2024/0124,954 | PURE COPPER PLATE | Mar 08, 21 | Apr 18, 24 | Mitsubishi Materials Corporation |
2024/0124,955 | HOT-ROLLED COPPER ALLOY SHEET AND SPUTTERING TARGET | Feb 08, 22 | Apr 18, 24 | Mitsubishi Materials Corporation |
2024/0124,956 | TiAl ALLOY MATERIAL AND TiAl INTERMEDIATE ALLOY MATERIAL | Oct 10, 23 | Apr 18, 24 | Kabushiki Kaisha Kobe Seiko Sho ( Kobe Steel Ltd); Japan represented by President of Tokyo Institute of Technology; |
2024/0124,958 | NICKEL-RUTHENIUM-BASED TERNARY OR GREATER ALLOYS, PRODUCTS COMPRISING THE SAME, AND METHODS OF MAKING AND USING THE SAME | Oct 02, 23 | Apr 18, 24 | Not available |
2024/0117,473 | ALUMINUM ALLOY SHEET, METHOD FOR MANUFACTURING SAME, AND HEAT EXCHANGER | Jan 06, 22 | Apr 11, 24 | UACJ CORPORATION |
2024/0117,472 | NICKEL-BASE ALLOY | Jun 28, 23 | Apr 11, 24 | Not available |
2024/0110,262 | AI WIRING MATERIAL | Jan 31, 22 | Apr 04, 24 | Not available |
2024/0110,263 | HIGH-ENTROPY ALLOY AND MANUFACTURING METHOD THEREFOR | Oct 04, 23 | Apr 04, 24 | Not available |
2024/0110,268 | SYSTEM AND METHOD FOR HEATING A PART | Nov 27, 23 | Apr 04, 24 | Not available |
2024/0110,269 | DEGRADABLE MAGNESIUM ALLOY | Oct 16, 20 | Apr 04, 24 | Not available |
2024/0110,270 | METHOD FOR HEAT TREATING COMPONENTS | Oct 06, 23 | Apr 04, 24 | Not available |
2024/0100,634 | LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME, SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, AND METHOD OF MANUFACTURING SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION | Sep 19, 23 | Mar 28, 24 | Research & Business Foundation Sungkyunkwan University |
2024/0102,141 | METHOD OF MANUFACTURING 2XXX-SERIES ALUMINUM ALLOY PRODUCTS | Nov 19, 21 | Mar 28, 24 | c/o Novelis Koblenz GmbH |
2024/0105,667 | ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR | Jan 25, 22 | Mar 28, 24 | TANAKA DENSHI KOGYO K.K.; Mitsubishi Electric Corporation; |
2024/0093,332 | FREE-CUTTING COPPER ALLOY AND METHOD FOR MANUFACTURING FREE-CUTTING COPPER ALLOY | Nov 30, 20 | Mar 21, 24 | Mitsubishi Materials Corporation |
2024/0093,339 | HIGH-ENTROPY AUSTENITIC STAINLESS STEEL AND PREPARATION METHOD THEREOF | Oct 31, 22 | Mar 21, 24 | Yanshan University |
2024/0084,428 | TISSUE EXERCISING AND STIMULATING BIOREACTOR | Dec 09, 22 | Mar 14, 24 | Not available |
2024/0076,768 | FINE GRAINED PURE TITANIUM AND MANUFACTURING METHOD THEREFOR | Mar 07, 22 | Mar 07, 24 | Not available |
2024/0076,763 | HEAT-RESISTANT ALLOY, HEAT-RESISTANT ALLOY POWDER, HEAT-RESISTANT ALLOY STRUCTURAL COMPONENT, AND MANUFACTURING METHOD OF THE SAME | Oct 27, 23 | Mar 07, 24 | Tokyo Metropolitan Public University Corporation; National University Corporation Hokkaido University; |
2024/0076,767 | HIGH STRENGTH, SAG RESISTANT ALUMINUM ALLOYS FOR USE AS FIN STOCK AND METHODS OF MAKING THE SAME | Jan 12, 22 | Mar 07, 24 | Novelis Inc. |