9995770 | Multidirectional semiconductor arrangement testing | Mar 21, 14 | Jun 12, 18 | Taiwan Semiconductor Manufacturing Company Limited |
9989558 | Probe head assemblies, components thereof, test systems including the same, and methods of operating the same | Dec 17, 15 | Jun 05, 18 | Cascade Microtech, Inc. |
9983230 | Probe pin and manufacturing method thereof | Feb 23, 16 | May 29, 18 | Not available |
9983231 | Deep-etched multipoint probe | Jun 20, 13 | May 29, 18 | Capres A/S |
9983232 | Prober for testing devices in a repeat structure on a substrate | Sep 19, 14 | May 29, 18 | Cascade Microtech, Inc. |
9977054 | Etching for probe wire tips for microelectronic device test | Jun 15, 15 | May 22, 18 | Intel Corp. |
9977053 | Wafer probe alignment | Jun 08, 16 | May 22, 18 | IBM Corporation |
9970961 | Probe card for testing wafers with fine pitch circuit | Jul 21, 16 | May 15, 18 | Hermes-Epitek Corp. |
9972933 | Contact probe | Aug 11, 17 | May 15, 18 | Japan Electronic Materials Corporation |
9958475 | Test device and test method using the same | Feb 25, 16 | May 01, 18 | BOE TECHNOLOGY GROUP CO., LTD; BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.; |
9952255 | Magnetically shielded probe card | Oct 30, 15 | Apr 24, 18 | Agilent Technologies Texas Instruments Incorporated |
9952279 | Apparatus for three dimensional integrated circuit testing | Dec 21, 12 | Apr 24, 18 | Taiwan Semiconductor Manufacturing Company, Ltd. |
9947457 | Pre space transformer, space transformer manufactured using the pre space transformer, and semiconductor device inspecting apparatus including the space transformer | Feb 27, 17 | Apr 17, 18 | SEMCNS CO., LTD |
9941652 | Space transformer with perforated metallic plate for electrical die test | Dec 17, 15 | Apr 10, 18 | Intel Corp. |
9933457 | Device for testing electronic components | Mar 10, 15 | Apr 03, 18 | Multitest elektronische Systeme GmbH |
9933478 | Probe card and having opposite surfaces with different directions and test apparatus including probe card thereof | Mar 04, 16 | Apr 03, 18 | TOSHIBA MEMORY CORPORATION |
9935024 | Method for forming semiconductor structure | Oct 07, 16 | Apr 03, 18 | Taiwan Semiconductor Manufacturing Co., Ltd. |
9933455 | Known good die testing for high frequency applications | May 04, 15 | Apr 03, 18 | QUALCOMM Incorporated |
9927487 | Probe card having configurable structure for exchanging or swapping electronic components for impedance matching | Dec 18, 13 | Mar 27, 18 | MPI Corporation |
9927463 | Wafer probe alignment | Oct 20, 15 | Mar 27, 18 | IBM Corporation |