B28D 1/06

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Showing 1 to 20 of 87 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9873159 Systems and methods for manufacturing diamond coated wiresDec 30, 15Jan 23, 18CORNER STAR LIMITED
9873178 Rotary gear transmission for toolsOct 09, 14Jan 23, 18ARBORTECH INDUSTRIES LIMITED
9868226 Stone cutting deviceJun 10, 14Jan 16, 18EHWA DIAMOND INDUSTRIAL CO., LTD.
9533397 Abrasive article and method of formingJun 28, 13Jan 03, 17SAINT-GOBAIN ABRASIFS, SAINT-GOBAIN ABRASIVES, INC,
9266253 Electric double-blade slot cutting machineJun 19, 13Feb 23, 16Hammer Electric Power Tools Co., Ltd.
9140333 Saw gear boxJan 23, 13Sep 22, 15MERIT ENGINEERING & EQUIPMENT COMPANY
8973566 Workpiece for frame gang saw, method for cutting the workpiece, and product cut by the methodDec 23, 09Mar 10, 15EHWA DIAMOND INDUSTRIAL CO., LTD.
8968054 Method for cooling a workpiece made of semiconductor material during wire sawingDec 30, 11Mar 03, 15SILTRONIC AG
8844511 Method for slicing a multiplicity of wafers from a crystal composed of semiconductor materialJan 20, 11Sep 30, 14SILTRONIC AG
8820309 Methods, wires, and apparatus for slicing hard materialsSep 19, 12Sep 02, 14UNIVERSITY OF SOUTH CAROLINA
8746961 Method, apparatus, system and heat exchanger for increasing the temperature of a substance which is initially in an at least partly solidified state in a containerApr 20, 05Jun 10, 14AAK DENMARK A/S
8734005 Method, apparatus, system and heat exchanger for increasing the temperature of a substance which is initially in an at least partly solidified state in a containerJun 28, 11May 27, 14AAK DENMARK A/S, Aarbuskarlshamn Denmark A/S,
8677986 Electrodeposited wire tool and manufacturing method thereofApr 08, 09Mar 25, 14A.L.M.T. CORP.
8534275 Wire saw deviceAug 13, 10Sep 17, 13SUMCO CORPORATION
8356590 Method and product for cutting materialsFeb 03, 10Jan 22, 13THE NANOSTEEL COMPANY, INC., Tha NanoSteel Company, Inc.,
8286623 Band saw cutting apparatus and ingot cutting methodAug 12, 09Oct 16, 12SHIN-ETSU HANDOTAI CO., LTD.
8261730 In-situ wafer processing system and methodJan 28, 09Sep 11, 12Cambridge Energy Resources Inc
8256407 Multi-wire saw and method for cutting ingotJun 27, 07Sep 04, 12MITSUBISHI ELECTRIC CORPORATION
8062100 Water supply for a hand-held power toolAug 06, 09Nov 22, 11ANDREAS STIHL AG & CO. KG
8056550 Block-cutting gangsaw for cutting granite or other hard materials, and corresponding cutting methodAug 06, 07Nov 15, 11Q.R.B.G. S.R.L.

Showing 1 to 20 of 87 results