C25D 1/22

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9930776 Ultrathin copper foil and method of manufacturing the same, and ultrathin copper layerDec 25, 12Mar 27, 18JX Nippon Mining & Metals Corporation
9821494 Mold release treatment method and method for producing anti-reflective filmMar 25, 13Nov 21, 17SHARP KABUSHIKI KAISHA
9806299 Cathode for thin film microbatteryJul 24, 14Oct 31, 17INTERNATIONAL BUSINESS MACHINES CORPORATION
9472789 Thin, flexible microsystem with integrated energy sourceJul 24, 14Oct 18, 16INTERNATIONAL BUSINESS MACHINES CORPORATION
6610418 Electolytic copper foil with carrier foil and method for manufacturing the sameNov 07, 01Aug 26, 03MITSUI MINING & SMELTING CO., LTD.
4564423 Permanent mandrel for making bumped tapes and methods of formingNov 28, 84Jan 14, 86GENERAL DYNAMICS CORPORATION
4363705 Passivating and silver removal methodJul 16, 81Dec 14, 82Capitol Records, Inc.