H05K 3/02

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Class  H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS


Subclass 3/02: Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12256491 Electronic component mounting substrate, electronic component mounted body, and method of manufacturing the same, as well as electronic apparatusDec 01, 20Mar 18, 25Sony Group Corporation
12247280 Metal foil with carrierJan 21, 21Mar 11, 25MITSUI MINING & SMELTING CO., LTD.
12233621 Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foilMay 14, 20Feb 25, 25Panasonic Intellectual Property Management Co., Ltd.
12225669 Manufacturing method of continuous sheet for circuit board production and continuous sheet for circuit board production manufactured therefromOct 01, 19Feb 11, 25LG Chem Ltd.
12216010 Flexible devices incorporating electronically-conductive layers, including flexible wireless LC sensorsFeb 26, 21Feb 04, 25The University Court of the University of Edinburgh; Heriot-Watt University;
12213249 Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring boardMay 11, 21Jan 28, 25Sumitomo Electric Industries Ltd.; Sumitomo Electric Printed Circuits, Inc.;
12201980 Droplet actuator fabrication apparatus, systems, and related methodsNov 10, 20Jan 21, 25Abbott Laboratories
12200857 Package deviceSep 27, 23Jan 14, 25Chimei Innolux Corporation
12193142 Ground discontinuities for thermal isolationDec 08, 22Jan 07, 25IBM Corporation
12177978 Circuit boardJun 03, 21Dec 24, 24Toppan Printing Co Ltd.
12168834 Surface-treated copper foil and copper clad laminateDec 23, 21Dec 17, 24Chang Chun Petrochemical Co. Ltd.
12167533 Metal foil with carrier and preparation method thereofNov 06, 19Dec 10, 24GUANGZHOU FANGBANG ELECTRONICS CO., LTD
12167544 Wiring circuit board, producing method thereof, and wiring circuit board assembly sheetAug 09, 22Dec 10, 24Nitto Denko Corporation
12142390 Communication cable including a mosaic tapeAug 01, 23Nov 12, 24Panduit Corp.
12120828 Reel mechanism and winding device for flexible copper clad laminateJun 08, 22Oct 15, 24AAC TECHNOLOGIES (NANJING) CO., LTD.
12098257 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardJul 16, 20Sep 24, 24Panasonic Intellectual Property Management Co., Ltd.
12083418 Process for the enhancement and modification of a video game controllerDec 26, 23Sep 10, 24Not available
12088208 Method and apparatus for delivering power to semiconductorsJun 07, 23Sep 10, 24Vicor Corporation
12089327 Metal-coated liquid-crystal polymer filmOct 13, 22Sep 10, 24Kuraray Co. Ltd.
12082352 Flexible circuit boardJul 21, 22Sep 03, 24Avary Holding (Shenzhen) Co., Limited.; QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD; GARUDA TECHNOLOGY CO., LTD.;

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0089,174 GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICATION OF TAMPER-RESPONDENT SENSORSSep 08, 23Mar 13, 25Not available
2025/0071,909 METHOD OF MANUFACTURING CIRCUIT BOARDAug 23, 24Feb 27, 25Not available
2025/0063,654 STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING THE SAME, AND METHOD OF MAKING THE SAMESep 13, 23Feb 20, 25Not available
2025/0063,664 CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONSAug 14, 23Feb 20, 25Not available
2025/0056,723 ELECTRONIC DEVICE INCLUDING INTERPOSEROct 28, 24Feb 13, 25Not available
2025/0037,905 COMMUNICATION CABLE INCLUDING A MOSAIC TAPEOct 11, 24Jan 30, 25Panduit Corp.
2024/0414,850 CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOFJan 04, 24Dec 12, 24Unimicron Technology Corp.
2024/0407,105 X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBSMay 31, 23Dec 05, 24Not available
2024/0365,473 METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROMJul 04, 24Oct 31, 24Not available
2024/0349,422 COPPER CLAD LAMINATE AND PRINTED WIRING BOARDMar 15, 22Oct 17, 24Not available
2024/0329,525 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUSJun 13, 24Oct 03, 24Asahi Kasei Kabushiki Kaisha
2024/0301,173 THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARDMay 15, 24Sep 12, 24Panasonic Intellectual Property Management Co., Ltd.
2024/0292,527 Flexible Interconnect Circuits And Methods Of Fabrication ThereofMay 06, 24Aug 29, 24CelLink Corporation
2024/0292,544 METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAFER LEVEL COMPONENTDec 05, 23Aug 29, 24Not available
2024/0274,543 Electronic device and manufacturing method thereofJan 08, 24Aug 15, 24Chimei Innolux Corporation
2024/0276,636 CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFACTURING PROCESS THEREOFMay 03, 23Aug 15, 24Not available
2024/0268,027 CIRCUIT BOARDJun 15, 22Aug 08, 24Not available
2024/0260,177 METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARDMay 24, 21Aug 01, 24Nitto Denko Corporation
2024/0260,182 CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAMEApr 09, 24Aug 01, 24KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.;
2024/0244,755 Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad Laminate and Printed Circuit BoardMay 30, 22Jul 18, 24Not available

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Patents Issued To Date - By Filing Year

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