H05K 3/08

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9380700 Method for forming traces of a printed circuit boardMay 19, 14Jun 28, 16Sierra Circuits, Inc.
9025340 Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabricationSep 30, 13May 05, 15NXP USA, INC.
8316518 Methods for manufacturing ultrasound transducers and other componentsSep 18, 09Nov 27, 12FUJIFILM SONOSITE, INC.
8288681 Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction methodSep 06, 06Oct 16, 12JAPAN DISPLAY INC.
4758927 Method of mounting a substrate structure to a circuit boardJan 21, 87Jul 19, 88TEKTRONIX, INC.
4700214 Electrical circuitryMay 20, 87Oct 13, 87Laserpath Corporation