| 2025/0115,785 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLISHING METHOD USING THE SAME | Jul 12, 24 | Apr 10, 25 | Samsung Electronics Co. Ltd.; SOULBRAIN CO., LTD; |
| 2025/0115,786 | POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHOD OF SUBSTRATE USING THE SAME | Sep 30, 24 | Apr 10, 25 | SK enpulse Co., Ltd. |
| 2025/0115,787 | POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHOD OF SUBSTRATE USING THE SAME | Sep 30, 24 | Apr 10, 25 | SK enpulse Co., Ltd. |
| 2025/0112,050 | POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING METHOD USING THE SAME | Sep 28, 23 | Apr 03, 25 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 2025/0109,317 | POLISHING COMPOSITION | Jul 25, 24 | Apr 03, 25 | Fujimi Incorporated |
| 2025/0109,319 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | Sep 20, 24 | Apr 03, 25 | Fujimi Incorporated |
| 2025/0109,318 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE | Aug 29, 24 | Apr 03, 25 | Fujimi Incorporated |
| 2025/0101,260 | CMP POLISHING SOLUTION, STORAGE SOLUTION, AND POLISHING METHOD | Jan 12, 22 | Mar 27, 25 | Not available |
| 2025/0101,261 | CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND SYSTEMS AND METHODS FOR POLISHING SUBSTRATE USING THE SAME | Aug 12, 22 | Mar 27, 25 | Not available |
| 2025/0101,262 | POLISHING COMPOSITION | Sep 17, 24 | Mar 27, 25 | Fujimi Incorporated |
| 2025/0101,263 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | Sep 19, 24 | Mar 27, 25 | Not available |
| 2025/0092,284 | POLISHING COMPOSITION AND SURFACE TREATMENT METHOD | Aug 19, 24 | Mar 20, 25 | Fujimi Incorporated |
| 2025/0084,280 | MOLYBDENUM CHEMICAL MECHANICAL POLISHING COMPOUNDS AND METHODS OF USE THEREOF | Aug 29, 24 | Mar 13, 25 | Not available |
| 2025/0084,294 | SLURRY AND POLISHING METHOD | Nov 26, 24 | Mar 13, 25 | Not available |
| 2025/0084,281 | POLISHING COMPOSITION AND METHOD FOR POLISHING SUBSTRATE USING THE COMPOSITION | Sep 05, 24 | Mar 13, 25 | Not available |
| 2025/0075,103 | SLURRY SOLUTION, METHOD FOR FABRICATING THE SLURRY SOLUTION, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SLURRY SOLUTION | Apr 19, 24 | Mar 06, 25 | Samsung Electronics Co. Ltd. |
| 2025/0075,104 | TITANIUM OXIDE-BASED CHEMICAL-MECHANICAL POLISHING COMPOSITION FOR HEAVILY-DOPED BORON SILICON FILMS | Aug 30, 24 | Mar 06, 25 | Not available |
| 2025/0075,105 | ANTIFOAMER FOR GRINDING OR POLISHING COMPOSITIONS AND METHODS FOR USING THE SAME | Oct 15, 24 | Mar 06, 25 | LaPel, LLC |
| 2025/0066,641 | POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | Mar 12, 24 | Feb 27, 25 | Samsung Electronics Co., Ltd. |
| 2025/0059,400 | INSULATING FILM POLISHING SOLUTION AND USAGE METHOD THEREOF | Dec 23, 22 | Feb 20, 25 | Not available |