| 2024/0033,973 | CUTTING TOOL FOR GANG SAW | Dec 16, 21 | Feb 01, 24 | EHWA DIAMOND IND. CO., LTD. |
| 2019/0099,918 | AUTOMATED PLANT FOR CUTTING AND OPERATING FLAT SLABS AND RELATIVE PROCEDURE | Oct 04, 18 | Apr 04, 19 | Not available |
| 2016/0107,334 | STONE CUTTING DEVICE | Jun 10, 14 | Apr 21, 16 | EHWA DIAMOND INDUSTRIAL CO., LTD. |
| 2015/0083,103 | DEVICE FOR CUTTING GRANITE OR OTHER HARD MATERIALS | Sep 23, 14 | Mar 26, 15 | CALAS PRODUCTION |
| 2014/0318,523 | METHOD OF MAKING A GLASS FORMING APPARATUS WITH REDUCED WEIGHT | Apr 29, 13 | Oct 30, 14 | CORNING INCORPORATED |
| 2012/0024,761 | METHODS TO SLICE A SILICON INGOT | Oct 13, 11 | Feb 02, 12 | CORNER STAR LIMITED, MEMC ELECTRONIC MATERIALS, INC., |
| 2011/0253,121 | WORKPIECE FOR FRAME GANG SAW, METHOD FOR CUTTING THE WORKPIECE, AND PRODUCT CUT BY THE METHOD | Dec 23, 09 | Oct 20, 11 | EHWA DIAMOND INDUSTRIAL CO., LTD. |
| 2011/0132,345 | WIRE SAW DEVICE AND METHOD FOR OPERATING SAME | Apr 09, 09 | Jun 09, 11 | APPLIED MATERIALS, INC. |
| 2010/0252,017 | METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW | Nov 17, 08 | Oct 07, 10 | SHIN-ETSU HANDOTAI CO., LTD. |
| 2010/0180,879 | BLOCK-CUTTING GANGSAW FOR CUTTING GRANITE OR OTHER HARD MATERIALS, AND CORRESPONDING CUTTING METHOD | Aug 06, 07 | Jul 22, 10 | Q.R.B.G. S.R.L. |
| 2010/0163,009 | MULTI-WIRE SAW AND METHOD FOR CUTTING INGOT | Jun 27, 07 | Jul 01, 10 | MITSUBISHI ELECTRIC CORPORATION |
| 2010/0163,462 | METHODS TO RECOVER AND PURIFY SILICON PARTICLES FROM SAW KERF | Dec 28, 09 | Jul 01, 10 | CORNER STAR LIMITED |
| 2010/0126,489 | IN-SITU WAFER PROCESSING SYSTEM AND METHOD | Jan 28, 09 | May 27, 10 | Cambridge Energy Resources Inc |
| 2010/0089,377 | SLICING METHOD AND WIRE SAW APPARATUS | Jan 24, 08 | Apr 15, 10 | SHIN-ETSU HANDOTAI CO., LTD. |
| 2010/0078,005 | SYSTEM AND METHOD FOR CUTTING GRANITE OR SIMILAR MATERIALS | Dec 04, 09 | Apr 01, 10 | EHWA DIAMOND INDUSTRIAL CO., LTD. |
| 2010/0037,880 | SLURRY FOR SLICING SILICON INGOT AND METHOD FOR SLICING SILICON INGOT USING THE SAME | Oct 10, 06 | Feb 18, 10 | MITSUBISHI ELECTRIC CORPORATION |
| 2010/0038,456 | METHOD AND SYSTEM FOR SEPARATING A MULTIPLICITY OF CERAMIC COMPONENTS FROM A COMPONENT BLOCK | Apr 02, 08 | Feb 18, 10 | SIEMENS AKTIENGESELLSCHAFT |
| 2010/0006,082 | WIRE SLICING SYSTEM | Jul 09, 09 | Jan 14, 10 | SAINT-GOBAIN ABRASIFS, SAINT-GOBAIN ABRASIVES, INC, |
| 2009/0320,819 | CARBON NANOTUBE FIBER WIRE FOR WAFER SLICING | May 21, 08 | Dec 31, 09 | APPLIED MATERIALS, INC. |
| 2009/0229,592 | CUTTING TIP OF FRAME SAW AND FRAME SAW WITH THE CUTTING TIP | Feb 28, 07 | Sep 17, 09 | EHWA DIAMOND INDUSTRIAL CO., LTD., GENERAL TOOL, INC., |