H05K 3/14

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Class  H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS


Subclass 3/14: Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12170244 High-throughput additively manufactured power delivery vias and tracesJun 26, 20Dec 17, 24Intel Corp.
12156342 Systems and methods for shaping flexible circuits to improve routing and attachmentAug 17, 22Nov 26, 24Aptiv Technologies AG
12148741 Sidewall connections and button interconnects for molded SiPsJun 10, 22Nov 19, 24Apple Inc.
12137519 Planar lightwave circuit structure based on printed circuit board and manufacturing method thereofAug 30, 22Nov 05, 24SOOCHOW UNIVERSITY
12137523 Interface assembly and method for manufacturing interface assemblyJul 17, 24Nov 05, 24TACTOTEK OY
12096562 Interface assembly and method for manufacturing interface assemblyApr 24, 24Sep 17, 24TACTOTEK OY
12075564 Electronic textiles and methods for fabrication thereofAug 29, 22Aug 27, 24Purdue Research Foundation
12068553 Flat conductor connection elementFeb 05, 21Aug 20, 24SAINT - GOBAIN GLASS FRANCE
12027038 Visible components with functional coatingJun 25, 20Jul 02, 24Audi AG
12004299 Interface assembly and method for manufacturing interface assemblyFeb 01, 23Jun 04, 24TACTOTEK OY
11930601 Method for manufacturing printed wiring boardFeb 24, 22Mar 12, 24Ibiden Co. Ltd.
11898008 Substrate for pattern formationJul 27, 18Feb 13, 24DAIKIN INDUSTRIES, LTD.
11895781 Miniaturized impedance sensorsOct 30, 19Feb 06, 24Tula Health, Inc.
11877386 Injection molded article and method for producing sameJan 16, 23Jan 16, 24Nissha Co., Ltd.
11818849 Increasing adhesion of metal-organic interfaces by silane vapor treatmentApr 21, 23Nov 14, 23Yield Engineering Systems, Inc.
11814719 Method of manufacturing deposition mask, intermediate product to which deposition mask is allocated, and deposition maskMar 18, 22Nov 14, 23Dai Nippon Printing Co., Ltd.
11795539 Systems and methods for selectively coating a substrate using shadowing featuresOct 22, 20Oct 24, 23Massachusetts Institute of Technology
11785716 Implantable electrical connecting deviceMay 20, 21Oct 10, 23ALBERT-LUDWIGS-UNIVERSITÄT FREIBURG
11765838 Right angle sidewall and button interconnects for molded SiPsAug 20, 21Sep 19, 23Apple Inc.
11672083 Method of manufacturing composite circuit boardOct 08, 21Jun 06, 23HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.; Avary Holding (Shenzhen) Co., Limited.;

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0033,102 METHOD OF FABRICATING METAL MASKOct 11, 24Jan 30, 25Not available
2024/0357,749 ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGANIC INTERFACESAug 10, 23Oct 24, 24Yield Engineering Systems, Inc.
2024/0276,648 FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE PULSED LIGHT-INDUCED ZINC MASS TRANSFERMar 30, 22Aug 15, 24Not available
2024/0276,650 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOFMay 25, 23Aug 15, 24Not available
2024/0276,653 WIRING BOARD AND WIRING BOARD MANUFACTURING METHODJan 30, 24Aug 15, 24Not available
2024/0251,510 PRINTED WIRING BOARDJan 24, 24Jul 25, 24Ibiden Co. Ltd.
2024/0244,759 Method and System for Generating Spray Patterns, Electronic Device, and Storage MediumApr 11, 22Jul 18, 24VAYO (SHANGHAI) TECHNOLOGY CO., LTD.
2024/0209,492 SYSTEMS AND METHODS FOR SELECTIVELY COATNG A SUBSTRATE USING SHADOWING FEATURESOct 23, 23Jun 27, 24Not available
2024/0188,228 METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM USED FOR IMPLEMENTING THE METHODFeb 14, 24Jun 06, 24Ibiden Co. Ltd.
2023/0156,926 CONTROLLED DEPOSITION METHOD OF A DONOR MATERIAL ONTO A TARGET SURFACE AND PLATE THEREFORApr 01, 21May 18, 23Not available
2023/0095,608 CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICESSep 24, 21Mar 30, 23Intel Corp.
2022/0145,460 Hydrophobic Low-Dielectric-Constant Film and Preparation Method ThereforMay 14, 20May 12, 22Not available
2022/0015,243 METHOD FOR MANUFACTURING EMBEDDED CIRCUIT BOARD, EMBEDDED CIRCUIT BOARD, AND APPLICATIONDec 28, 20Jan 13, 22Not available
2021/0400,817 METHOD AND APPARATUS FOR THE POST-MANUFACTURING ADJUSTMENT OF THE CHARACTERISTIC IMPEDANCE OF PCB TRACES CARRYING HIGH-SPEED DATA SIGNALSJun 19, 20Dec 23, 21Not available
2020/0178,396 METHOD FOR FORMING CIRCUIT PATTERN ON SURFACE OF THREE-DIMENSIONAL STRUCTURENov 27, 19Jun 04, 20Not available
2019/0364,667 METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARDJan 16, 18Nov 28, 19SHINSHU UNIVERSITY; DENKA COMPANY LIMITED;
2018/0332,711 METHOD FOR CREATING PATTERNED COATINGS ON A MOLDED ARTICLE, AND DEVICE FOR CARRYING OUT SAID METHODSep 30, 16Nov 15, 18Not available
2018/0255,646 Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic ApparatusFeb 28, 18Sep 06, 18Not available
2018/0168,026 FLEXIBLE CIRCUIT BOARD, ARRAY SUBSTRATE, FABRICATING METHOD THEREOF, AND DISPLAY APPARATUSAug 23, 16Jun 14, 18Not available
2018/0042,119 STRUCTURE COMPRISING ELECTRICALLY SURFACE CONDUCTIVE LINES AND METHOD FOR MAKING ELECTRICALLY CONDUCTIVE LINES ON A SURFACE OF A STRUCTUREDec 30, 15Feb 08, 18AIRBUS GROUP SAS

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