| 2024/0150,614 | POSITIVELY CHARGED ABRASIVE WITH NEGATIVELY CHARGED IONIC OXIDIZER FOR POLISHING APPLICATION | Oct 30, 23 | May 09, 24 | Not available |
| 2024/0124,744 | POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME | Sep 27, 22 | Apr 18, 24 | Not available |
| 2024/0117,219 | POLISHING COMPOSITION | Feb 02, 22 | Apr 11, 24 | Not available |
| 2024/0117,218 | POLISHING METHOD AND POLISHING COMPOSITION | Feb 02, 22 | Apr 11, 24 | Not available |
| 2024/0117,220 | CHEMICAL-MECHANICAL POLISHING COMPOSITION FOR HEAVILY-DOPED BORON SILICON FILMS | Oct 09, 23 | Apr 11, 24 | Not available |
| 2024/0110,080 | POLISHING COMPOSITION | Dec 05, 23 | Apr 04, 24 | Not available |
| 2024/0101,866 | POLISHING COMPOSITION, PRODUCTION METHOD OF POLISHING COMPOSITION, POLISHING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE | Sep 20, 23 | Mar 28, 24 | Not available |
| 2024/0101,865 | TUNGSTEN CMP COMPOSITION INCLUDING A SULFUR CONTAINING ANIONIC SURFACTANT | Sep 19, 23 | Mar 28, 24 | Not available |
| 2024/0101,867 | POLISHING METHOD AND POLISHING COMPOSITION | Dec 05, 23 | Mar 28, 24 | Not available |
| 2024/0091,905 | ABRASIVE SLURRY REGENERATION METHOD AND ABRASIVE SLURRY REGENERATION SYSTEM | Aug 24, 23 | Mar 21, 24 | Not available |
| 2024/0084,067 | NOVEL CURABLE COMPOSITION CONTAINING CYCLIC MONOMER | Jan 27, 22 | Mar 14, 24 | Tokuyama Corporation |
| 2024/0084,170 | POLISHING COMPOSITION AND POLISHING METHOD | Jan 26, 22 | Mar 14, 24 | Not available |
| 2024/0084,171 | ORGANIC LAYER POLISHING COMPOSITION AND METHOD FOR POLISHING USING SAME | Nov 17, 23 | Mar 14, 24 | Not available |
| 2024/0076,521 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | Sep 05, 23 | Mar 07, 24 | Not available |
| 2024/0052,201 | METHODS AND MATERIALS FOR POLISHING OF MATERIALS | Aug 09, 23 | Feb 15, 24 | Not available |
| 2024/0052,203 | POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME | Nov 10, 21 | Feb 15, 24 | Fujimi Incorporated |
| 2024/0052,202 | POLISHING COMPOSITION AND METHOD OF POLISHING SILICON WAFER | Nov 17, 21 | Feb 15, 24 | Not available |
| 2024/0043,718 | POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESSING,METHOD FOR PREPARING POLISHING COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT TO WHICH POLISHING COMPOSITION IS APPLIED | Oct 18, 21 | Feb 08, 24 | Not available |
| 2024/0043,719 | POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESSING,METHOD FOR PREPARING POLISHING COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT TO WHICH POLISHING COMPOSITION IS APPLIED | Oct 18, 21 | Feb 08, 24 | Not available |
| 2024/0043,720 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING SUBSTRATE | Oct 06, 23 | Feb 08, 24 | Not available |