C09J 1/00

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Showing 1 to 20 of 53 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
RE47418 Optical connectors with inorganic adhesives and methods for making the sameJul 17, 17Jun 04, 19Corning Optical Communications LLC
9994489 Bonding dissimilar ceramic componentsDec 30, 14Jun 12, 18The Boeing Company
9988558 Repulpable adhesivesSep 16, 09Jun 05, 18tesa SE
9976058 High temperature seal compositions and methods of using sameMay 29, 15May 22, 18Palo Alto Research Center Incorporated
9969905 Transient liquid phase (TLP) bonding of nickel based alloys by forming an aluminum-titanium coating and subsequent heat treatmentJan 08, 15May 15, 18Northwestern University
9771268 Nano-diamond dispersion solution and method for preparing sameJul 01, 15Sep 26, 17NEOENBIZ
9688887 Pressure-sensitive adhesives including expandable graphiteFeb 06, 15Jun 27, 17FIRESTONE BUILDING PRODUCTS COMPANY, LLC
9683135 Pressure-sensitive adhesives including expandable graphiteNov 07, 13Jun 20, 17FIRESTONE BUILDING PRODUCTS COMPANY, LLC
9481813 Bonding material composition, aluminum nitride bonded body, and method for producing the sameDec 05, 14Nov 01, 16NGK INSULATORS, LTD.
9475964 Joining a thermoplastic material and a metalDec 28, 15Oct 25, 16THE BOEING COMPANY
9365592 Bonding compositionOct 03, 13Jun 14, 16BANDO CHEMICAL INDUSTRIES, LTD.
9086548 Optical connectors with inorganic adhesives and methods for making the sameSep 30, 13Jul 21, 15CORNING OPTICAL COMMUNICATIONS LLC
8926787 Surface-modified film, process for producing same, and laminated film and process for producing sameSep 17, 10Jan 06, 15STELLA CHEMIFA CORPORATION
8920595 Formaldehyde free binder compositions for fibrous materialsJan 04, 13Dec 30, 14JOHNS MANVILLE
8876409 Optical deviceMar 18, 11Nov 04, 14OLYMPUS CORPORATION
8871661 Bonding materialSep 07, 10Oct 28, 14Sophia Product Co.
8865483 Substrate processing apparatus and substrate processing methodAug 01, 13Oct 21, 14TOKYO ELECTRON LIMITED
8308892 Di-cinnamyl compounds and methods for use thereofApr 09, 09Nov 13, 12DESIGNER MOLECULES, INC.
8017661 Inorganic anion exchanger composed of bismuth compound and resin composition for electronic component encapsulation using the sameNov 16, 07Sep 13, 11TOAGOSEI CO., LTD.
8003224 Method for producing cellulose acylate composition and cellulose acylate filmJun 26, 07Aug 23, 11FUJIFILM CORPORATION

Showing 1 to 20 of 53 results