H05K 3/06

Technology



back to "H05K 3/06" profile

More Results

Showing 1 to 20 of 351 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9997324 Apparatus for fabricating flat panel displayOct 07, 08Jun 12, 18LG Display Co., Ltd.
9997448 Wiring substrateNov 07, 17Jun 12, 18Shinko Electric Industries Co. Ltd.
9989720 Opto-electric hybrid boardOct 14, 15Jun 05, 18Nitto Denko Corporation
9992863 Connector inserts and receptacle tongues formed using printed circuit boardsAug 22, 14Jun 05, 18Apple Inc.
9992873 Method of manufacturing a package substrateDec 14, 15Jun 05, 18Qi Ding Technology Qinhuangdao Co., Ltd.; Zhen Ding Technology Co., Ltd.;
9982102 Photocurable composition and method of manufacturing film using the compositionSep 11, 13May 29, 18CANON KABUSHIKI KAISHA
9977522 Touch panel and method of manufacturing the sameMar 25, 15May 22, 18Samsung Display Co., Ltd.
9980388 Biocompatible ribbon cable with narrow folded sectionDec 18, 15May 22, 18California Institute of Technology
9974192 Method of manufacturing an intermediate product for an interposer and intermediate product for an interposerMay 01, 17May 15, 18Ashai Glass Company Limited
9974166 Circuit board and manufacturing method thereofSep 13, 16May 15, 18Unimicron Technology Corp.
9965128 Touch sensing unit, touch substrate and method for producing the same, touch display panel and touch display apparatusApr 30, 15May 08, 18BOE Technology Group Co. Ltd.
9960079 Passive within viaMay 17, 13May 01, 18Intel Corp.
9961765 Security mesh and method of makingSep 21, 16May 01, 18IBM Corporation
9953908 Method for forming solder bumps using sacrificial layerOct 30, 15Apr 24, 18International Business Machine Corporation
9949373 Interposer frame with polymer matrix and methods of fabricationJan 18, 17Apr 17, 18Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
9947749 Thin film compositions and methodsNov 13, 14Apr 17, 18Cornell University
9942990 Insertion loss reduction and increased bonding in a circuit apparatusAug 24, 16Apr 10, 18International Business Machine Corporation
9932684 Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxidesJul 27, 16Apr 03, 18Rohm and Haas Electronic Materials LLC; Dow Global Technologies LLC;
9934419 Package structure, electronic device and method for manufacturing package structureApr 01, 17Apr 03, 18Shenzhen Goodix Technology Co., Ltd.
9927349 Method of producing through wiring substrate and method of producing deviceDec 14, 16Mar 27, 18CANON KABUSHIKI KAISHA

Showing 1 to 20 of 351 results