H05K 3/10

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Description

Class  H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS


Subclass 3/10: Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12267963 Circuit board with anti-corrosion properties and electronic device having the sameJan 31, 24Apr 01, 25CHAMP TECH OPTICAL (FOSHAN) CORPORATION
12245369 Methods and systems for fabricating 3D multielectrode arrays with 3D printed electrodesMay 06, 22Mar 04, 25University of Oregon
12245371 Ultra-thin composite transparent conductive film and preparation method thereforSep 21, 23Mar 04, 25IVTOUCH CO., LTD
12245378 Three-dimensional molding machineNov 13, 19Mar 04, 25FUJI CORPORATION
12245383 Method of preparing a high density interconnect printed circuit board including microvias filled with copperAug 19, 20Mar 04, 25Atotech Deutschland GmbH & Co. KG
12238871 Method for manufacturing component embedded circuit boardOct 08, 21Feb 25, 25QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD; Avary Holding (Shenzhen) Co., Limited.;
12232266 Connection method for chip and circuit board, and circuit board assembly and electronic deviceNov 16, 22Feb 18, 25INTELLIMICRO MEDICAL CO., LTD.
12232273 Printed circuit board and method of fabricating the sameJun 20, 23Feb 18, 25LG INNOTEK CO., LTD.
12221389 Aluminum/ceramic bonding substrate and method for producing sameJul 23, 21Feb 11, 25Dowa Metaltech Co., Ltd.; Mitsubishi Electric Corporation;
12201167 Conductive garment fastening productApr 06, 20Jan 21, 25Prym Intimates Group Limited
12187943 Chemical solution used for cleaning or etching ruthenium-containing layer and method for fabricating ruthenium wiringJan 13, 22Jan 07, 25Tokyo Ohka Kogyo Co. LTD
12181796 Wiring formation method and transfer mold manufacturing methodJan 08, 21Dec 31, 24CONNECTEC JAPAN CORPORATION
12185478 Printed circuit board having embedded componentNov 15, 22Dec 31, 24AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
12177978 Circuit boardJun 03, 21Dec 24, 24Toppan Printing Co Ltd.
12165881 Methods and systems of forming metal interconnect layers using engineered templatesJul 25, 23Dec 10, 24Not available
12167540 Printed circuit boardSep 09, 20Dec 10, 24LG INNOTEK CO., LTD.
12167544 Wiring circuit board, producing method thereof, and wiring circuit board assembly sheetAug 09, 22Dec 10, 24Nitto Denko Corporation
12160949 Wiring board and method for manufacturing wiring boardMay 25, 22Dec 03, 24FUJIFILM Corporation
12160954 Wiring board having a wiring pattern that has a multi-layer structureJul 14, 22Dec 03, 24Shinko Electric Industries Co. Ltd.
12156343 Electrical connections to embedded electronic componentsJan 22, 21Nov 26, 243M Innovative Properties Company

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0107,001 COIL DEVICE AND PRINTED WIRING BOARDDec 23, 22Mar 27, 25Sumitomo Electric Printed Circuits, Inc.; Sumitomo Electric Industries Ltd.;
2025/0089,174 GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICATION OF TAMPER-RESPONDENT SENSORSSep 08, 23Mar 13, 25Not available
2025/0081,330 Component Carrier with Rough Surface and Smooth Surface Metal Traces and Manufacturing MethodApr 25, 23Mar 06, 25Not available
2025/0069,900 Methods And Systems Of Forming Metal Interconnect Layers Using Engineered TemplatesNov 11, 24Feb 27, 25Not available
2025/0071,890 STRETCHABLE CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE SAMESep 25, 23Feb 27, 25Not available
2025/0071,896 CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARDFeb 27, 24Feb 27, 25SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2025/0056,715 FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAMEAug 29, 23Feb 13, 25Not available
2025/0056,728 FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEXIBLE TRANSPARENT WIRING BOARDJun 10, 24Feb 13, 25Nippon Mektron Ltd.
2025/0040,041 ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING SAMEOct 16, 24Jan 30, 25Not available
2025/0031,306 FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAMEJul 28, 23Jan 23, 25Not available
2025/0031,319 LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTUREOct 08, 24Jan 23, 25Not available
2025/0016,916 PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTSSep 23, 24Jan 09, 25Not available
2025/0016,921 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAMEApr 08, 24Jan 09, 25SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2025/0016,932 METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN A PRE-STRETCH STATE AND USES THEREOFJul 15, 24Jan 09, 25Not available
2024/0431,030 PRINTED WIRING BOARDJul 28, 22Dec 26, 24Sumitomo Electric Printed Circuits, Inc.
2024/0431,034 PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARDSep 08, 22Dec 26, 24Gebr. Schmid GmbH & Co.
2024/0421,471 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARDAug 26, 24Dec 19, 24DAI NIPPON PRINTING CO., LTD.
2024/0407,093 INTRA-PAIR SKEW COMPENSATION OF DIFFERENTIAL SIGNALSMay 30, 23Dec 05, 24Not available
2024/0381,526 TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARDMay 08, 23Nov 14, 24Not available
2024/0349,425 ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICEAug 17, 22Oct 17, 24501 TDK Corporation

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