H05K 3/16

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Description

Class  H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS


Subclass 3/16: Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12171064 Interconnect and method for manufacturing the sameMar 04, 21Dec 17, 24Raytheon Company
12156342 Systems and methods for shaping flexible circuits to improve routing and attachmentAug 17, 22Nov 26, 24Aptiv Technologies AG
12144121 Wiring substrate and method for manufacturing wiring substrateSep 30, 22Nov 12, 24Ibiden Co. Ltd.
12096549 Panel molded electronic assemblies with multi-surface conductive contactsJan 24, 22Sep 17, 24Vicor Corporation
12028989 Method for manufacturing wiring board, and wiring boardJun 13, 22Jul 02, 24501 Toyota Jidosha Kabushiki Kaisha
12004295 Articles including metallized viasDec 03, 20Jun 04, 24Corning Incorporated
11856713 Multilayer resin substrate and method of manufacturing multilayer resin substrateSep 10, 21Dec 26, 23Murata Manufacturing Co Ltd.
11772179 Method for producing a high-temperature resistant lead free solder joint, and high-temperature-resistant lead-free solder jointJun 13, 19Oct 03, 23ENDRESS+HAUSER SE+CO.KG
11665829 Method for manufacturing wiring boardDec 15, 20May 30, 23501 Toyota Jidosha Kabushiki Kaisha
11638346 Component package and printed circuit board for the sameMar 18, 21Apr 25, 23SAMSUNG-ELECTRO-MECHANICS CO. LTD.
11632861 Method for manufacturing embedded circuit board, embedded circuit board, and applicationDec 28, 20Apr 18, 23SHENNAN CIRCUITS CO., LTD.
11490524 Liquid metal-based flexible electronic device and preparation method and use thereofOct 28, 21Nov 01, 22Harbin Institute of Technology
11490528 Method for manufacturing wiring board, and wiring boardSep 11, 20Nov 01, 22501 Toyota Jidosha Kabushiki Kaisha
11324107 Panel molded electronic assemblies with multi-surface conductive contactsDec 06, 19May 03, 22Vicor Corporation
11261520 Roll-to-roll surface treatment device, and film deposition method and film deposition device using sameAug 23, 17Mar 01, 22Sumitomo Metal Mining Co. Ltd.
11246212 Printed circuit board deformable in both length and widthJun 21, 19Feb 08, 22Avary Holding (Shenzhen) Co., Limited.; HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.;
11194179 Wiring on curved surfacesJun 21, 17Dec 07, 21Tectus Corporation
11102891 Method of manufacturing a polymer printed circuit boardFeb 01, 19Aug 24, 21BGT MATERIALS LIMITED
11098401 Method of forming wiring on side portion of substrateJun 24, 19Aug 24, 21TETOS Co., Ltd.
11057996 Circuit board, method of manufacturing circuit board, and electronic deviceJun 04, 19Jul 06, 21FUJITSU INTERCONNECT TECHNOLOGIES LIMITED

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0048,562 WIRING SUBSTRATEJul 30, 24Feb 06, 25Ibiden Co. Ltd.
2025/0008,651 PRINTED WIRING BOARDJun 25, 24Jan 02, 25Ibiden Co. Ltd.
2025/0008,652 PRINTED WIRING BOARDJun 26, 24Jan 02, 25Ibiden Co. Ltd.
2024/0431,031 PRINTED WIRING BOARDJun 20, 24Dec 26, 24Ibiden Co. Ltd.
2024/0407,094 PRINTED WIRING BOARDMay 31, 24Dec 05, 24Ibiden Co. Ltd.
2024/0365,478 CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRCUIT BOARDJul 11, 24Oct 31, 24Not available
2024/0324,103 WIRING SUBSTRATEMar 22, 24Sep 26, 24Ibiden Co. Ltd.
2024/0306,296 WIRING SUBSTRATEMar 08, 24Sep 12, 24Ibiden Co. Ltd.
2024/0306,299 WIRING SUBSTRATEMar 05, 24Sep 12, 24Ibiden Co. Ltd.
2024/0306,312 PRINTED WIRING BOARDMar 07, 24Sep 12, 24Ibiden Co. Ltd.
2024/0274,895 METHOD OF MAKING A BATTERY SENSORApr 21, 22Aug 15, 24Not available
2024/0268,021 PRINTED WIRING BOARDFeb 07, 24Aug 08, 24Ibiden Co. Ltd.
2024/0260,179 PRINTED WIRING BOARDJan 30, 24Aug 01, 24Ibiden Co. Ltd.
2024/0237,232 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING MODULEMay 09, 23Jul 11, 24HANNSTAR DISPLAY CORPORATION
2024/0196,526 WIRING SUBSTRATENov 29, 23Jun 13, 24Ibiden Co. Ltd.
2024/0114,615 METHOD FOR MANUFACTURING WIRING CIRCUIT BOARDSep 15, 20Apr 04, 24Nitto Denko Corporation
2024/0107,684 PRINTED WIRING BOARDSep 27, 23Mar 28, 24Ibiden Co. Ltd.
2024/0107,685 PRINTED WIRING BOARDSep 27, 23Mar 28, 24Ibiden Co. Ltd.
2024/0030,144 WIRING SUBSTRATEJul 24, 23Jan 25, 24Ibiden Co. Ltd.
2024/0032,207 Method for Manufacturing a Sheet with Double-Sided Structured Conducting Layers for Electronic ApplicationsOct 05, 23Jan 25, 24Not available

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Patents Issued To Date - By Filing Year

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