H05K 3/04

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Showing 1 to 20 of 82 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9996788 Method and apparatus for producing an electronic deviceAug 13, 15Jun 12, 18R.R. Donnelley & Sons Company
9999134 Self-decap cavity fabrication process and structureMar 25, 16Jun 12, 18Multek Technologies Limited
9992873 Method of manufacturing a package substrateDec 14, 15Jun 05, 18Qi Ding Technology Qinhuangdao Co., Ltd.; Zhen Ding Technology Co., Ltd.;
9982348 Method of forming patterned metal unit, and patterned article formed with the sameOct 16, 15May 29, 18Taiwan Green Point Enterprises Co. Ltd.
9980394 Bonding electronic components to patterned nanowire transparent conductorsJul 18, 14May 22, 183M Innovative Properties Company
9974189 Method and system of producing a multilayer element and multilayer elementAug 08, 14May 15, 183D-Micromac AG
9920415 Mitigation and elimination of tin whiskersOct 29, 12Mar 20, 18INTERNATIONAL BUSINESS MACHINES CORPORATION
9903906 Flexible circuit board and cutting deviceJun 16, 16Feb 27, 18BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.,
9899123 Nanowires-based transparent conductorsApr 04, 08Feb 20, 18CAM HOLDING CORPORATION
9855783 Electronic deviceJul 15, 11Jan 02, 18NOVALIA LTD.
9807871 Electronic assembly with fiducial marks for precision registration during subsequent processing stepsAug 11, 14Oct 31, 173M INNOVATIVE PROPERTIES COMPANY
9775236 Method of manufacturing a transparent substrateMar 07, 14Sep 26, 17LG CHEM, LTD.
9766732 Printing of multiple inks to achieve precision registration during subsequent processingJun 05, 15Sep 19, 173M INNOVATIVE PROPERTIES COMPANY
9763332 Support body, method of manufacturing support body, method of manufacturing wiring board, method of manufacturing electronic component, and wiring structureNov 11, 15Sep 12, 17SHINKO ELECTRIC INDUSTRIES CO., LTD.
9754712 Embedded magnetic components and methodsDec 09, 15Sep 05, 17RADIAL ELECTRONICS, INC.
9728697 Light emitting device including a metal substrate for high heat dissipation and increased light efficiencyOct 01, 14Aug 08, 17SHARP KABUSHIKI KAISHA
9728705 Metallization having high power compatibility and high electrical conductivitySep 28, 15Aug 08, 17QUALCOMM INCORPORATED, SNAPTRACK, INC.,
9723726 Film composite having electrical functionality for applying to a substrateFeb 25, 15Aug 01, 17SCHREINER GROUP GMBH & CO. KG
9644253 Mitigation and elimination of tin whiskersNov 05, 13May 09, 17INTERNATIONAL BUSINESS MACHINES CORPORATION
9646854 Embedded circuit patterning feature selective electroless copper platingMar 28, 14May 09, 17INTEL CORPORATION

Showing 1 to 20 of 82 results