C23F 1/26

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Showing 1 to 20 of 35 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9757212 Titanium nano-scale etching on an implant surfaceMar 10, 16Sep 12, 17BIOMET 3I, LLC
9751265 Method for preparing a composite of metal and resinJan 05, 15Sep 05, 17TAISEI PLAS CO., LTD.
9741827 Etchant and method of manufacturing display device by using the sameOct 07, 14Aug 22, 17DONGWOO FINE-CHEM CO., LTD.
9677002 Etching compositionOct 09, 15Jun 13, 17SAMSUNG ELECTRONICS CO., LTD.
9644274 Etching solution for copper or a compound comprised mainly of copperJun 28, 12May 09, 17MITSUBISHI GAS CHEMICAL COMPANY, INC.
9605349 Decreasing bacterial responses on nano-modified titaniumDec 15, 14Mar 28, 17HOWMEDICA OSTEONICS CORP.
9580818 Etching liquid for film of multilayer structure containing copper layer and molybdenum layerMay 27, 11Feb 28, 17MITSUBISHI GAS CHEMICAL COMPANY, INC.
9530670 Methods of forming conductive patterns and methods of manufacturing semiconductor devices using the same using an etchant composition that includes phosphoric acid, nitric acid, and an assistant oxidantSep 22, 14Dec 27, 16SAMSUNG ELECTRONICS CO., LTD., SOULBRAIN CO., LTD.,
9481934 Method of removing work-affected layerMar 12, 13Nov 01, 16MITSUBISHI HEAVY INDUSTRIES AERO ENGINES, LTD.
9466508 Liquid composition used in etching multilayer film containing copper and molybdenum, manufacturing method of substrate using said liquid composition, and substrate manufactured by said manufacturing methodApr 09, 14Oct 11, 16MITSUBISHI GAS CHEMICAL COMPANY, INC.
9455283 Etch chemistries for metallization in electronic devicesMar 03, 15Sep 27, 16H.C. STARCK INC., Daetec, LLC,
9388063 Methods for manufacturing molded glass object and upper moldOct 19, 09Jul 12, 16KONICA MINOLTA OPTO, INC.
9365770 Etching solution for copper/molybdenum-based multilayer thin filmJul 25, 12Jun 14, 16MITSUBISHI GAS CHEMICAL COMPANY, INC.
9365934 Liquid composition used in etching copper- and titanium-containing multilayer film, etching method in which said composition is used, method for manufacturing multilayer-film wiring, and substrateMar 31, 14Jun 14, 16MITSUBISHI GAS CHEMICAL COMPANY, INC.
9347125 Etchant composition and method of forming metal wire and thin film transistor array panel using the sameMay 29, 15May 24, 16DONGWOO FINE-CHEM CO., LTD., SAMSUNG DISPLAY CO., LTD.,
9343408 solutionNov 08, 13May 17, 16GLOBALFOUNDRIES INC., INTERMOLECULAR, INC.,
9330937 Etching of semiconductor structures that include titanium-based layersNov 13, 13May 03, 16INTERMOLECULAR, INC.
9308153 Method for the preparation of surfaces of dental or orthopedic implantsSep 15, 14Apr 12, 16BORROZZINO, CARLO, RUGERI, FURIO, Ruggeri, Furio,
9293565 Etchant composition and method of manufacturing metal wiring and thin film transistor substrate using the etchantDec 09, 13Mar 22, 16DONGWOO FINE-CHEM CO., LTD., SAMSUNG DISPLAY CO., LTD.,
9287228 Method for etching semiconductor structures and etching composition for use in such a methodJun 26, 14Mar 15, 16LAM RESEARCH AG

Showing 1 to 20 of 35 results