H05K 1/05

Sub-Class

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Description

Class  H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS


Subclass 1/05: Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate Insulated metal substrate

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12258468 Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor packageMar 29, 19Mar 25, 25Resonac Corporation
12262468 Copper-clad laminate and method of forming the sameJul 26, 21Mar 25, 25VERSIV COMPOSITES LIMITED
12250767 Dielectric substrate and method of forming the sameSep 21, 23Mar 11, 25VERSIV COMPOSITES LIMITED
12250769 Circuit board and manufacturing method thereofJun 17, 22Mar 11, 25Not available
12240988 Coating composition and laminateNov 20, 23Mar 04, 25DAIKIN INDUSTRIES, LTD.
12237556 Electronic deviceNov 09, 22Feb 25, 25Murata Manufacturing Co Ltd.
12238859 Wiring circuit boardNov 09, 22Feb 25, 25Nitto Denko Corporation
12232255 Circuit boardJun 17, 21Feb 18, 25LG INNOTEK CO., LTD.
12219700 Circuit boardAug 25, 20Feb 04, 25LG INNOTEK CO., LTD.
12207399 Component carrier having a double dielectric layer and method of manufacturing the sameDec 09, 20Jan 21, 25AT&S (Chongqing) Company Limited
12207401 Embedded smart moduleOct 10, 22Jan 21, 25National Taipel University of Technology
12207410 Wiring circuit boardOct 25, 22Jan 21, 25Nitto Denko Corporation
12198734 Disk deviceOct 18, 23Jan 14, 25Kabushiki Kaisha Toshiba; TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION;
12193158 Printed circuit board moduleDec 04, 20Jan 07, 25LG INNOTEK CO., LTD.
12181936 Electronic device including electrostatic discharge pathSep 22, 22Dec 31, 24Samsung Electronics Co., Ltd.
12184052 Circuit assembly and electrical junction boxJul 08, 22Dec 31, 24Sumitomo Wiring Systems, Ltd.
12177968 Method of forming a flexible electronics assemblyApr 03, 20Dec 24, 24The Boeing Company
12177972 Heat-dissipating circuit board, heat-dissipating member, and production method for heat-dissipating circuit boardAug 23, 22Dec 24, 24NOF Corporation
12162257 Metal clad laminated plate and method for manufacturing metal clad laminated plateJan 04, 23Dec 10, 24Panasonic Intellectual Property Management Co., Ltd.
12166339 Circuit structureMar 05, 21Dec 10, 24Autonetworks Technologies Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd.;

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0120,008 PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATIONDec 22, 23Apr 10, 25PANJIT INTERNATIONAL INC.
2025/0112,142 ARRANGEMENT FOR A SEMICONDUCTOR ARRANGEMENT COMPRISING AT LEAST ONE PASSIVE COMPONENT AND A SUBSTRATENov 28, 22Apr 03, 25Siemens Aktiengesellschaft
2025/0106,993 CIRCUIT CARRIER AND METHODSep 19, 24Mar 27, 25Vitesco Technologies GmbH
2025/0089,162 SUBSTRATE STRUCTUREOct 19, 23Mar 13, 25SUBTRON TECHNOLOGY CO. LTD.
2025/0075,062 RESIN COMPOSITION, RESIN-ATTACHED METAL FOIL, CURED PRODUCT, METAL-BASED SUBSTRATE, AND ELECTRONIC PARTJan 25, 22Mar 06, 25TAIYO Holdings Co., Ltd.
2025/0081,340 PRINTED CIRCUIT BOARDFeb 07, 24Mar 06, 25SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2025/0026,951 EPOXY RESIN COMPOSITION FOR INTERLAYER INSULATION, RESIN SHEET FOR INTERLAYER INSULATION, LAMINATE FOR CIRCUIT BOARD, METAL- BASED CIRCUIT BOARD, AND POWER MODULESep 16, 24Jan 23, 25NHK SPRING CO., LTD.
2025/0008,645 PRINTED WIRING BOARDJun 25, 24Jan 02, 25Ibiden Co. Ltd.
2024/0414,841 COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARDDec 02, 22Dec 12, 24Mitsubishi Materials Corporation
2024/0357,732 Isolation Slots for an Antenna and Printed Circuit Board InterfaceApr 24, 23Oct 24, 24Not available
2024/0349,424 METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATEFeb 09, 24Oct 17, 24Not available
2024/0324,116 STORAGENov 01, 23Sep 26, 24Not available
2024/0306,292 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOFNov 09, 23Sep 12, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2024/0290,708 SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AND METHOD OF MAKING THE SAMEFeb 28, 24Aug 29, 24LUX SEMICONDUCTORS, INC.
2024/0292,532 COMPONENT MOUNTING BOARDOct 05, 22Aug 29, 24Nippon Mektron Ltd.
2024/0284,599 Method for preparing novel material layer structure of circuit board and article thereofMar 26, 24Aug 22, 24Not available
2024/0284,608 CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULEMar 21, 24Aug 22, 24Not available
2024/0268,021 PRINTED WIRING BOARDFeb 07, 24Aug 08, 24Ibiden Co. Ltd.
2024/0260,179 PRINTED WIRING BOARDJan 30, 24Aug 01, 24Ibiden Co. Ltd.
2024/0244,742 WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEETJan 28, 22Jul 18, 24Nitto Denko Corporation

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Patents Issued To Date - By Filing Year

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