Class H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Subclass 1/09: Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the metallic pattern
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12264249 | Curable composition for inkjet, cured product and flexible printed circuit board | Oct 20, 20 | Apr 01, 25 | Microcosm Technology Co., Ltd. |
| 12263795 | Trim element comprising a functional layer made of carbon material | Nov 19, 21 | Apr 01, 25 | Faurecia Interieur Industrie |
| 12260278 | Card-type medium and card-type medium manufacturing method | Jul 12, 23 | Mar 25, 25 | TOPPAN INC. |
| 12262469 | Copper-clad laminate plate and printed wiring board | Jul 14, 21 | Mar 25, 25 | MITSUI MINING & SMELTING CO., LTD. |
| 12262481 | Electrical devices with electrodes on softening polymers and methods of manufacturing thereof | Jan 02, 24 | Mar 25, 25 | 501 Board of Regents The University of Texas System |
| 12249704 | Method of direct embedding a lithium ion battery on a flexible printed circuit board | Feb 05, 21 | Mar 11, 25 | Compass Technology Company Limited |
| 12250767 | Dielectric substrate and method of forming the same | Sep 21, 23 | Mar 11, 25 | VERSIV COMPOSITES LIMITED |
| 12240986 | Thermally curable ink-jet ink | Jul 02, 19 | Mar 04, 25 | KONICA MINOLTA , INC. |
| 12245366 | Wiring board | Aug 21, 20 | Mar 04, 25 | Kyocera Corporation |
| 12245369 | Methods and systems for fabricating 3D multielectrode arrays with 3D printed electrodes | May 06, 22 | Mar 04, 25 | University of Oregon |
| 12245373 | Printed circuit board and electronic device including same | Feb 03, 22 | Mar 04, 25 | ASUSTek Computer Inc. |
| 12232548 | Flexible pressure sensors and user interfaces | Jun 11, 20 | Feb 25, 25 | LOOMIA Technologies, Inc. |
| 12233621 | Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil | May 14, 20 | Feb 25, 25 | Panasonic Intellectual Property Management Co., Ltd. |
| 12238859 | Wiring circuit board | Nov 09, 22 | Feb 25, 25 | Nitto Denko Corporation |
| 12227661 | Method for processing metal nanowire ink with metal ions | Oct 23, 23 | Feb 18, 25 | EKC Technology, Inc. |
| 12232254 | Printed circuit board and manufacturing method thereof | Aug 03, 22 | Feb 18, 25 | Unimicron Technology Corporation |
| 12232273 | Printed circuit board and method of fabricating the same | Jun 20, 23 | Feb 18, 25 | LG INNOTEK CO., LTD. |
| 12223147 | Printed wiring | Apr 24, 24 | Feb 11, 25 | Japan Aviation Electronics Industry Limited |
| 12224081 | Conductive paste and electronic device | Nov 23, 21 | Feb 11, 25 | BEIJING DREAM INK TECHNOLOGIES CO., LTD. |
| 12213250 | Conductive ink interconnected devices | Aug 31, 22 | Jan 28, 25 | NCR Voyix Corporation |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0100,268 | METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING APPARATUS AND PASTE DISPENSING APPARATUS FOR DISPENSING PASTE FOR A PRINTER | Mar 08, 22 | Mar 27, 25 | Not available |
| 2025/0105,132 | POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES | Sep 26, 23 | Mar 27, 25 | Not available |
| 2025/0096,430 | RECHARGEABLE BATTERY MODULE | Aug 07, 24 | Mar 20, 25 | Samsung SDI Co., Ltd. |
| 2025/0098,059 | CIRCUIT BOARD | Dec 04, 24 | Mar 20, 25 | Not available |
| 2025/0089,161 | ULTRA-THIN LAMINATED GLASS ASSEMBLY WITH ELECTRIC CIRCUITRY | Nov 25, 24 | Mar 13, 25 | Not available |
| 2025/0089,166 | HYBRID PRINTED CIRCUIT BOARD | Jul 16, 24 | Mar 13, 25 | Not available |
| 2025/0081,341 | Method and Apparatus of Conductive Hybrid Material Layer Stacks with Magnetic Material | Oct 30, 24 | Mar 06, 25 | Not available |
| 2025/0071,893 | CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF | Dec 15, 22 | Feb 27, 25 | AMOSENSE CO., LTD. |
| 2025/0071,894 | PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD | Mar 20, 23 | Feb 27, 25 | Sumitomo Electric Industries Ltd.; Sumitomo Electric Printed Circuits, Inc.; |
| 2025/0059,665 | ELECTROLYTIC SOLUTION FOR COPPER FOIL, AND ELECTROLYTIC COPPER FOIL | Dec 20, 22 | Feb 20, 25 | Shenzhen Institute of Advanced Electronic Materials |
| 2025/0063,655 | MEMBRANE CIRCUIT BOARD | Sep 14, 23 | Feb 20, 25 | Not available |
| 2025/0063,656 | SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND SMART WEARABLE SYSTEM | Dec 23, 22 | Feb 20, 25 | MIDAS H&T INC. |
| 2025/0063,672 | REAL-TIME IN-SITU ADDITIVE CIRCUIT TUNING FOR RF/MICROWAVE ELECTRONICS | Aug 14, 23 | Feb 20, 25 | Not available |
| 2025/0056,722 | HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD | Aug 06, 24 | Feb 13, 25 | SHANGHAI METAPWR ELECTRONICS CO., LTD |
| 2025/0048,550 | TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME | Jul 30, 24 | Feb 06, 25 | The Charles Stark Draper Laboratory, Inc. |
| 2025/0036,176 | Printed Circuits with Embedded Resistive Thermal Devices | Oct 01, 24 | Jan 30, 25 | Not available |
| 2025/0040,036 | CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT THERMAL EXPANSION COEFFICIENTS AND METHOD FOR PRODUCING THE SAME | Oct 31, 23 | Jan 30, 25 | Not available |
| 2025/0040,041 | ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING SAME | Oct 16, 24 | Jan 30, 25 | Not available |
| 2025/0040,044 | ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN | Dec 07, 23 | Jan 30, 25 | Not available |
| 2025/0040,054 | TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN | Dec 07, 23 | Jan 30, 25 | Not available |
| Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More |
|---|
