H05K 3/10

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9999132 Electronic packageMay 24, 16Jun 12, 18Silicon Precision Industries Co. Ltd.
9992863 Connector inserts and receptacle tongues formed using printed circuit boardsAug 22, 14Jun 05, 18Apple Inc.
9989854 Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frameJul 22, 14Jun 05, 18Hitachi Chemical Company, Ltd.
9986631 Electronic power module with enhanced thermal dissipation and manufacturing method thereofMar 25, 16May 29, 18SMI STMicroelectronics S.r.l
9983705 Conductive structure and manufacturing method thereforNov 20, 14May 29, 18LG Chem Ltd.
9982102 Photocurable composition and method of manufacturing film using the compositionSep 11, 13May 29, 18CANON KABUSHIKI KAISHA
9980391 Method of manufacturing an on-board wireless module architectureMar 30, 15May 22, 18Marvell International Ltd.
9980394 Bonding electronic components to patterned nanowire transparent conductorsJul 18, 14May 22, 183M Innovative Properties Company
9980374 Support entering into the fabrication of an electronic device, corresponding memory card connector, memory card read terminal and manufacturing methodOct 24, 14May 22, 18INGENICO GROUP
9976446 Electrical panelAug 19, 15May 22, 18Rolls Royce plc
9980364 Wiring substrate and manufacturing method thereofMar 22, 16May 22, 18Yazaki -Corporation
9980392 Process for producing substrate having wiring, radiation-sensitive composition, electronic circuit and electronic deviceSep 12, 16May 22, 18JSR Corporation
9977522 Touch panel and method of manufacturing the sameMar 25, 15May 22, 18Samsung Display Co., Ltd.
9980393 Pattern-forming method for forming a conductive circuit patternMay 05, 15May 22, 18Electronics and Telecommunications Research Institute
9974192 Method of manufacturing an intermediate product for an interposer and intermediate product for an interposerMay 01, 17May 15, 18Ashai Glass Company Limited
9972413 Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrateOct 10, 13May 15, 18DAI NIPPON PRINTING CO., LTD.
9966164 Insulated coated wire having a wire coating layer of a resin surrounded by a wire adhesive layer of a resinJun 10, 14May 08, 18Hitachi Chemical Company, Ltd.
9965000 Integrated protective meshApr 20, 15May 08, 18Microsoft Technology Licensing, LLC.
9965123 Method of manufacturing touch panelDec 28, 15May 08, 18SAMSUNG DISPLAY CO., LTD.
9967976 Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit boardDec 21, 15May 08, 18SUMITOMO ELECTRIC INDUSTRIES, LTD.; SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.;

Showing 1 to 20 of 963 results