H05K 3/07

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Class  H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS


Subclass 3/07: Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12150248 System for providing dynamic feedback for selective adhesion PCB productionSep 01, 22Nov 19, 24Honeywell Federal Manufacturing & Technologies, LLC
11728258 Electroless metal-defined thin pad first level interconnects for lithographically defined viasNov 29, 21Aug 15, 23Intel Corp.
11716818 Embedded-type transparent electrode substrate and method for manufacturing sameJan 06, 22Aug 01, 23LG Chem Ltd.
11565825 Surfacing materials for composite structuresMay 03, 21Jan 31, 23CYTEC INDUSTRIES INC.
11483928 Flexible printed circuit boardAug 03, 18Oct 25, 22Sumitomo Electric Printed Circuits, Inc.; Sumitomo Electric Industries Ltd.;
11266023 Electronic circuit productionApr 15, 19Mar 01, 22DST Innovations Limited
10283484 Low cost substratesMay 25, 16May 07, 19Invensas Corporation
10102470 Method for manufacturing an electrical circuit board, electrical circuit board obtained by this method and smart card comprising such an electrical circuit boardAug 22, 16Oct 16, 18Linxens Holding
9950405 Chemical mechanical planarization apparatus and methodsJul 29, 14Apr 24, 18Semiconductor Manufacturing International (Beijing) Corporation; Semiconductor Manufacturing International (Shanghai) Corporation;
9721825 Method of providing a flexible semiconductor device and flexible semiconductor device thereofApr 12, 16Aug 01, 17ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
9441309 Electrode and method of forming the master electrodeDec 20, 13Sep 13, 16LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST), REPLISAURUS GROUP SAS,
8741113 Method and electrode for defining and replicating structures in conducting materialsMar 12, 12Jun 03, 14Centre de Recherche Public—Gabriel Lippmann
8506791 Linear guideAug 16, 06Aug 13, 13MTU AERO ENGINES GMBH
8500988 Device and method for ELID honingSep 08, 06Aug 06, 13SUBARU CORPORATION
8431007 Electro-thinning apparatus for removing excess metal from surface metal layer of substrate and removing method using the sameNov 25, 09Apr 30, 13ADVANCED SEMICONDUCTOR ENGINEERING, INC.
8366903 Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing methodAug 21, 08Feb 05, 13VIA MECHANICS, LTD., Hitachi Via Mechanics,
8236162 Electroerosion machining system and method for electrode wear compensationSep 30, 08Aug 07, 12GENERAL ELECTRIC COMPANY
7964085 Electrochemical removal of tantalum-containing materialsJun 17, 04Jun 21, 11QUANTUM GLOBAL TECHNOLOGIES LLC
7150820 Thiourea- and cyanide-free bath and process for electrolytic etching of goldSep 22, 03Dec 19, 06APPLIED MATERIALS, INC.
7067048 Method to improve the control of electro-polishing by use of a plating electrode an electrolyte bathAug 08, 03Jun 27, 06BELL SEMICONDUCTOR, LLC

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0071,893 CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOFDec 15, 22Feb 27, 25AMOSENSE CO., LTD.
2025/0063,671 METHOD FOR MANUFACTURING CIRCUIT BOARDDec 05, 22Feb 20, 25LX Semicon Co., Ltd.
2016/0242,297 Electronic Circuit ProductionSep 19, 14Aug 18, 16DST Innovations Limited
2015/0034,369 RESIN COMPOSITION FOR PRINTED WIRING BOARDSJul 03, 12Feb 05, 15MITSUBISHI GAS CHEMICAL COMPANY, INC.

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