H05K 3/12

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Description

Class  H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS


Subclass 3/12: Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12265050 Porous nanostructured electrodes for detection of neurotransmittersApr 25, 23Apr 01, 25IBM Corporation
12267963 Circuit board with anti-corrosion properties and electronic device having the sameJan 31, 24Apr 01, 25CHAMP TECH OPTICAL (FOSHAN) CORPORATION
12260162 Method and apparatus for printing electrical circuit directly on target surface having 3-dimensional shape, 3D printer used for the same and electrical device having electrical circuit printed by the sameJan 17, 22Mar 25, 25KAIST (Korea Advanced Institute of Science and Technology)
12262481 Electrical devices with electrodes on softening polymers and methods of manufacturing thereofJan 02, 24Mar 25, 25501 Board of Regents The University of Texas System
12251924 System and method for aligning a movable cart to an assembly apparatusJan 10, 22Mar 18, 25Illinois Tool Works Inc.
12245378 Three-dimensional molding machineNov 13, 19Mar 04, 25FUJI CORPORATION
12232548 Flexible pressure sensors and user interfacesJun 11, 20Feb 25, 25LOOMIA Technologies, Inc.
12238870 Deposition with solid feedstockJan 15, 21Feb 25, 25Liquid Wire Inc.
12226822 Additive manufacturing process of 3D electronic substrateAug 11, 23Feb 18, 25Dowell -- A Division of Schlumberger Technology Corporation
12226831 Direct printing and writing using undercooled metallic core-shell particlesJun 08, 21Feb 18, 25Iowa State University Research Foundation, Inc.; THE INDIUM CORPORATION OF AMERICA;
12226998 Doctoring unit for a printing apparatusDec 02, 21Feb 18, 25EKRA AUTOMATISIERUNGSSYSTEME GMBH
12232267 Electronics assemblyMar 19, 24Feb 18, 25TACTOTEK OY
12223147 Printed wiringApr 24, 24Feb 11, 25Japan Aviation Electronics Industry Limited
12224081 Conductive paste and electronic deviceNov 23, 21Feb 11, 25BEIJING DREAM INK TECHNOLOGIES CO., LTD.
12209304 Methods for printing metal lines and patterns at high resolutionMar 21, 23Jan 28, 25Reophotonics, Ltd.
12213250 Conductive ink interconnected devicesAug 31, 22Jan 28, 25NCR Voyix Corporation
12202279 Methods of detecting and adjusting contact of a micro-structural fluid ejector to a substrate and method of detecting a fault condition in fluid flow from a micro-structural fluid ejector onto a substrateApr 14, 20Jan 21, 25XTPL S.A.
12207418 Method for manufacturing display panel using inkjet deviceFeb 21, 23Jan 21, 25UNIJET CO., LTD.
12200871 Component-containing substrateMar 08, 23Jan 14, 25Shinko Electric Industries Co. Ltd.
12188892 3D printed microelectrode arraysJan 31, 19Jan 07, 25Carnegie Mellon University

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0108,597 PRINTING SYSTEM AND METHOD FOR CONTROLLING PRINTING SYSTEMSep 25, 24Apr 03, 25Not available
2025/0113,430 TECHNOLOGIES FOR REDUCING THE IMPACT OF RADIOFREQUENCY INTERFERENCE ON A CIRCUIT BOARDNov 17, 23Apr 03, 25Intel Corp.
2025/0100,268 METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING APPARATUS AND PASTE DISPENSING APPARATUS FOR DISPENSING PASTE FOR A PRINTERMar 08, 22Mar 27, 25Not available
2025/0089,154 DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES FOR SHIELDING APPLICATIONSJul 31, 24Mar 13, 25Not available
2025/0089,176 CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAMENov 29, 23Mar 13, 25Not available
2025/0081,349 SECURE ELECTRONIC COMPONENT ASSEMBLYSep 05, 23Mar 06, 25NVIDIA Corporation
2025/0071,893 CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOFDec 15, 22Feb 27, 25AMOSENSE CO., LTD.
2025/0058,572 SUBSTRATE POSITIONING FOR DEPOSITION MACHINENov 07, 24Feb 20, 25Kateeva, Inc.
2025/0060,329 3D Printed Microelectrode ArraysAug 29, 24Feb 20, 25Not available
2025/0063,672 REAL-TIME IN-SITU ADDITIVE CIRCUIT TUNING FOR RF/MICROWAVE ELECTRONICSAug 14, 23Feb 20, 25Not available
2025/0056,731 DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELECTRICAL AND/OR ELECTRONIC CIRCUITSOct 28, 24Feb 13, 25Not available
2025/0056,732 SYSTEMS AND METHODS OF 3D-PRINTING A CIRCUIT BOARD ON A HEAT SINK ASSEMBLY HAVING POWER DEVICES BONDED THERETOOct 28, 24Feb 13, 25Toyota Motor Engineering & Manufacturing North America, Inc.
2025/0033,131 SELF CORRECTING OVEN TECHNOLOGYDec 07, 22Jan 30, 25Not available
2025/0038,416 SHARED APERTURE ANTENNA FOR MEDICAL DEVICESOct 15, 24Jan 30, 25King Fahd University of Petroleum and Minerals
2025/0040,054 TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERNDec 07, 23Jan 30, 25Not available
2025/0040,055 METHOD TO MAKE THIN FILM ELECTRICALLY-CONDUCTIVE PATTERNJul 26, 23Jan 30, 25Not available
2025/0040,060 HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PREPARATION METHOD THEREOFOct 21, 22Jan 30, 25Not available
2025/0013,145 MICROCHANNEL PRINTINGOct 21, 22Jan 09, 25Not available
2025/0008,664 METHOD FOR ESTABLISHING AN ELECTRICAL CONNECTION AND/OR COMMUNICATION LINKAug 05, 22Jan 02, 25Siemens Aktiengesellschaft
2024/0431,038 PRINTING OF MULTILAYER CIRCUITS ON GRAPHICSJun 25, 24Dec 26, 24Not available

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Patents Issued To Date - By Filing Year

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