| RE49987 | Multiple plated via arrays of different wire heights on a same substrate | Apr 20, 22 | May 28, 24 | Invensas LLC |
| RE47767 | Group III-nitride layers with patterned surfaces | Dec 23, 15 | Dec 17, 19 | Nokia of America Corporation |
| 9994440 | MEMS device and process | Jun 30, 14 | Jun 12, 18 | Cirrus Logic, Inc. |
| 9998812 | Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals | Feb 15, 16 | Jun 12, 18 | Infineon Technologies AG |
| 9994439 | Pressure sensor, manufacturing method of pressure sensor, altimeter, electronic apparatus, and moving object | Jan 27, 17 | Jun 12, 18 | Seiko Epson Corporation |
| 9994441 | Optical electronic device and method of fabrication | Oct 31, 16 | Jun 12, 18 | Agilent Technologies Texas Instruments Incorporated |
| 9988260 | Rough MEMS surface | Apr 29, 16 | Jun 05, 18 | NXP USA, Inc. |
| 9988261 | Micromechanical device and method for manufacturing a micromechanical device | Jun 13, 13 | Jun 05, 18 | 502 Robert Bosch GmbH |
| 9988265 | Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation | Aug 22, 16 | Jun 05, 18 | Semiconductor Manufacturing International (Shanghai) Corporation |
| 9991251 | Semiconductor device | Jun 02, 17 | Jun 05, 18 | Murata Manufacturing Co., Ltd. |
| 9983169 | Integrated microfluidic circuit with electrowetting-based operation and corresponding microfluidic system | Sep 17, 14 | May 29, 18 | SMI STMicroelectronics S.r.l |
| 9983401 | MEMS device | May 16, 16 | May 29, 18 | Intel Corp. |
| 9981841 | MEMS integrated pressure sensor and microphone devices and methods of forming same | May 15, 17 | May 29, 18 | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 9981273 | Negative dielectrophoresis for selective elution of immuno-bound particles | Sep 30, 13 | May 29, 18 | The Board of Trustees of the Leland Stanford Junior University |
| 9983403 | Device and method for micro-electro-mechanical-system photonic switch | Oct 03, 14 | May 29, 18 | HUAWEI TECHNOLOGIES CO., LTD. |
| 9981267 | Paired laser and electrokinetic separation, manipulation, and analysis device | Jun 15, 16 | May 29, 18 | The Goverment of the United States of America as represented by the Secretary of the Navy |
| 9986344 | MEMS microphone with low pressure region between diaphragm and counter electrode | Nov 06, 15 | May 29, 18 | Infineon Technologies AG |
| 9975757 | Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devices | Jun 03, 15 | May 22, 18 | Taiwan Semiconductor Manufacturing Co Ltd. |
| 9975762 | Stacked semiconductor structure and method of forming the same | Jun 12, 13 | May 22, 18 | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 9975758 | Wafer processing equipment having exposable sensing layers | Jul 13, 17 | May 22, 18 | Applied Materials Inc. |