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2024/0106,087 | JOINING METHODS AND DEVICES MADE USING SAID METHODS | Sep 25, 23 | Mar 28, 24 | Not available |
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2024/0075,559 | SOLDER MATERIAL | Nov 10, 23 | Mar 07, 24 | Fuji Electric Co. Ltd. |
2024/0068,135 | Fabric with Electrical Components | Nov 08, 23 | Feb 29, 24 | Not available |
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2024/0074,065 | REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME | Feb 17, 23 | Feb 29, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
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2024/0052,688 | CONNECTING ELEMENT FOR INSULATED GLAZING WITH AN ELECTRICALLY CONDUCTIVE COATING AND/OR ELECTRICALLY CONTROLLABLE FUNCTIONAL ELEMENT | Feb 22, 22 | Feb 15, 24 | Not available |
2024/0055,707 | METHOD OF FORMING A BRAZED JOINT HAVING MOLYBDENUM MATERIAL | Oct 26, 23 | Feb 15, 24 | Not available |
2024/0057,261 | MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN | Oct 24, 23 | Feb 15, 24 | Not available |
2024/0047,410 | SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE | Mar 27, 23 | Feb 08, 24 | Samsung Electronics Co. Ltd. |
2024/0047,411 | SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE | Mar 28, 23 | Feb 08, 24 | Samsung Electronics Co. Ltd. |