| 9991138 | Etching method and etching apparatus | Jul 25, 16 | Jun 05, 18 | Tokyo Electron Limited |
| 9992874 | Metal foil with carrier | Mar 10, 09 | Jun 05, 18 | JX Nippon Mining & Metals Corporation |
| 9992873 | Method of manufacturing a package substrate | Dec 14, 15 | Jun 05, 18 | Qi Ding Technology Qinhuangdao Co., Ltd.; Zhen Ding Technology Co., Ltd.; |
| 9986636 | Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boards | Mar 31, 17 | May 29, 18 | Infineon Technologies AG |
| 9981450 | Copper foil composite, formed product and method of producing the same | Jan 13, 12 | May 29, 18 | JX Nippon Mining & Metals Corporation |
| 9980371 | Printed wiring board | Feb 16, 16 | May 22, 18 | IBIDEN CO., LTD. |
| 9974193 | Coating metal foil with N-heterocyclic carbene compounds containing organic functionalities for improving metal-to-resin adhesion | Sep 30, 15 | May 15, 18 | International Business Machine Corporation |
| 9974189 | Method and system of producing a multilayer element and multilayer element | Aug 08, 14 | May 15, 18 | 3D-Micromac AG |
| 9965123 | Method of manufacturing touch panel | Dec 28, 15 | May 08, 18 | SAMSUNG DISPLAY CO., LTD. |
| 9967976 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Dec 21, 15 | May 08, 18 | SUMITOMO ELECTRIC INDUSTRIES, LTD.; SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.; |
| 9965998 | Method for printing an electronic label | Sep 17, 15 | May 08, 18 | Eastman Kodak Company |
| 9967974 | Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon | Apr 17, 14 | May 08, 18 | LG Chem Ltd. |
| 9961784 | Manufacturing method of circuit substrate | Mar 31, 17 | May 01, 18 | SUBTRON TECHNOLOGY CO. LTD. |
| 9955588 | Multilayer carrier foil | Nov 28, 16 | Apr 24, 18 | Chang Chun Petrochemical Co. Ltd. |
| 9955583 | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board | Jul 23, 14 | Apr 24, 18 | JX Nippon Mining & Metals Corporation |
| 9955574 | Copper foil composite, formed product and method of producing the same | Jan 13, 12 | Apr 24, 18 | JX Nippon Mining & Metals Corporation |
| 9955580 | Method of manufacturing rigid-flexible printed circuit board | Aug 04, 16 | Apr 24, 18 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 9944565 | Metal/ceramic bonding substrate and method for producing same | Nov 20, 12 | Apr 17, 18 | Dowa Metaltech Co., Ltd.; Tokuyama Corporation; |
| 9949372 | Printed wiring board and method for manufacturing the same | Feb 24, 17 | Apr 17, 18 | Ibiden Co. Ltd. |
| 9947749 | Thin film compositions and methods | Nov 13, 14 | Apr 17, 18 | Cornell University |