B23K 1/00

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
2024/0123,530 Resistive Heating Wire Termination SystemOct 18, 22Apr 18, 24Not available
2024/0109,157 SOLDER JOINTDec 11, 23Apr 04, 24Fuji Electric Co. Ltd.
2024/0113,067 SOLDER REFLOW APPARATUSApr 19, 23Apr 04, 24Not available
2024/0101,392 ELEVATOR SYSTEM SAFETY BRAKESep 27, 22Mar 28, 24Not available
2024/0106,087 JOINING METHODS AND DEVICES MADE USING SAID METHODSSep 25, 23Mar 28, 24Not available
2024/0082,938 ADDITIVELY DEPOSITING MULTIPLE BRAZE MATERIALSSep 09, 22Mar 14, 24Not available
2024/0087,879 INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORMNov 14, 23Mar 14, 24Not available
2024/0087,915 SEMICONDUCTOR SUBSTRATE BONDING TOOL AND METHODS OF OPERATIONNov 22, 23Mar 14, 24Not available
2024/0075,559 SOLDER MATERIALNov 10, 23Mar 07, 24Fuji Electric Co. Ltd.
2024/0068,135 Fabric with Electrical ComponentsNov 08, 23Feb 29, 24Not available
2024/0071,650 PANE WITH ELECTRIC CONNECTION ELEMENTDec 22, 21Feb 29, 24Not available
2024/0074,065 REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAMEFeb 17, 23Feb 29, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2024/0058,901 BRAZE ALLOY MIX FOR APPLICATION IN A METHOD FOR BRAZING A COMPONENT, ADDITIVE ALLOY, BRAZING METHOD, AND COMPONENTMay 17, 23Feb 22, 24MTU Aero Engines AG
2024/0063,171 ASSEMBLY OF A CHIP TO A SUBSTRATEOct 30, 23Feb 22, 24Not available
2024/0051,051 ULTRA-THIN SOLDERING GASKET AND PREPARATION METHOD THEREFOR, SOLDERING METHOD, AND SEMICONDUCTOR DEVICEDec 13, 21Feb 15, 24NINGBO S J ELECTRONICS CO., LTD.
2024/0052,688 CONNECTING ELEMENT FOR INSULATED GLAZING WITH AN ELECTRICALLY CONDUCTIVE COATING AND/OR ELECTRICALLY CONTROLLABLE FUNCTIONAL ELEMENTFeb 22, 22Feb 15, 24Not available
2024/0055,707 METHOD OF FORMING A BRAZED JOINT HAVING MOLYBDENUM MATERIALOct 26, 23Feb 15, 24Not available
2024/0057,261 MICRO SOLDER JOINT AND STENCIL APERTURE DESIGNOct 24, 23Feb 15, 24Not available
2024/0047,410 SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICEMar 27, 23Feb 08, 24Samsung Electronics Co. Ltd.
2024/0047,411 SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICEMar 28, 23Feb 08, 24Samsung Electronics Co. Ltd.

Showing 1 to 20 of 1134 results