| 12262481 | Electrical devices with electrodes on softening polymers and methods of manufacturing thereof | Jan 02, 24 | Mar 25, 25 | 501 Board of Regents The University of Texas System |
| 12245358 | Circuit board with embedded electronic component and manufacturing method thereof | Mar 23, 23 | Mar 04, 25 | QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD; Avary Holding (Shenzhen) Co., Limited.; GARUDA TECHNOLOGY CO., LTD.; |
| 12245369 | Methods and systems for fabricating 3D multielectrode arrays with 3D printed electrodes | May 06, 22 | Mar 04, 25 | University of Oregon |
| 12232548 | Flexible pressure sensors and user interfaces | Jun 11, 20 | Feb 25, 25 | LOOMIA Technologies, Inc. |
| 12217978 | Etching device and etching method using the same | Oct 14, 21 | Feb 04, 25 | Samsung Display Co., Ltd. |
| 12207405 | Beveled overburden for vias and method of making the same | Apr 29, 21 | Jan 21, 25 | Corning Incorporated |
| 12185477 | Method for making printed wiring board, printed wiring board, and adhesive film for making printed wiring board | Mar 02, 22 | Dec 31, 24 | AJINOMOTO CO., INC. |
| 12185478 | Printed circuit board having embedded component | Nov 15, 22 | Dec 31, 24 | AT&S Austria Technologie & Systemtechnik Aktiengesellschaft |
| 12185479 | Flexible circuit board and manufacturing method thereof | Sep 15, 22 | Dec 31, 24 | Unimicron Technology Corp. |
| 12171057 | Manufacturing method for pcb with thermal conductor embedded therein, and pcb | Aug 11, 20 | Dec 17, 24 | SHENGYI ELECTRONICS CO., LTD. |
| 12171067 | Method of manufacturing printed wiring board | Mar 17, 20 | Dec 17, 24 | MITSUI MINING & SMELTING CO., LTD. |
| 12165881 | Methods and systems of forming metal interconnect layers using engineered templates | Jul 25, 23 | Dec 10, 24 | Not available |
| 12167534 | Method for manufacturing a ceramic copper circuit board | Dec 09, 21 | Dec 10, 24 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 12167540 | Printed circuit board | Sep 09, 20 | Dec 10, 24 | LG INNOTEK CO., LTD. |
| 12148974 | Fabrication of superconducting devices that control direct currents and microwave signals | Apr 07, 22 | Nov 19, 24 | IBM Corporation |
| 12109640 | Ceramic-copper composite, ceramic circuit board, power module, and method of producing ceramic-copper composite | Dec 26, 19 | Oct 08, 24 | DENKA COMPANY LIMITED |
| 12114424 | Circuit board and preparation method thereof | Apr 24, 20 | Oct 08, 24 | HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.; Avary Holding (Shenzhen) Co., Limited.; |
| 12101871 | Circuit board using thermocouple to dissipate generated heat and method for manufacturing the same | Jun 20, 22 | Sep 24, 24 | Avary Holding (Shenzhen) Co., Limited.; QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD; GARUDA TECHNOLOGY CO., LTD.; |
| 12101891 | Circuit board and manufacturing method therefor | May 20, 20 | Sep 24, 24 | Avary Holding (Shenzhen) Co., Limited.; QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD; |
| 12101892 | Semi-automatic corrosion box of copper clad laminate | Nov 13, 19 | Sep 24, 24 | DALIAN UNIVERSITY OF TECHNOLOGY |
