C22C 5/08

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9960140 Metal joining structure using metal nanoparticles and metal joining method and metal joining materialNov 11, 14May 01, 18Nippon Steel & Sumitomo Metal Corporation; Waseda University;
9961791 Seal ring and method for manufacturing seal ringJan 15, 13May 01, 18Hitachi Metals LTD
9812421 Bonding wire for semiconductor devicesDec 04, 14Nov 07, 17NIPPON MICROMETAL CORPORATION, NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.,
9780011 Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor moduleJul 02, 12Oct 03, 17HITACHI METALS, LTD.
9731384 Methods and compositions for brazingDec 29, 14Aug 15, 17BAKER HUGHES INCORPORATED
9732401 Solid metal alloyNov 16, 12Aug 15, 17M. TECHNIQUE CO., LTD.
9721694 Fine silver particle powder, method for manufacturing the same, silver paste using the powder and method of use of the pasteApr 03, 15Aug 01, 17DOWA ELECTRONICS MATERIALS CO., LTD.
9722201 Organic electroluminescence device and method of manufacturing the sameDec 14, 15Aug 01, 17SONY CORPORATION
9708691 Process for investment casting and casting grain for use in the processFeb 28, 11Jul 18, 17ARGENTIUM INTERNATIONAL LIMITED
9708692 Sliding bearingApr 07, 09Jul 18, 17KS Gleitlager GmbH, MIBA GLEITLAGER AUSTRIA GMBH,
9663849 Fancy color silver containing alloysSep 16, 16May 30, 17LEACHGARNER, INC.
9666382 Silver and copper alloyed rivet contactDec 13, 13May 30, 17TANAKA KIKINZOKU KOGYO K.K.
9657378 Pink colored silver containing alloysMay 06, 14May 23, 17LEACHGARNER, INC.
9576693 Metal material for electronic component and method for manufacturing the sameSep 10, 12Feb 21, 17JX NIPPON MINING & METALS CORPORATION
9570207 Electrical contact materials and method for preparing the sameNov 06, 14Feb 14, 17LSIS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY,
9543266 Bonding wire for semiconductor device use and method of production of sameMar 31, 15Jan 10, 17NIPPON MICROMETAL CORPORATION, NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.,
9536854 Bonding wire for semiconductor device use and method of production of sameMar 31, 15Jan 03, 17NIPPON MICROMETAL CORPORATION, NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.,
9375811 Active metal brazing materialMay 21, 12Jun 28, 16TANAKA KIKINZOKU KOGYO K.K.
9293232 Composite conductor and electric wire using the sameDec 06, 12Mar 22, 16DYDEN CORPORATION, FUKUOKA PREFECTURAL GOVERNMENT, KUMAMOTO UNIVERSITY,
9267191 Reversibly age hardenable, palladium containing tarnish resistant sterling silver alloysOct 03, 13Feb 23, 16RICHLINE GROUP, INC.

Showing 1 to 20 of 80 results