H05K 3/18

Sub-Class

Watch

Stats

Description

Class  H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS


Subclass 3/18: Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12245383 Method of preparing a high density interconnect printed circuit board including microvias filled with copperAug 19, 20Mar 04, 25Atotech Deutschland GmbH & Co. KG
12232273 Printed circuit board and method of fabricating the sameJun 20, 23Feb 18, 25LG INNOTEK CO., LTD.
12219698 Printed circuit board dielectric molding, machining and electrolytic metallizationOct 23, 23Feb 04, 25Infinitum Electric, Inc.
12209304 Methods for printing metal lines and patterns at high resolutionMar 21, 23Jan 28, 25Reophotonics, Ltd.
12160954 Wiring board having a wiring pattern that has a multi-layer structureJul 14, 22Dec 03, 24Shinko Electric Industries Co. Ltd.
12148741 Sidewall connections and button interconnects for molded SiPsJun 10, 22Nov 19, 24Apple Inc.
12144121 Wiring substrate and method for manufacturing wiring substrateSep 30, 22Nov 12, 24Ibiden Co. Ltd.
12144124 Low-roughness surface-treated copper foil with low bending deformation, copper clad laminate comprising same, and printed wiring boardJan 11, 22Nov 12, 24Lotte Energy Materials Corporation
12129567 Plasma treatments for flexures of hard disk drivesMay 06, 16Oct 29, 24Hutchinson Technology Incorporated
12114437 Wiring structure, method for manufacturing same, and semiconductor packageJun 23, 21Oct 08, 24Resonac Corporation
12107327 Wiring board and method for manufacturing wiring boardMay 23, 23Oct 01, 24Dai Nippon Printing Co Ltd.
12108539 Four dimensional printed circuit boardsMay 06, 22Oct 01, 24The Government of the United States of America as represented by the Secretary of the Navy
12101890 Method of manufacturing printed circuit boardJun 27, 22Sep 24, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
12096549 Panel molded electronic assemblies with multi-surface conductive contactsJan 24, 22Sep 17, 24Vicor Corporation
12082335 Superconducting flex circuit boards having metal structures for improved interfacing characteristicsSep 16, 21Sep 03, 24Google LLC
12063748 Catalyzed metal foil and uses thereof to produce electrical circuitsFeb 12, 21Aug 13, 24AVERATEK CORPORATION
12058812 Substrate for a printed wiring boardJan 15, 21Aug 06, 24Sumitomo Electric Industries Ltd.
12035467 Circuit structureJun 27, 23Jul 09, 24Ticona LLC
12028988 Printed wiring boardJun 21, 23Jul 02, 24Ibiden Co. Ltd.
12022621 Printed circuit board and method for manufacturing the sameJul 20, 22Jun 25, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.

more results

Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0106,987 FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRUCTURESep 26, 23Mar 27, 25Cyntec Co. Ltd.
2025/0107,001 COIL DEVICE AND PRINTED WIRING BOARDDec 23, 22Mar 27, 25Sumitomo Electric Printed Circuits, Inc.; Sumitomo Electric Industries Ltd.;
2025/0089,171 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOFMay 23, 24Mar 13, 25SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2025/0089,174 GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICATION OF TAMPER-RESPONDENT SENSORSSep 08, 23Mar 13, 25Not available
2025/0080,074 FILTER PRODUCTION METHOD AND FILTEROct 26, 21Mar 06, 25Not available
2025/0070,003 WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING WIRING BOARDOct 23, 24Feb 27, 25TOPPAN Holdings Inc.
2025/0071,896 CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARDFeb 27, 24Feb 27, 25SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2025/0063,651 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARDDec 21, 22Feb 20, 25Sumitomo Electric Industries Ltd.; Sumitomo Electric Printed Circuits, Inc.;
2025/0056,718 PRINTED WIRING BOARDJul 31, 24Feb 13, 25Ibiden Co. Ltd.
2025/0040,055 METHOD TO MAKE THIN FILM ELECTRICALLY-CONDUCTIVE PATTERNJul 26, 23Jan 30, 25Not available
2025/0031,314 METHOD FOR PRODUCING AN ELECTRICAL CONNECTION FOR A POWER MODULE OF AN AIRCRAFTDec 01, 22Jan 23, 25Not available
2024/0431,035 PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFACE OF THE PRINTED CIRCUIT BOARD FOR THE COB IC CARDJun 17, 24Dec 26, 24Not available
2024/0421,471 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARDAug 26, 24Dec 19, 24DAI NIPPON PRINTING CO., LTD.
2024/0414,849 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARDAug 20, 24Dec 12, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2024/0414,850 CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOFJan 04, 24Dec 12, 24Unimicron Technology Corp.
2024/0414,855 ELECTRONICS MODULE WITH RACEWAY AND SUBMODULESFeb 01, 24Dec 12, 24Not available
2024/0407,086 PRINTED CIRCUIT BOARDJun 07, 23Dec 05, 24Sumitomo Electric Industries Ltd.; Sumitomo Electric Printed Circuits, Inc.;
2024/0407,106 Catalyzed Metal Foil and Uses ThereofAug 12, 24Dec 05, 24Not available
2024/0407,107 METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMICONDUCTORSJun 23, 23Dec 05, 24Not available
2024/0397,609 WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARDMay 08, 24Nov 28, 24Nitto Denko Corporation

more results

Top Owners in This Subclass

Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More

Patents Issued To Date - By Filing Year

Average Time to Issuance