B23K 1/005

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Showing 1 to 20 of 124 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9979251 Substrate manufactured from sheet metal and resin, motor provided with substrate, and soldering method thereforMar 01, 16May 22, 18FANUC CORPORATION
9975195 Arrangement and method for the reproducible application of small amounts of liquidJul 17, 14May 22, 18Pac Tech - Packaging Technologies GmbH
9951692 Support structure for a gas turbine engineDec 23, 11Apr 24, 18GKN AEROSPACE SWEDEN AB
9926619 Aluminum alloyApr 28, 16Mar 27, 18Novelis Inc.
9919374 Robotic gripper sensorOct 09, 15Mar 20, 18TE CONNECTIVITY CORPORATION
9919372 Heat-bonding apparatus and method of manufacturing heat-bonded productsJan 09, 14Mar 20, 18ORIGIN ELECTRIC COMPANY, LIMITED
9908194 Method for establishing a permanent bond between a ferrous alloy and an aluminium or an aluminium alloyApr 09, 14Mar 06, 18THALES
9881744 Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bondsFeb 28, 14Jan 30, 18KEMET ELECTRONICS CORPORATION
9869182 Turbine rotor for an exhaust gas turbine and method for producing the turbine rotorMar 20, 13Jan 16, 18CONTINENTAL AUTOMOTIVE GMBH
9855618 Functionalized metal oxide soldering methods and UV sensor manufactured thereofFeb 16, 15Jan 02, 18KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
9849533 Hybrid diffusion-brazing process and hybrid diffusion-brazed articleMay 30, 13Dec 26, 17GENERAL ELECTRIC COMPANY
9841609 Assembly methods of a SMA assembly and an OIS deviceJun 28, 16Dec 12, 17SAE MAGNETICS (H.K.) LTD.
9803781 Joint structure for metallic pipesDec 22, 11Oct 31, 17DAIKIN INDUSTRIES, LTD.
9796042 Material joining head assemblyAug 08, 13Oct 24, 17GM GLOBAL TECHNOLOGY OPERATIONS LLC
9793057 Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bondMay 09, 16Oct 17, 17KEMET ELECTRONICS CORPORATION
9768141 Removal apparatuses for semiconductor chipsFeb 26, 15Sep 19, 17SAMSUNG ELECTRONICS CO., LTD.
9706665 Device for assembling a chip on a substrate by providing a solder-forming massJun 25, 14Jul 11, 17VALEO ETUDES ELECTRONIQUES
9694442 Apparatus and method for forming electrical solder connections in a disk drive unitMay 14, 12Jul 04, 17SAE MAGNETICS (H.K.) LTD.
9683682 Methods and systems of joining pipesMar 15, 13Jun 20, 17LINCOLN GLOBAL, INC.
9685423 Semiconductor chip assembly and method for manufacturing the sameJan 22, 14Jun 20, 17PAC TECH - PACKAGING TECHNOLOGIES GMBH, PAC Tech—Packaging Technologies GmbH,

Showing 1 to 20 of 124 results