| 2025/0109,501 | ATOMIC LAYER ETCHING OF METALS USING NOVEL CO-REACTANTS AS HALOGENATING AGENTS | Feb 01, 23 | Apr 03, 25 | Not available |
| 2025/0069,898 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS | Nov 14, 24 | Feb 27, 25 | Kokusai Electric Corporation |
| 2025/0062,130 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | Nov 01, 24 | Feb 20, 25 | Not available |
| 2025/0037,970 | ATOMIC LAYER ETCHING PROCESSES | Jul 31, 24 | Jan 30, 25 | Not available |
| 2024/0258,160 | AMORPHOUS LAYERS FOR REDUCING COPPER DIFFUSION AND METHOD FORMING SAME | Mar 19, 24 | Aug 01, 24 | Not available |
| 2024/0191,359 | ETCHING METHOD AND PROCESSING DEVICE | Apr 04, 22 | Jun 13, 24 | Not available |
| 2024/0124,992 | NOVEL NICKEL FOAM HAVING HIERARCHICAL PORE STRUCTURE, METHOD OF PRODUCING THE SAME, AND APPLICATION THEREOF | Oct 17, 23 | Apr 18, 24 | Daegu Gyeongbuk Institute of Science and Technology |
| 2024/0026,548 | THERMAL ATOMIC LAYER ETCHING PROCESSES | Jul 10, 23 | Jan 25, 24 | Not available |
| 2023/0374,670 | ETCH PROCESS FOR OXIDE OF ALKALINE EARTH METAL | May 17, 22 | Nov 23, 23 | Not available |
| 2023/0193,475 | SYSTEMS AND METHODS FOR PROCESSING A SILICON SURFACE USING MULTIPLE RADICAL SPECIES | Dec 19, 22 | Jun 22, 23 | Not available |
| 2023/0151,495 | ATOMIC LAYER ROUGHNESS REDUCING METHODS AND DEVICES | Nov 16, 22 | May 18, 23 | Not available |
| 2023/0005,749 | SEMICONDUCTOR FABRICATING METHOD | Sep 01, 20 | Jan 05, 23 | Not available |
| 2022/0356,585 | VAPOR CLEANING OF SUBSTRATE SURFACES | Jun 23, 20 | Nov 10, 22 | Not available |
| 2022/0325,418 | METAL REMOVAL METHOD, DRY ETCHING METHOD, AND PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENT | Apr 17, 20 | Oct 13, 22 | EC-Showa Denko K.K. |
| 2022/0267,909 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Feb 24, 22 | Aug 25, 22 | Not available |
| 2022/0254,679 | Amorphous Layers for Reducing Copper Diffusion and Method Forming Same | Apr 25, 22 | Aug 11, 22 | Not available |
| 2022/0056,593 | DRY ETCHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ETCHING DEVICE | Feb 19, 20 | Feb 24, 22 | CENTRAL GLASS COMPANY, LIMITED |
| 2021/0079,533 | CLEANING METHOD AND RECORDING MEDIUM FOR RECORDING CLEANING PROGRAM | Sep 10, 20 | Mar 18, 21 | Tokyo Electron Limited |
| 2021/0066,122 | Amorphous Layers for Reducing Copper Diffusion and Method Forming Same | Jun 02, 20 | Mar 04, 21 | Not available |
| 2021/0066,601 | METHOD FOR PRODUCING VAPOR DEPOSITION MASK, AND METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR ELEMENT | Nov 16, 20 | Mar 04, 21 | Dai Nippon Printing Co., Ltd. |