| 12265103 | Leadless current sensor package with high isolation | Aug 05, 22 | Apr 01, 25 | ALLEGRO MICROSYSTEMS, LLC |
| 12266598 | Dense via pitch interconnect to increase wiring density | Oct 24, 22 | Apr 01, 25 | International Business Machine Corporation |
| 12267946 | Power delivery network noise isolation in a computing device | Feb 16, 22 | Apr 01, 25 | QUALCOMM Incorporated |
| 12267950 | Flexible printed wiring board and battery wiring module | Jul 09, 20 | Apr 01, 25 | Sumitomo Electric Printed Circuits, Inc.; Sumitomo Electric Industries Ltd.; Sumitomo Wiring Systems LTD; Autonetworks Technologies Ltd.; |
| 12267953 | Wiring board | Nov 22, 22 | Apr 01, 25 | Shinko Electric Industries Co. Ltd. |
| 12267955 | Semiconductor device, power conversion apparatus, moving body, and method for producing semiconductor device | May 21, 20 | Apr 01, 25 | Mitsubishi Electric Corporation |
| 12267956 | Mounting structure of electronic component | Sep 29, 22 | Apr 01, 25 | Murata Manufacturing Co Ltd. |
| 12267957 | Hybrid pitch through hole connector | Dec 18, 20 | Apr 01, 25 | Intel Corp. |
| 12267958 | Electronic component and manufacturing method thereof | Jul 07, 23 | Apr 01, 25 | Murata Manufacturing Co., Ltd. |
| 12267959 | System and method for reversible connection of interchangeable components | Jul 22, 22 | Apr 01, 25 | Dell Products L.P. |
| 12267960 | Electronic component sub-mount and electronic device using the same | Oct 18, 22 | Apr 01, 25 | Lextar Electronics Corporation |
| 12267962 | Capacitor-wire-embedded wiring board | Nov 07, 22 | Apr 01, 25 | Samsung Electronics Co. Ltd. |
| 12259112 | Illuminating circuit structure | Aug 28, 22 | Mar 25, 25 | Darfon Electronics Corp. |
| 12260885 | Disk device having components that communicate with each other via conversion devices | Sep 08, 21 | Mar 25, 25 | Kabushiki Kaisha Toshiba; TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION; |
| 12260975 | Over-voltage circuit protection device | Sep 08, 22 | Mar 25, 25 | Fuzetec Technology Co., Ltd. |
| 12262464 | Methods for forming engineered thermal paths of printed circuit boards by use of removable layers | Dec 06, 21 | Mar 25, 25 | Not available |
| 12262465 | Circuit board | May 13, 21 | Mar 25, 25 | LG INNOTEK CO., LTD. |
| 12262470 | Printed circuit board | Jan 19, 22 | Mar 25, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 12262481 | Electrical devices with electrodes on softening polymers and methods of manufacturing thereof | Jan 02, 24 | Mar 25, 25 | 501 Board of Regents The University of Texas System |
| 12254803 | Display device | Jul 06, 23 | Mar 18, 25 | Samsung Display Co., Ltd. |
