H05K 3/04

Sub-Class

Watch

Stats

Description

Class  H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS


Subclass 3/04: Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12262481 Electrical devices with electrodes on softening polymers and methods of manufacturing thereofJan 02, 24Mar 25, 25501 Board of Regents The University of Texas System
12213258 Method of manufacture for embedded IC chip directly connected to PCBOct 16, 19Jan 28, 25AVERATEK CORPORATION
12207395 Backplane footprint for high speed, high density electrical connectorsSep 27, 23Jan 21, 25Amphenol Corporation
12185462 Capacitive compensation for vertical interconnect accessesMar 09, 22Dec 31, 24Achronix Semiconductor Corporation
12177967 Electrically conductive filmMay 24, 22Dec 24, 24Gentherm GmbH
12127341 Multilayer printed circuit boardJul 28, 22Oct 22, 24Thales
12114433 Substrate, method for manufacturing substrate, and electronic deviceMay 26, 20Oct 08, 24FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
12089338 Flexible circuitry device manufacturing methodJan 15, 21Sep 10, 24LOOMIA Technologies, Inc.
11997789 Redistribution plateOct 24, 22May 28, 24Not available
11991836 Electrical devices with electrodes on softening polymers and methods of manufacturing thereofJan 26, 23May 21, 24501 Board of Regents The University of Texas System
11979976 Methods of forming interconnect circuitsJul 22, 21May 07, 24CelLink Corporation
11950372 Methods of making metal patterns on flexible substrateJun 27, 19Apr 02, 243M Innovation Properties Company
11917768 Single-layer circuit board, multi-layer circuit board, and manufacturing methods thereforJan 25, 22Feb 27, 24RICHVIEW ELECTRONICS CO., LTD.
11903137 Clinch mechanism for assembling a printed circuit board with electronic componentsJun 12, 20Feb 13, 24UNIVERSAL INSTRUMENTS CORPORATION
11849544 Milling of flex foil with two conductive layers from both sidesJul 01, 20Dec 19, 23Gentherm GmbH
11805595 Backplane footprint for high speed, high density electrical connectorsJul 25, 22Oct 31, 23Amphenol Corporation
11751327 Electrically conductive filmMar 17, 21Sep 05, 23Gentherm GmbH
11744023 Dual conductor laminated substrateJan 15, 21Aug 29, 23Gentherm GmbH
11723149 Resistive PCB traces for improved stabilityJan 26, 21Aug 08, 23Kioxia Corporation
11700688 Display substrate, method for manufacturing the same and display deviceFeb 24, 21Jul 11, 23HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD; BOE Technology Group Co. Ltd.;

more results

Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0081,355 Methods Of Manufacture Of A Compact Phased Array AntennaAug 29, 24Mar 06, 25Not available
2025/0063,664 CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONSAug 14, 23Feb 20, 25Not available
2025/0048,559 DRAPABLE, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFORAug 08, 24Feb 06, 25Not available
2025/0031,316 METHODS FOR FORMING CIRCUIT PATTERN ON SUBSTRATE USING METAL FOIL WITH LOW SURFACE ROUGHNESSNov 23, 23Jan 23, 25Not available
2024/0405,345 WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVIDED WITH WIRING BOARDSep 29, 22Dec 05, 24Not available
2024/0276,632 Interconnect Circuit Methods And DevicesApr 02, 24Aug 15, 24CelLink Corporation
2024/0260,200 METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USING SAME, AND MANUFACTURING METHOD FOR LAMINATEJun 24, 22Aug 01, 24Not available
2024/0206,052 METHOD AND STRUCTURE FOR ALIGNMENT OF LENS TO OPTICAL PRODUCT AT PCBA LEVELFeb 29, 24Jun 20, 24PixArt Imaging Inc.
2024/0206,075 A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE WITH AT LEAST ONE PATTERNED LAYERApr 19, 22Jun 20, 24Not available
2024/0206,076 METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATEFeb 29, 24Jun 20, 24Not available
2024/0107,680 SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERCONNECTSep 22, 22Mar 28, 24Not available
2023/0380,072 TAPE AND MANUFACTURING METHOD THEREOFFeb 14, 23Nov 23, 23Not available
2023/0276,578 ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOUT USING TIE BARSMay 08, 23Aug 31, 23Not available
2023/0093,870 Method for Forming Resistance on Circuit Board and Circuit Board Having ResistanceNov 17, 21Mar 30, 23Not available
2023/0007,781 METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MANUFACTURING MOLDED OBJECT, MOLDED OBJECTNov 18, 20Jan 05, 23Fujikura Ltd.
2022/0192,028 MILLING OF FLEX FOIL WITH TWO CONDUCTIVE LAYERS FROM BOTH SIDESApr 03, 20Jun 16, 22Not available
2021/0161,018 METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATEJun 27, 19May 27, 21Not available
2021/0092,844 Double-Sided, Single Conductor Laminated SubstrateMar 18, 20Mar 25, 21Not available
2020/0323,084 METHOD FOR DEPOSITING FUNCTIONAL TRACESMar 08, 18Oct 08, 20MGI Digital Technology; INKJET ENGINE TECHNOLOGY;
2020/0236,788 CIRCUIT BOARD INTERCONNECT DECALSDec 27, 19Jul 23, 20Honeywell Federal Manufacturing & Technologies, LLC

more results

Top Owners in This Subclass

Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More

Patents Issued To Date - By Filing Year

Average Time to Issuance