B23H 5/10

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
2025/0018,486 SYSTEM AND METHOD OF THINNING WAFER SUBSTRATENov 15, 22Jan 16, 25Not available
2023/0321,740 Electrochemical Discharge-assisted Micro-grinding Device for Micro-components of Brittle and Hard MaterialsApr 29, 22Oct 12, 23Not available
2010/0043,742 METHOD AND ELECTRODE FOR THE PRODUCTION OF A RADIAL BEARING SURFACE, AND CONNECTING RODOct 17, 07Feb 25, 10DAIMLER AG
2004/0245,096 Dimensionally stable anode for the electrowinning of aluminumJun 10, 04Dec 09, 04NORSK HYDRO ASA
2004/0011,669 Protection of reinforced concreteJun 13, 03Jan 22, 04FOSROC INTERNATIONAL LIMITED
2003/0127,321 Asbestos-free diaphragm, comprising non-fibrous mineral particles, combination comprising same, method for obtaining same and use thereofSep 13, 02Jul 10, 03CHLORALP
2003/0019,760 Copper electrowinningJan 30, 02Jan 30, 03Not available