate having improved stretch uniformity and method of manufacturing the same | Mar 24, 22 | Apr 23, 24 | Korea Institute of Science and Technology |
| 11968780 | Method to manufacture conductive anodic filament-resistant microvias | Jun 02, 22 | Apr 23, 24 | International Business Machine Corporation |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2024/0148,329 | DEVICES, SYSTEMS, METHODS AND COMPUTER-ACCESSIBLE MEDIUM FOR PROVIDING WIRELESS STENT-BASED INTERFACES TO THE NERVOUS SYSTEM | Nov 13, 23 | May 09, 24 | Not available |
| 2024/0150,567 | RESIN COMPOSITION AND USES THEREOF | Nov 17, 22 | May 09, 24 | TAIWAN UNION TECHNOLOGY CORPORATION |
| 2024/0153,927 | MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS | Nov 13, 23 | May 09, 24 | Not available |
| 2024/0155,764 | PRINTED CIRCUIT BOARD | Feb 01, 23 | May 09, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2024/0155,765 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREFOR | Feb 22, 22 | May 09, 24 | Not available |
| 2024/0155,770 | PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND PROCESS FOR MANUFACTURING SUCH AN INSERT | Feb 23, 22 | May 09, 24 | Not available |
| 2024/0155,776 | PRINTED WIRING BOARD | Nov 06, 23 | May 09, 24 | Ibiden Co. Ltd. |
| 2024/0155,777 | ELECTRONIC DEVICE | Sep 26, 23 | May 09, 24 | Not available |
| 2024/0140,863 | Glass Cloth and Method of Manufacture | Oct 30, 23 | May 02, 24 | Shin-Etsu Chemical Co., Ltd. |
| 2024/0147,607 | CONDUCTIVE FILM AND DISPLAY PANEL | Apr 15, 22 | May 02, 24 | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 2024/0147,614 | LIQUID CRYSTAL POLYMER EMBEDDED MICROELECTRONICS DEVICE | Jan 02, 24 | May 02, 24 | Not available |
| 2024/0147,615 | ELECTRONIC DEVICE | Oct 10, 23 | May 02, 24 | Japan Display Inc. |
| 2024/0147,616 | ELECTRONIC DEVICE ASSEMBLY APPARATUS | Oct 30, 23 | May 02, 24 | NACHI-FUJIKOSHI CORP. |
| 2024/0147,618 | Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof | Feb 24, 22 | May 02, 24 | Not available |
| 2024/0132,684 | GLASS FABRIC, PREPREG, AND PRINTED CIRCUIT BOARD | Oct 10, 21 | Apr 25, 24 | Asahi Kasei Kabushiki Kaisha |
| 2024/0138,058 | ELECTRONIC SUBSTRATE | Feb 25, 22 | Apr 25, 24 | LG INNOTEK CO., LTD. |
| 2024/0138,060 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE | Dec 29, 23 | Apr 25, 24 | Not available |
| 2024/0138,061 | ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES | Oct 18, 23 | Apr 25, 24 | Not available |
| 2024/0125,050 | CIRCUIT BOARD UNWOVEN FABRIC, CIRCUIT BOARD PREPREG USING SAME AND CIRCUIT BOARD USING SAME | Apr 12, 22 | Apr 18, 24 | Not available |
| 2024/0130,041 | INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION | Oct 18, 22 | Apr 18, 24 | Dell Products L.P. |
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