Class H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Subclass 3/00: Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L)
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12265380 | Matching process controllers for improved matching of process | Dec 30, 20 | Apr 01, 25 | Applied Materials Inc. |
| 12267958 | Electronic component and manufacturing method thereof | Jul 07, 23 | Apr 01, 25 | Murata Manufacturing Co., Ltd. |
| 12267963 | Circuit board with anti-corrosion properties and electronic device having the same | Jan 31, 24 | Apr 01, 25 | CHAMP TECH OPTICAL (FOSHAN) CORPORATION |
| 12267964 | Electronic component module and method for manufacturing electronic component module | Mar 16, 23 | Apr 01, 25 | MURATA MANUFACTURING CO., LTD |
| 12259652 | Photosensitive dry film, and printed wiring board with photosensitive dry film | Aug 20, 21 | Mar 25, 25 | Tamura Corporation |
| 12261108 | Chip heat dissipating structure, chip structure, circuit board and supercomputing device | May 21, 21 | Mar 25, 25 | BITMAIN TECHNOLOGIES INC. |
| 12262464 | Methods for forming engineered thermal paths of printed circuit boards by use of removable layers | Dec 06, 21 | Mar 25, 25 | Not available |
| 12262474 | Display panel and method for assembling same and spliced display device | Jul 29, 21 | Mar 25, 25 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 12262481 | Electrical devices with electrodes on softening polymers and methods of manufacturing thereof | Jan 02, 24 | Mar 25, 25 | 501 Board of Regents The University of Texas System |
| 12251727 | Mask device and method of coating resin using the same | May 02, 23 | Mar 18, 25 | Samsung Display Co., Ltd. |
| 12256491 | Electronic component mounting substrate, electronic component mounted body, and method of manufacturing the same, as well as electronic apparatus | Dec 01, 20 | Mar 18, 25 | Sony Group Corporation |
| 12256494 | Modified internal clearance(s) at connector pin aperture(s) of a circuit board | Oct 21, 22 | Mar 18, 25 | IBM Corporation |
| 12250769 | Circuit board and manufacturing method thereof | Jun 17, 22 | Mar 11, 25 | Not available |
| 12250770 | Board edge electrical contact structures | Apr 13, 21 | Mar 11, 25 | Nokia Solutions and Networks Oy |
| 12250773 | Wiring board and wiring board manufacturing method | Jul 06, 22 | Mar 11, 25 | Shinko Electric Industries Co. Ltd. |
| 12250776 | Substrate structure and cutting method thereof | May 15, 23 | Mar 11, 25 | Unimicron Technology Corp. |
| 12245361 | Interconnect structure having conductor extending along dielectric block | Jun 29, 23 | Mar 04, 25 | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 12245366 | Wiring board | Aug 21, 20 | Mar 04, 25 | Kyocera Corporation |
| 12232548 | Flexible pressure sensors and user interfaces | Jun 11, 20 | Feb 25, 25 | LOOMIA Technologies, Inc. |
| 12236176 | System and method for trace generation and reconfiguration on a breadboard or printed circuit board | Jun 03, 22 | Feb 25, 25 | Not available |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0120,008 | PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION | Dec 22, 23 | Apr 10, 25 | PANJIT INTERNATIONAL INC. |
| 2025/0108,597 | PRINTING SYSTEM AND METHOD FOR CONTROLLING PRINTING SYSTEM | Sep 25, 24 | Apr 03, 25 | Not available |
| 2025/0113,439 | CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SPLIT SUBSTRATE | Nov 25, 24 | Apr 03, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0113,446 | PLATED THROUGH-HOLE STRUCTURES AND METHOD FOR THE MANUFACTURE THEREOF | Sep 30, 24 | Apr 03, 25 | Not available |
| 2025/0106,979 | Embeddable Electrically Insulating Thermal Connector and Circuit Board Including the Same | Dec 09, 24 | Mar 27, 25 | Not available |
| 2025/0106,987 | FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRUCTURE | Sep 26, 23 | Mar 27, 25 | Cyntec Co. Ltd. |
| 2025/0107,006 | RF COVER LAYER | Sep 21, 23 | Mar 27, 25 | Raytheon Company |
| 2025/0107,007 | FOLD FLEX CIRCUIT FOR LNOP | Dec 10, 24 | Mar 27, 25 | Not available |
| 2025/0097,644 | MEMBRANE UNIT FOR SPEAKER DEVICE | Jul 22, 24 | Mar 20, 25 | Not available |
| 2025/0098,062 | TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED TAMPER-DETECT CIRCUITRY | Sep 19, 23 | Mar 20, 25 | Not available |
| 2025/0098,074 | MITIGATING FIBER WEAVE EFFECT IN A PRINTED CIRCUIT BOARD | Sep 19, 23 | Mar 20, 25 | Not available |
| 2025/0082,220 | CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS | Nov 25, 24 | Mar 13, 25 | Not available |
| 2025/0085,332 | SYSTEM AND METHOD FOR DETECTING DEFECTIVE BACK-DRILLS IN PRINTED CIRCUIT BOARDS | Nov 25, 24 | Mar 13, 25 | Not available |
| 2025/0089,154 | DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES FOR SHIELDING APPLICATIONS | Jul 31, 24 | Mar 13, 25 | Not available |
| 2025/0089,167 | WIRING SUBSTRATE | Sep 11, 24 | Mar 13, 25 | Ibiden Co. Ltd. |
| 2025/0089,171 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | May 23, 24 | Mar 13, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2025/0089,174 | GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICATION OF TAMPER-RESPONDENT SENSORS | Sep 08, 23 | Mar 13, 25 | Not available |
| 2025/0089,175 | Method for Manufacturing Multicoloured Printed Circuits for Smart Card Modules | Jul 11, 22 | Mar 13, 25 | Not available |
| 2025/0080,074 | FILTER PRODUCTION METHOD AND FILTER | Oct 26, 21 | Mar 06, 25 | Not available |
| 2025/0081,329 | WIRING BOARD AND LAMINATED WIRING BOARD | Aug 29, 24 | Mar 06, 25 | Not available |
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