G01R 1/073

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Showing 1 to 20 of 703 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9995770 Multidirectional semiconductor arrangement testingMar 21, 14Jun 12, 18Taiwan Semiconductor Manufacturing Company Limited
9989558 Probe head assemblies, components thereof, test systems including the same, and methods of operating the sameDec 17, 15Jun 05, 18Cascade Microtech, Inc.
9983230 Probe pin and manufacturing method thereofFeb 23, 16May 29, 18Not available
9983231 Deep-etched multipoint probeJun 20, 13May 29, 18Capres A/S
9983232 Prober for testing devices in a repeat structure on a substrateSep 19, 14May 29, 18Cascade Microtech, Inc.
9977054 Etching for probe wire tips for microelectronic device testJun 15, 15May 22, 18Intel Corp.
9977053 Wafer probe alignmentJun 08, 16May 22, 18IBM Corporation
9970961 Probe card for testing wafers with fine pitch circuitJul 21, 16May 15, 18Hermes-Epitek Corp.
9972933 Contact probeAug 11, 17May 15, 18Japan Electronic Materials Corporation
9958475 Test device and test method using the sameFeb 25, 16May 01, 18BOE TECHNOLOGY GROUP CO., LTD; BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.;
9952255 Magnetically shielded probe cardOct 30, 15Apr 24, 18Agilent Technologies Texas Instruments Incorporated
9952279 Apparatus for three dimensional integrated circuit testingDec 21, 12Apr 24, 18Taiwan Semiconductor Manufacturing Company, Ltd.
9947457 Pre space transformer, space transformer manufactured using the pre space transformer, and semiconductor device inspecting apparatus including the space transformerFeb 27, 17Apr 17, 18SEMCNS CO., LTD
9941652 Space transformer with perforated metallic plate for electrical die testDec 17, 15Apr 10, 18Intel Corp.
9933457 Device for testing electronic componentsMar 10, 15Apr 03, 18Multitest elektronische Systeme GmbH
9933478 Probe card and having opposite surfaces with different directions and test apparatus including probe card thereofMar 04, 16Apr 03, 18TOSHIBA MEMORY CORPORATION
9935024 Method for forming semiconductor structureOct 07, 16Apr 03, 18Taiwan Semiconductor Manufacturing Co., Ltd.
9933455 Known good die testing for high frequency applicationsMay 04, 15Apr 03, 18QUALCOMM Incorporated
9927487 Probe card having configurable structure for exchanging or swapping electronic components for impedance matchingDec 18, 13Mar 27, 18MPI Corporation
9927463 Wafer probe alignmentOct 20, 15Mar 27, 18IBM Corporation

Showing 1 to 20 of 703 results